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Patent applications and USPTO patent grants for Chen; Chee Koang.The latest application filed is for "integrated circuit thermal management method and apparatus".
Patent | Date |
---|---|
Thermal management method including a metallic layer directly on an integrated heat spreader and integrated circuit Grant 7,678,616 - Sir , et al. March 16, 2 | 2010-03-16 |
Integrated circuit thermal management method and apparatus Grant 7,439,618 - Sir , et al. October 21, 2 | 2008-10-21 |
Integrated Circuit Thermal Management Method And Apparatus App 20080254573 - Sir; Jiun Hann ;   et al. | 2008-10-16 |
Providing a metal layer in a semiconductor package Grant 7,332,823 - Khaw , et al. February 19, 2 | 2008-02-19 |
Die stack system and method App 20070210428 - Tan; Wooi Aun ;   et al. | 2007-09-13 |
Providing a metal layer in a semiconductor package App 20070138656 - Khaw; Lee Peng ;   et al. | 2007-06-21 |
Electronic assembly that includes pads having a bowl shaped upper section App 20070063302 - Chen; Chee Koang ;   et al. | 2007-03-22 |
Integrated circuit thermal management method and apparatus App 20060214286 - Sir; Jiun Hann ;   et al. | 2006-09-28 |
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