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name:-0.015806913375854
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Chen; Chang-Fu Patent Filings

Chen; Chang-Fu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chen; Chang-Fu.The latest application filed is for "circuit carrier structure and manufacturing method thereof".

Company Profile
5.15.15
  • Chen; Chang-Fu - Taoyuan TW
  • Chen; Chang-Fu - Taoyuan City TW
  • Chen; Chang-Fu - Hsinchu County TW
  • Chen; Chang-Fu - Port Louis MU
  • Chen; Chang Fu - Taichung TW
  • Chen; Chang-Fu - Taipei Hsien TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Circuit carrier structure and manufacturing method thereof
Grant 11,153,963 - Chen , et al. October 19, 2
2021-10-19
Circuit Carrier Structure And Manufacturing Method Thereof
App 20210289614 - Chen; Chang-Fu ;   et al.
2021-09-16
Package Structure
App 20210202394 - LIN; Yi ;   et al.
2021-07-01
Package structure
Grant 10,978,401 - Lin , et al. April 13, 2
2021-04-13
Carrier structure
Grant 10,825,599 - Chen , et al. November 3, 2
2020-11-03
Package Structure
App 20190279936 - LIN; Yi ;   et al.
2019-09-12
Multi-layer circuit structure and manufacturing method thereof
Grant 10,383,226 - Chen , et al. A
2019-08-13
Multi-layer Circuit Structure And Manufacturing Method Thereof
App 20190116667 - Chen; Chang-Fu ;   et al.
2019-04-18
Carrier Structure
App 20190088401 - Chen; Chang-Fu ;   et al.
2019-03-21
Circuit board and manufacturing method thereof
Grant 9,775,246 - Wu , et al. September 26, 2
2017-09-26
Circuit Board And Manufacturing Method Thereof
App 20170042026 - Wu; Kuan-Hsi ;   et al.
2017-02-09
Package structure and method for manufacturing the same
Grant 9,559,045 - Pan , et al. January 31, 2
2017-01-31
Package Structure And Method For Manufacturing The Same
App 20160343645 - Pan; Pi-Te ;   et al.
2016-11-24
Manufacturing method of package structure
Grant 8,893,379 - Sun , et al. November 25, 2
2014-11-25
Manufacturing Method Of Package Structure
App 20130095615 - Sun; Shih-Hao ;   et al.
2013-04-18
Package structure
Grant 8,420,951 - Sun , et al. April 16, 2
2013-04-16
Package Structure And Manufacturing Method Thereof
App 20120279772 - Sun; Shih-Hao ;   et al.
2012-11-08
Method for fabricating a packaging substrate
Grant 7,964,106 - Chen June 21, 2
2011-06-21
Method For Fabricating A Packaging Substrate
App 20090294401 - Chen; Chang-Fu
2009-12-03
Towing Handle Assembly
App 20090064456 - Chen; Chang-Fu
2009-03-12
Suitcase
Grant D577,490 - Chen September 30, 2
2008-09-30
Semiconductor package substrate and semiconductor package having the same
App 20070278659 - Chang; Wen Liang ;   et al.
2007-12-06
Multi-functional scanning camera
App 20070035655 - Chen; Chang-Fu ;   et al.
2007-02-15
Integrated circuit carrier with conductive rings and semiconductor device integrated with the carrier
Grant 7,135,642 - Wang , et al. November 14, 2
2006-11-14
Integrated circuit carrier with conductive rings and semiconductor device integrated with the carrier
App 20050205990 - Wang, C. F. ;   et al.
2005-09-22
Semiconductor package
Grant 6,509,636 - Tsai , et al. January 21, 2
2003-01-21
Dual-sided chip package without a die pad
Grant 6,437,447 - Huang , et al. August 20, 2
2002-08-20

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