loadpatents
Patent applications and USPTO patent grants for Chen; Chang-Fu.The latest application filed is for "circuit carrier structure and manufacturing method thereof".
Patent | Date |
---|---|
Circuit carrier structure and manufacturing method thereof Grant 11,153,963 - Chen , et al. October 19, 2 | 2021-10-19 |
Circuit Carrier Structure And Manufacturing Method Thereof App 20210289614 - Chen; Chang-Fu ;   et al. | 2021-09-16 |
Package Structure App 20210202394 - LIN; Yi ;   et al. | 2021-07-01 |
Package structure Grant 10,978,401 - Lin , et al. April 13, 2 | 2021-04-13 |
Carrier structure Grant 10,825,599 - Chen , et al. November 3, 2 | 2020-11-03 |
Package Structure App 20190279936 - LIN; Yi ;   et al. | 2019-09-12 |
Multi-layer circuit structure and manufacturing method thereof Grant 10,383,226 - Chen , et al. A | 2019-08-13 |
Multi-layer Circuit Structure And Manufacturing Method Thereof App 20190116667 - Chen; Chang-Fu ;   et al. | 2019-04-18 |
Carrier Structure App 20190088401 - Chen; Chang-Fu ;   et al. | 2019-03-21 |
Circuit board and manufacturing method thereof Grant 9,775,246 - Wu , et al. September 26, 2 | 2017-09-26 |
Circuit Board And Manufacturing Method Thereof App 20170042026 - Wu; Kuan-Hsi ;   et al. | 2017-02-09 |
Package structure and method for manufacturing the same Grant 9,559,045 - Pan , et al. January 31, 2 | 2017-01-31 |
Package Structure And Method For Manufacturing The Same App 20160343645 - Pan; Pi-Te ;   et al. | 2016-11-24 |
Manufacturing method of package structure Grant 8,893,379 - Sun , et al. November 25, 2 | 2014-11-25 |
Manufacturing Method Of Package Structure App 20130095615 - Sun; Shih-Hao ;   et al. | 2013-04-18 |
Package structure Grant 8,420,951 - Sun , et al. April 16, 2 | 2013-04-16 |
Package Structure And Manufacturing Method Thereof App 20120279772 - Sun; Shih-Hao ;   et al. | 2012-11-08 |
Method for fabricating a packaging substrate Grant 7,964,106 - Chen June 21, 2 | 2011-06-21 |
Method For Fabricating A Packaging Substrate App 20090294401 - Chen; Chang-Fu | 2009-12-03 |
Towing Handle Assembly App 20090064456 - Chen; Chang-Fu | 2009-03-12 |
Suitcase Grant D577,490 - Chen September 30, 2 | 2008-09-30 |
Semiconductor package substrate and semiconductor package having the same App 20070278659 - Chang; Wen Liang ;   et al. | 2007-12-06 |
Multi-functional scanning camera App 20070035655 - Chen; Chang-Fu ;   et al. | 2007-02-15 |
Integrated circuit carrier with conductive rings and semiconductor device integrated with the carrier Grant 7,135,642 - Wang , et al. November 14, 2 | 2006-11-14 |
Integrated circuit carrier with conductive rings and semiconductor device integrated with the carrier App 20050205990 - Wang, C. F. ;   et al. | 2005-09-22 |
Semiconductor package Grant 6,509,636 - Tsai , et al. January 21, 2 | 2003-01-21 |
Dual-sided chip package without a die pad Grant 6,437,447 - Huang , et al. August 20, 2 | 2002-08-20 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.