Chen; Bi-Trong
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chen; Bi-Trong.The latest application filed is for "integration film scheme for copper / low-k interconnect".
- Chen; Bi-Trong - Hsin-Chu TW
- Chen; Bi-Trong - Tainan TW
- Chen; Bi-Trong - Kuenming Village TW
- Chen; Bi-Trong - Taiwan TW
| Patent | Date |
|---|---|
| Integration film scheme for copper / low-k interconnect Grant 7,244,673 - Huang , et al. July 17, 2 | 2007-07-17 |
| Integration film scheme for copper / low-k interconnect App 20050098896 - Huang, Tai-Chun ; et al. | 2005-05-12 |
| Method of forming dummy copper plug to improve low k structure mechanical strength and plug fill uniformity Grant 6,887,790 - Bao , et al. May 3, 2 | 2005-05-03 |
| Thin interface layer to improve copper etch stop Grant 6,884,659 - Chen , et al. April 26, 2 | 2005-04-26 |
| Thin interface layer to improve copper etch stop App 20040038550 - Chen, Bi-Trong ; et al. | 2004-02-26 |
| Thin interface layer to improve copper etch stop Grant 6,623,654 - Chen , et al. September 23, 2 | 2003-09-23 |
| Thin interface layer to improve copper etch stop App 20030089678 - Chen, Bi-Trong ; et al. | 2003-05-15 |
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