loadpatents
Patent applications and USPTO patent grants for Chen; Bao-Chun.The latest application filed is for "heat dissipation device with heat pipes".
Patent | Date |
---|---|
Heat dissipation device with heat pipes Grant 7,866,375 - Zhou , et al. January 11, 2 | 2011-01-11 |
Heat Dissipation Device With Heat Pipes App 20080128111 - Zhou; Shi-Wen ;   et al. | 2008-06-05 |
Heat Dissipation Device App 20080121372 - ZHOU; SHI-WEN ;   et al. | 2008-05-29 |
Heat dissipating device Grant 7,310,229 - Lee , et al. December 18, 2 | 2007-12-18 |
Computer system with cooling device for CPU Grant 7,286,357 - Wung , et al. October 23, 2 | 2007-10-23 |
Heat dissipation device Grant 7,286,363 - Lee , et al. October 23, 2 | 2007-10-23 |
Heat dissipation device Grant 7,283,361 - Lee , et al. October 16, 2 | 2007-10-16 |
Computer Chassis App 20070183124 - Wung; Shih-Hsun ;   et al. | 2007-08-09 |
Computer System With Cooling Device For Cpu App 20070121296 - Wung; Shih-Hsun ;   et al. | 2007-05-31 |
Heat-dissipating fin assembly for heat sink Grant 7,190,588 - Lee , et al. March 13, 2 | 2007-03-13 |
Heat dissipation device App 20060291169 - Lee; Hsieh-Kun ;   et al. | 2006-12-28 |
Heat dissipating device assembly Grant 7,142,430 - Lee , et al. November 28, 2 | 2006-11-28 |
Heat dissipating device App 20060098408 - Lee; Hsieh-Kun ;   et al. | 2006-05-11 |
Heat dissipation device App 20060018097 - Lee; Hsieh-Kun ;   et al. | 2006-01-26 |
Heat-dissipating fin assembly for heat sink App 20060012961 - Lee; Hsieh-Kun ;   et al. | 2006-01-19 |
Heat dissipating device assembly App 20050117306 - Lee, Hsieh-Kun ;   et al. | 2005-06-02 |
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