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name:-0.001431941986084
name:-0.00088906288146973
Chen; Allis Patent Filings

Chen; Allis

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chen; Allis.The latest application filed is for "jig structure for an integrated circuit package".

Company Profile
0.1.9
  • Chen; Allis - Hsinchu Hsien TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Package structure for a photosensitive chip
Grant 6,590,269 - Chuang , et al. July 8, 2
2003-07-08
Image sensor structure
App 20030116817 - Yeh, Nai Hua ;   et al.
2003-06-26
Jig structure for an integrated circuit package
App 20030118680 - Lin, Chief ;   et al.
2003-06-26
Module Card And A Method For Manufacturing The Same
App 20030071129 - Ho, Mon Nan ;   et al.
2003-04-17
Package structure of integrated circuits and method for packaging the same
App 20020096766 - Chen, Wen Chuan ;   et al.
2002-07-25
Substrate Structure For An Integrated Circuit Package And Method For Manufacturing The Same
App 20020096360 - Ho, Mon Nan ;   et al.
2002-07-25
Structure Of Stacked Integrated Circuits And Method For Manufacturing The Same
App 20020096761 - Chen, Wen Chuan ;   et al.
2002-07-25
Stacked structure of integrated circuits
App 20020096754 - Chen, Wen Chuan ;   et al.
2002-07-25
Structure of stacked integrated circuits and method for manufacturing the same
App 20020096762 - Chen, Wen Chuan ;   et al.
2002-07-25
Integrated circuit structure having an adhesive agent and method for manufacturing the same
App 20020096751 - Chen, Wen Chuan ;   et al.
2002-07-25

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