Chelini; Remy J.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chelini; Remy J..The latest application filed is for "channel method for forming a capacitor".
- Chelini; Remy J. - Crystal Lake IL
| Patent | Date |
|---|---|
| Channel method for forming a capacitor Grant 7,833,292 - Brenneman , et al. November 16, 2 | 2010-11-16 |
| Channel Method For Forming A Capacitor App 20100177460 - Brenneman; Keith R. ; et al. | 2010-07-15 |
| Thin solid electrolytic capacitor embeddable in a substrate Grant 7,745,281 - Prymak , et al. June 29, 2 | 2010-06-29 |
| Method for forming multi-layer embedded capacitors on a printed circuit board Grant 7,444,727 - Savic , et al. November 4, 2 | 2008-11-04 |
| Thin Solid Electrolytic Capacitor Embeddable In A Substrate App 20080216296 - Prymak; John D. ; et al. | 2008-09-11 |
| Textiles Having a High Impedance Surface App 20080160851 - Dunn; Gregory J. ; et al. | 2008-07-03 |
| Embedded capacitors and methods for their fabrication and connection Grant 7,361,568 - Dunn , et al. April 22, 2 | 2008-04-22 |
| Method For Forming Embedded Capacitors On A Printed Curcuit Board And Resultant Printed Circuit Board App 20070209178 - Savic; Jovica ; et al. | 2007-09-13 |
| Peelable circuit board foil Grant 7,241,510 - Dunn , et al. July 10, 2 | 2007-07-10 |
| Embedded capacitors and methods for their fabrication and connection App 20070139864 - Dunn; Gregory J. ; et al. | 2007-06-21 |
| Peelable circuit board foil App 20060269728 - Dunn; Gregory J. ; et al. | 2006-11-30 |
| Corrosion-resistant copper bond pad and integrated device Grant 7,078,796 - Dunn , et al. July 18, 2 | 2006-07-18 |
| Polymer thick film resistor, layout cell, and method Grant 7,038,571 - Dunn , et al. May 2, 2 | 2006-05-02 |
| Printed circuit dielectric foil and embedded capacitors App 20050135074 - Dunn, Gregory J. ; et al. | 2005-06-23 |
| Corrosion-resistant bond pad and integrated device App 20050104207 - Dean, Timothy B. ; et al. | 2005-05-19 |
| Peelable Circuit Board Foil App 20050079375 - Dean, Timothy B. ; et al. | 2005-04-14 |
| Peelable circuit board foil Grant 6,872,468 - Dean , et al. March 29, 2 | 2005-03-29 |
| Corrosion-resistant copper bond pad and integrated device App 20050001324 - Dunn, Gregory J. ; et al. | 2005-01-06 |
| Corrosion-resistant bond pad and integrated device App 20050001316 - Dean, Timothy B. ; et al. | 2005-01-06 |
| Polymer thick film resistor, layout cell, and method App 20040239474 - Dunn, Gregory J. ; et al. | 2004-12-02 |
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