Chee; Wai Onn
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chee; Wai Onn.The latest application filed is for "printed circuit cable assembly for top down installation".
- Chee; Wai Onn - Singapore SG
| Patent | Date |
|---|---|
| Printed circuit cable assembly for top down installation Grant 7,871,289 - Chin , et al. January 18, 2 | 2011-01-18 |
| Printed Circuit Cable Assembly For Top Down Installation App 20090009912 - Chin; Cheng Siong ; et al. | 2009-01-08 |
| Disc drive housing with air guide Grant 6,894,867 - Hong , et al. May 17, 2 | 2005-05-17 |
| Low cost overmolded magnet and pole assembly Grant 6,735,054 - Ooi , et al. May 11, 2 | 2004-05-11 |
| Disc drive housing with air guide App 20030156350 - Hong, Yiren ; et al. | 2003-08-21 |
| Low cost overmolded magnet and pole assembly App 20020015263 - Ooi, Tak Koon ; et al. | 2002-02-07 |
| Wrap around shock absorber for disc drives Grant 6,324,054 - Chee , et al. November 27, 2 | 2001-11-27 |
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