Cheah; Bok Eng Kong; Jackson Chung Peng Kuan; Chin Lee
Patent Applications and Registrations
Patent applications and USPTO patent grants for Cheah; Bok Eng Kong; Jackson Chung Peng Kuan; Chin Lee.The latest application filed is for "stacked-component placement in multiple-damascene printed wiring boards for semiconductor package substrates".
- Cheah; Bok Eng Kong; Jackson Chung Peng Kuan; Chin Lee - BUKIT GAMBIR, PENANG Tanjung Tokong, 07 Bayan Le MY MY MY
| Patent | Date |
|---|---|
| Stacked-component Placement In Multiple-damascene Printed Wiring Boards For Semiconductor Package Substrates App 20200128673 - Cheah; Bok Eng ; et al. | 2020-04-23 |
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