| Patent | Date |
|---|
Low loss high-speed interconnects
Grant 11,456,516 - Ong , et al. September 27, 2 | 2022-09-27 |
Molded Silicon Interconnects In Bridges For Integrated-circuit Packages
App 20220302033 - Cheah; Bok Eng ; et al. | 2022-09-22 |
Molded Interconnects In Bridges For Integrated-circuit Packages
App 20220278084 - Ong; Jenny Shio Yin ; et al. | 2022-09-01 |
Overhang bridge interconnect
Grant 11,430,764 - Cheah , et al. August 30, 2 | 2022-08-30 |
Hybrid transmission line
Grant 11,411,290 - Lo , et al. August 9, 2 | 2022-08-09 |
Stacked through-silicon vias for multi-device packages
Grant 11,398,415 - Cheah , et al. July 26, 2 | 2022-07-26 |
Micro through-silicon via for transistor density scaling
Grant 11,393,741 - Cheah , et al. July 19, 2 | 2022-07-19 |
Power delivery for embedded interconnect bridge devices and methods
Grant 11,393,758 - Cheah , et al. July 19, 2 | 2022-07-19 |
Three dimensional foldable substrate with vertical side interface
Grant 11,375,617 - Chuah , et al. June 28, 2 | 2022-06-28 |
Semiconductor package with hybrid through-silicon-vias
Grant 11,367,673 - Lim , et al. June 21, 2 | 2022-06-21 |
Inductor array and support
Grant 11,363,717 - Kong , et al. June 14, 2 | 2022-06-14 |
Interconnect core
Grant 11,355,458 - Kong , et al. June 7, 2 | 2022-06-07 |
Vertical power plane module for semiconductor packages
Grant 11,342,289 - Ong , et al. May 24, 2 | 2022-05-24 |
Micro Through-silicon Via For Transistor Density Scaling
App 20220157694 - CHEAH; Bok Eng ; et al. | 2022-05-19 |
Substrate With Gradiated Dielectric For Reducing Impedance Mismatch
App 20220102295 - Kong; Jackson Chung Peng ; et al. | 2022-03-31 |
Multi-faceted integrated-circuit dice and packages
Grant 11,289,427 - Cheah , et al. March 29, 2 | 2022-03-29 |
Integrated bridge for die-to-die interconnects
Grant 11,282,780 - Cheah , et al. March 22, 2 | 2022-03-22 |
Semiconductor package with co-axial ball-grid-array
Grant 11,284,518 - Kong , et al. March 22, 2 | 2022-03-22 |
Molded Power Delivery Interconnect Module For Improved Imax And Power Integrity
App 20220077060 - LIM; Seok Ling ; et al. | 2022-03-10 |
Stacked Semiconductor Package With Flyover Bridge
App 20220077070 - CHEE; Choong Kooi ; et al. | 2022-03-10 |
Inductor Array And Support
App 20220078913 - KONG; Jackson Chung Peng ; et al. | 2022-03-10 |
Interposer For 2.5d Packaging Architecture
App 20220077065 - KUAN; Chin Lee ; et al. | 2022-03-10 |
3d Stacked Die Package With Molded Integrated Heat Spreader
App 20220077113 - ONG; Jenny Shio Yin ; et al. | 2022-03-10 |
Semiconductor Device And Method Of Forming The Same
App 20220068821 - CHEAH; Bok Eng ; et al. | 2022-03-03 |
Vertical Power Plane Module For Semiconductor Packages
App 20220068846 - ONG; Jenny Shio Yin ; et al. | 2022-03-03 |
Substrate Cores For Warpage Control
App 20220068843 - LIM; Seok Ling ; et al. | 2022-03-03 |
Embedded Reference Layers For Semiconductor Package Substrates
App 20220068836 - Cheah; Bok Eng ; et al. | 2022-03-03 |
Semiconductor Package With Hybrid Through-silicon-vias
App 20220068764 - LIM; Seok Ling ; et al. | 2022-03-03 |
Stacked Semiconductor Package With Stepped Stiffener
App 20220068841 - ONG; Jenny Shio Yin ; et al. | 2022-03-03 |
Multi-chip Package With Extended Frame
App 20220068782 - CHEAH; Bok Eng ; et al. | 2022-03-03 |
Electrical Shield For Stacked Heterogeneous Device Integration
App 20220068833 - LIM; Seok Ling ; et al. | 2022-03-03 |
Semiconductor System And Method Of Forming Semiconductor System
App 20220068740 - KONG; Jackson Chung Peng ; et al. | 2022-03-03 |
Semiconductor Package With Co-axial Ball-grid-array
App 20220071022 - KONG; Jackson Chung Peng ; et al. | 2022-03-03 |
Semiconductor Device And Method Of Forming The Same
App 20220068750 - ONG; Jenny Shio Yin ; et al. | 2022-03-03 |
Stiffener build-up layer package
Grant 11,227,841 - Cheah , et al. January 18, 2 | 2022-01-18 |
Hybrid Boards with Embedded Planes
App 20210410273 - KONG; Jackson Chung Peng ; et al. | 2021-12-30 |
Stiffener shield for device integration
Grant 11,205,622 - Ong , et al. December 21, 2 | 2021-12-21 |
Vertical Die-to-die Interconnects Bridge
App 20210384130 - CHEAH; Bok Eng ; et al. | 2021-12-09 |
Asymmetrical Laminated Circuit Boards For Improved Electrical Performance
App 20210385948 - KONG; Jackson Chung Peng ; et al. | 2021-12-09 |
Stacked Semiconductor Package And Method Of Forming The Same
App 20210384135 - KUAN; Chin Lee ; et al. | 2021-12-09 |
Interposer Structures And Methods For 2.5d And 3d Packaging
App 20210384133 - Ong; Jenny Shio Yin ; et al. | 2021-12-09 |
Semiconductor Package, Semiconductor System, And Method Of Forming Semiconductor Package
App 20210384116 - CHEAH; Bok Eng ; et al. | 2021-12-09 |
Embedded reference layers for semiconductor package substrates
Grant 11,195,801 - Cheah , et al. December 7, 2 | 2021-12-07 |
Hybrid Ball Grid Array Package For High Speed Interconnects
App 20210375735 - Cheah; Bok Eng ; et al. | 2021-12-02 |
Flexible shield for semiconductor devices
Grant 11,177,226 - Cheah , et al. November 16, 2 | 2021-11-16 |
Substrate with gradiated dielectric for reducing impedance mismatch
Grant 11,164,827 - Kong , et al. November 2, 2 | 2021-11-02 |
Opossum Redistribution Frame For Configurable Memory Devices
App 20210335718 - CHEAH; Bok Eng ; et al. | 2021-10-28 |
Semiconductor Package With Hybrid Mold Layers
App 20210335698 - CHEAH; Bok Eng ; et al. | 2021-10-28 |
Device, system and method to promote the integrity of signal communications
Grant 11,153,968 - Kong , et al. October 19, 2 | 2021-10-19 |
Micro Through-silicon Via For Transistor Density Scaling
App 20210320051 - Cheah; Bok Eng ; et al. | 2021-10-14 |
Packaged die stacks with stacked capacitors and methods of assembling same
Grant 11,121,074 - Cheah , et al. September 14, 2 | 2021-09-14 |
Encapsulated Vertical Interconnects For High-speed Applications And Methods Of Assembling Same
App 20210217689 - Cheah; Bok Eng ; et al. | 2021-07-15 |
Encapsulated vertical interconnects for high-speed applications and methods of assembling same
Grant 11,049,801 - Cheah , et al. June 29, 2 | 2021-06-29 |
Overhang Bridge Interconnect
App 20210193616 - Cheah; Bok Eng ; et al. | 2021-06-24 |
Integrated Bridge For Die-to-die Interconnects
App 20210193567 - Cheah; Bok Eng ; et al. | 2021-06-24 |
Multi-level Fan-out Interconnects For Integrated-circuit Packages
App 20210183779 - Cheah; Bok Eng ; et al. | 2021-06-17 |
Interposer For Hybrid Interconnect Geometry
App 20210183755 - Ong; Jenny Shio Yin ; et al. | 2021-06-17 |
Low Loss High-speed Interconnects
App 20210184326 - Ong; Ling Li ; et al. | 2021-06-17 |
Composite Bridge Die-to-die Interconnects For Integrated-circuit Packages
App 20210183776 - Cheah; Bok Eng ; et al. | 2021-06-17 |
Plane-less voltage reference interconnects
Grant 11,037,874 - Cheah , et al. June 15, 2 | 2021-06-15 |
Integrated Circuit Packages With Conductive Element Having Cavities Housing Electrically Connected Embedded Components
App 20210167023 - Lim; Seok Ling ; et al. | 2021-06-03 |
Over-molded IC package with in-mold capacitor
Grant 10,998,261 - Kong , et al. May 4, 2 | 2021-05-04 |
Capacitors embedded in stiffeners for small form-factor and methods of assembling same
Grant 10,985,147 - Ong , et al. April 20, 2 | 2021-04-20 |
Stiffener-integrated interconnect bypasses for chip-package apparatus and methods of assembling same
Grant 10,978,407 - Kong , et al. April 13, 2 | 2021-04-13 |
Systems in packages including wide-band phased-array antennas and methods of assembling same
Grant 10,978,434 - Cheah , et al. April 13, 2 | 2021-04-13 |
Multi-conductor interconnect structure for a microelectronic device
Grant 10,980,108 - Ooi , et al. April 13, 2 | 2021-04-13 |
Semiconductor package having an impedance-boosting channel
Grant 10,971,440 - Cheah , et al. April 6, 2 | 2021-04-06 |
3D high-inductive ground plane for crosstalk reduction
Grant 10,973,116 - Kong , et al. April 6, 2 | 2021-04-06 |
Recess By-pass Interconnects
App 20210098350 - Cheah; Bok Eng ; et al. | 2021-04-01 |
Electronic packages with stacked sitffeners and methods of assembling same
Grant 10,964,677 - Ong , et al. March 30, 2 | 2021-03-30 |
Overpass dice stacks and methods of using same
Grant 10,957,649 - Cheah , et al. March 23, 2 | 2021-03-23 |
Ring-in-ring configurable-capacitance stiffeners and methods of assembling same
Grant 10,950,552 - Kong , et al. March 16, 2 | 2021-03-16 |
Programmable redistribution die
Grant 10,943,864 - Goh , et al. March 9, 2 | 2021-03-09 |
3D stacked-in-recess system in package
Grant 10,943,792 - Cheah , et al. March 9, 2 | 2021-03-09 |
Frame-array Interconnects For Integrated-circuit Packages
App 20210066185 - Lim; Seok Ling ; et al. | 2021-03-04 |
Three Dimensional Foldable Substrate With Vertical Side Interface
App 20210051801 - Chuah; Tin Poay ; et al. | 2021-02-18 |
Stacked dice systems
Grant 10,916,524 - Cheah , et al. February 9, 2 | 2021-02-09 |
Integrated circuit packages with conductive element having cavities housing electrically connected embedded components
Grant 10,910,325 - Lim , et al. February 2, 2 | 2021-02-02 |
Interposer With Flexible Portion
App 20210028094 - Cheah; Bok Eng ; et al. | 2021-01-28 |
Micro through-silicon via for transistor density scaling
Grant 10,903,142 - Cheah , et al. January 26, 2 | 2021-01-26 |
Vertical modular stiffeners for stacked multi-device packages
Grant 10,903,155 - Cheah , et al. January 26, 2 | 2021-01-26 |
Packaged Die Stacks With Stacked Capacitors And Methods Of Assembling Same
App 20210005547 - Cheah; Bok Eng ; et al. | 2021-01-07 |
Multiple-layer, self-equalizing interconnects in package substrates
Grant 10,886,209 - Hall , et al. January 5, 2 | 2021-01-05 |
Multi-faceted Integrated-circuit Dice And Packages
App 20200395309 - Cheah; Bok Eng ; et al. | 2020-12-17 |
3d Trench Reference Planes For Integrated-circuit Die Packages
App 20200395318 - Kuan; Chin Lee ; et al. | 2020-12-17 |
Electronic Device And Crosstalk Mitigating Substrate
App 20200388578 - Lim; Min Suet ; et al. | 2020-12-10 |
Transmission line design with routing-over-void compensation
Grant 10,856,407 - Yong , et al. December 1, 2 | 2020-12-01 |
Interposer with flexible portion
Grant 10,840,177 - Cheah , et al. November 17, 2 | 2020-11-17 |
Micro-hinge For An Electronic Device
App 20200325711 - Cheah; Bok Eng ; et al. | 2020-10-15 |
Hybrid Transmission Line
App 20200321674 - Lo; Hungying ; et al. | 2020-10-08 |
Stairstep interposers with integrated shielding for electronics packages
Grant 10,748,854 - Cheah , et al. A | 2020-08-18 |
Semiconductor package having inductive lateral interconnects
Grant 10,734,333 - Kong , et al. | 2020-08-04 |
Folded semiconductor package architectures and methods of assembling same
Grant 10,734,318 - Cheah , et al. | 2020-08-04 |
Fiber weave-sandwiched differential pair routing technique
Grant 10,716,209 - Cheah , et al. | 2020-07-14 |
Multi-orientation Display Device
App 20200192432 - Yee; Chee Chun ; et al. | 2020-06-18 |
Multiple-surface Connected Embedded Interconnect Bridge For Semiconductor Package Substrates
App 20200168538 - Ong; Jenny Shio Yin ; et al. | 2020-05-28 |
Stacked-device Through-silicon Vias For Semiconductor Packages
App 20200168528 - Cheah; Bok Eng ; et al. | 2020-05-28 |
Systems In Packages Including Wide-band Phased-array Antennas And Methods Of Assembling Same
App 20200168592 - Cheah; Bok Eng ; et al. | 2020-05-28 |
Embedded Reference Layers For Semiconductor Package Substrates
App 20200168559 - Cheah; Bok Eng ; et al. | 2020-05-28 |
High Density Flexible Interconnect Design For Multi-mode Signaling
App 20200170113 - Sreerama; Chaitanya ; et al. | 2020-05-28 |
Mutual inductance suppressor for crosstalk immunity enhancement
Grant 10,652,999 - Yong , et al. | 2020-05-12 |
Ring-in-ring configurable-capacitance stiffeners and methods of assembling same
Grant 10,651,127 - Kong , et al. | 2020-05-12 |
Extended stiffener for platform miniaturization
Grant 10,643,983 - Goh , et al. | 2020-05-05 |
Fiber Weave-sandwiched Differential Pair Routing Technique
App 20200137886 - Cheah; Bok Eng ; et al. | 2020-04-30 |
Plane-less Voltage Reference Interconnects
App 20200135639 - Cheah; Bok Eng ; et al. | 2020-04-30 |
Micro-hinge for an electronic device
Grant 10,633,898 - Cheah , et al. | 2020-04-28 |
Devices And Methods For Signal Integrity Protection Technique
App 20200126928 - Cheah; Bok Eng ; et al. | 2020-04-23 |
Stacked-component Placement In Multiple-damascene Printed Wiring Boards For Semiconductor Package Substrates
App 20200128673 - Cheah; Bok Eng ; et al. | 2020-04-23 |
Flexible computing device that includes a plurality of displays
Grant 10,606,316 - Kong , et al. | 2020-03-31 |
Stacked Through-silicon Vias For Multi-device Packages
App 20200091040 - Cheah; Bok Eng ; et al. | 2020-03-19 |
Flexible Shield For Semiconductor Devices And Methods
App 20200091093 - Cheah; Bok Eng ; et al. | 2020-03-19 |
Packaged die stacks with stacked capacitors and methods of assembling same
Grant 10,593,618 - Cheah , et al. | 2020-03-17 |
Multi-conductor Interconnect Structure For A Microelectronic Device
App 20200084880 - Ooi; Ping Ping ; et al. | 2020-03-12 |
Stacked Dice Systems
App 20200083194 - Cheah; Bok Eng ; et al. | 2020-03-12 |
Power Delivery For Embedded Interconnect Bridge Devices And Methods
App 20200083170 - Cheah; Bok Eng ; et al. | 2020-03-12 |
Programmable Redistribution Die
App 20200083157 - Goh; Eng Huat ; et al. | 2020-03-12 |
Systems in packages including wide-band phased-array antennas and methods of assembling same
Grant 10,580,761 - Cheah , et al. | 2020-03-03 |
Micro Through-silicon Via For Transistor Density Scaling
App 20200043831 - Cheah; Bok Eng ; et al. | 2020-02-06 |
Microelectronics Package With A Combination Heat Spreader/radio Frequency Shield
App 20200027813 - Cheah; Bok Eng ; et al. | 2020-01-23 |
Over-molded IC packages with embedded voltage reference plane and heater spreader
Grant 10,541,200 - Ooi , et al. Ja | 2020-01-21 |
Interposer With Flexible Portion
App 20200006204 - Cheah; Bok Eng ; et al. | 2020-01-02 |
Stiffener Build-up Layer Package
App 20200006253 - Cheah; Bok Eng ; et al. | 2020-01-02 |
Stiffener Shield For Device Integration
App 20200006247 - Ong; Jenny Shio Yin ; et al. | 2020-01-02 |
Stiffener-integrated Interconnect Bypasses For Chip-package Apparatus And Methods Of Assembling Same
App 20200006246 - Kong; Jackson Chung Peng ; et al. | 2020-01-02 |
Vertical Modular Stiffeners For Stacked Multi-device Packages
App 20190393141 - Cheah; Bok Eng ; et al. | 2019-12-26 |
Through-stiffener inerconnects for package-on-package apparatus and methods of assembling same
Grant 10,504,854 - Cheah , et al. Dec | 2019-12-10 |
Multi-orientation display device
Grant 10,503,211 - Yee , et al. Dec | 2019-12-10 |
Substrate With Gradiated Dielectric For Reducing Impedance Mismatch
App 20190355681 - Kong; Jackson Chung Peng ; et al. | 2019-11-21 |
Routing-over-void-T-line-compensation
Grant 10,484,231 - Yong , et al. Nov | 2019-11-19 |
Composite Stacked Interconnects For High-speed Applications And Methods Of Assembling Same
App 20190311978 - Cheah; Bok Eng ; et al. | 2019-10-10 |
Encapsulated Vertical Interconnects For High-speed Applications And Methods Of Assembling Same
App 20190304885 - Cheah; Bok Eng ; et al. | 2019-10-03 |
Stacked package assembly with voltage reference plane
Grant 10,403,604 - Cheah , et al. Sep | 2019-09-03 |
Semiconductor package with package components disposed on a package substrate within a footprint of a die
Grant 10,396,047 - Ong , et al. A | 2019-08-27 |
Flexible packaging architecture
Grant 10,396,038 - Cheah , et al. A | 2019-08-27 |
Ring-in-ring Configurable-capacitance Stiffeners And Methods Of Assembling Same
App 20190259704 - Kong; Jackson Chung Peng ; et al. | 2019-08-22 |
Overpass Dice Stacks And Methods Of Using Same
App 20190229057 - Cheah; Bok Eng ; et al. | 2019-07-25 |
Electrical interconnect for a flexible electronic package
Grant 10,354,957 - Cheah , et al. July 16, 2 | 2019-07-16 |
Mutual Inductance Suppressor For Crosstalk Immunity Enhancement
App 20190215953 - YONG; Khang Choong ; et al. | 2019-07-11 |
Multiple-layer, Self-equalizing Interconnects In Package Substrates
App 20190214336 - Hall; Stephen Harvey ; et al. | 2019-07-11 |
3d Stacked-in-recess System In Package
App 20190206698 - Cheah; Bok Eng ; et al. | 2019-07-04 |
3d High-inductive Ground Plane For Crosstalk Reduction
App 20190208620 - KONG; Jackson Chung Peng ; et al. | 2019-07-04 |
Flexible integrated circuit that includes an antenna
Grant 10,334,736 - Koh , et al. | 2019-06-25 |
Through-stiffener Inerconnects For Package-on-package Apparatus And Methods Of Assembling Same
App 20190181097 - Cheah; Bok Eng ; et al. | 2019-06-13 |
Semiconductor Package Having An Impedance-boosting Channel
App 20190181080 - CHEAH; Bok Eng ; et al. | 2019-06-13 |
Systems In Packages Including Wide-band Phased-array Antennas And Methods Of Assembling Same
App 20190181126 - Cheah; Bok Eng ; et al. | 2019-06-13 |
Microelectronic device package having alternately stacked die
Grant 10,319,698 - Cheah , et al. | 2019-06-11 |
Folded Semiconductor Package Architectures And Methods Of Assembling Same
App 20190148269 - Cheah; Bok Eng ; et al. | 2019-05-16 |
Semiconductor Package Having Inductive Lateral Interconnects
App 20190131257 - KONG; Jackson Chung Peng ; et al. | 2019-05-02 |
Electronic Packages With Stacked Sitffeners And Methods Of Assembling Same
App 20190109122 - Ong; Jenny Shio Yin ; et al. | 2019-04-11 |
Ring-in-ring Configurable-capacitance Stiffeners And Methods Of Assembling Same
App 20190103359 - Kong; Jackson Chung Peng ; et al. | 2019-04-04 |
Micro-hinge For An Electronic Device
App 20190093402 - Cheah; Bok Eng ; et al. | 2019-03-28 |
Stairstep Interposers With Integrated Shielding For Electronics Packages
App 20190057940 - Cheah; Bok Eng ; et al. | 2019-02-21 |
Device, System And Method To Promote The Integrity Of Signal Communications
App 20190045625 - Kong; Jackson Chung Peng ; et al. | 2019-02-07 |
Stacked Dies With Passive Components Within Facing Recesses
App 20190013301 - CHEAH; Bok Eng ; et al. | 2019-01-10 |
Extended Stiffener For Platform Miniaturization
App 20190013303 - GOH; Eng Huat ; et al. | 2019-01-10 |
Packaged Die Stacks With Stacked Capacitors And Methods Of Assembling Same
App 20190006277 - Cheah; Bok Eng ; et al. | 2019-01-03 |
Capacitors Embedded In Stiffeners For Small Form-factor And Methods Of Assembling Same
App 20190006333 - Ong; Jenny Shio Yin ; et al. | 2019-01-03 |
Transmission Line Design With Routing-over-void Compensation
App 20190008029 - Yong; Khang Choong ; et al. | 2019-01-03 |
Routing-over-void T-line Compensation
App 20190007259 - Yong; Khang Choong ; et al. | 2019-01-03 |
Over-molded Ic Packages With Embedded Voltage Reference Plane & Heater Spreader
App 20180366407 - OOI; Ping Ping ; et al. | 2018-12-20 |
Semiconductor Package With Package Components Disposed On A Package Substrate Within A Footprint Of A Die
App 20180366423 - ONG; Jenny Shio Yin ; et al. | 2018-12-20 |
Capacitive compensation structures using partially meshed ground planes
Grant 10,158,339 - Kong , et al. Dec | 2018-12-18 |
Over-molded Ic Package With In-mold Capacitor
App 20180358292 - KONG; Jackson Chung Peng ; et al. | 2018-12-13 |
Package-bottom through-mold via interposers for land-side configured devices for system-in-package apparatus
Grant 10,153,253 - Loo , et al. Dec | 2018-12-11 |
Electrical Interconnect For A Flexible Electronic Package
App 20180350748 - Cheah; Bok Eng ; et al. | 2018-12-06 |
Flexible Computing Device That Includes A Plurality Of Displays
App 20180348823 - KONG; Jackson Chung Peng ; et al. | 2018-12-06 |
Integrated Circuit Packages With Conductive Element Having Cavities Housing Electrically Connected Embedded Components
App 20180342467 - Lim; Seok Ling ; et al. | 2018-11-29 |
Stacked Package Assembly With Voltage Reference Plane
App 20180294252 - CHEAH; Bok Eng ; et al. | 2018-10-11 |
Microelectronic device having an air core inductor
Grant 10,085,342 - Cheah , et al. September 25, 2 | 2018-09-25 |
Inductor interconnect
Grant 10,083,922 - Lim , et al. September 25, 2 | 2018-09-25 |
Vertical trench routing in a substrate
Grant 10,079,158 - Kong , et al. September 18, 2 | 2018-09-18 |
Embedded Voltage Reference Plane For System-in-package Applications
App 20180226357 - Kong; Jackson Chung Peng ; et al. | 2018-08-09 |
Micro-hinge for an electronic device
Grant 10,041,282 - Cheah , et al. August 7, 2 | 2018-08-07 |
Micro-hinge for an electronic device
Grant 10,036,187 - Cheah , et al. July 31, 2 | 2018-07-31 |
Foldable fabric-based packaging solution
Grant 10,014,710 - Cheah , et al. July 3, 2 | 2018-07-03 |
Package-bottom Interposers For Land-side Configured Devices For System-in-package Apparatus
App 20180175002 - Loo; Howe Yin ; et al. | 2018-06-21 |
Microelectronic Device Having An Air Core Inductor
App 20180168043 - Cheah; Bok Eng ; et al. | 2018-06-14 |
Package-bottom Through-mold Via Interposers For Land-side Configured Devices For System-in-package Apparatus
App 20180145051 - Loo; Howe Yin ; et al. | 2018-05-24 |
Inductor Interconnect
App 20180145042 - Lim; Min Suet ; et al. | 2018-05-24 |
High Density Second Level Interconnection For Bumpless Build Up Layer (bbul) Packaging Technology
App 20180145014 - Cheah; Bok Eng ; et al. | 2018-05-24 |
Microelectronic Device Package Having Alternately Stacked Die
App 20180138146 - Cheah; Bok Eng ; et al. | 2018-05-17 |
Interconnects For Wearable Device
App 20180088627 - Cheah; Bok Eng ; et al. | 2018-03-29 |
Flexible Integrated Circuit That Includes An Antenna
App 20180049326 - Koh; Boon Ping ; et al. | 2018-02-15 |
Board-edge interconnection module with integrated capacitive coupling for enabling ultra-mobile computing devices
Grant 9,893,444 - Kong , et al. February 13, 2 | 2018-02-13 |
Flexible integrated circuit that includes an antenna
Grant 9,839,134 - Koh , et al. December 5, 2 | 2017-12-05 |
Flexible Packaging Architecture
App 20170345763 - CHEAH; Bok Eng ; et al. | 2017-11-30 |
Embedded die-down package-on-package device
Grant 9,812,422 - Ooi , et al. November 7, 2 | 2017-11-07 |
Multi-die semiconductor structure with intermediate vertical side chip and semiconductor package for same
Grant 9,812,425 - Cheah , et al. November 7, 2 | 2017-11-07 |
Flexible system-in-package solutions for wearable devices
Grant 9,778,688 - Tang , et al. October 3, 2 | 2017-10-03 |
High density second level interconnection for bumpless build up layer (BBUL) packaging technology
Grant 9,721,878 - Cheah , et al. August 1, 2 | 2017-08-01 |
Flexible Integrated Circuit That Includes An Antenna
App 20170181289 - Koh; Boon Ping ; et al. | 2017-06-22 |
Capacitive Compensation Structures Using Partially Meshed Ground Planes
App 20170170799 - Kong; Jackson Chung Peng ; et al. | 2017-06-15 |
Foldable Fabric-based Packaging Solution
App 20170170676 - CHEAH; Bok Eng ; et al. | 2017-06-15 |
Integrated circuit packaging techniques and configurations for small form-factor or wearable devices
Grant 9,646,953 - Kong , et al. May 9, 2 | 2017-05-09 |
Board-edge Interconnection Module With Integrated Capacitive Coupling For Enabling Ultra-mobile Computing Devices
App 20170093064 - KONG; JACKSON CHUNG PENG ; et al. | 2017-03-30 |
Multi-orientation Display Device
App 20170075388 - Yee; Chee Chun ; et al. | 2017-03-16 |
Electrical interconnect for an electronic package
Grant 9,552,995 - Yong , et al. January 24, 2 | 2017-01-24 |
Multi-die Semiconductor Structure With Intermediate Vertical Side Chip And Semiconductor Package For Same
App 20170018530 - CHEAH; Bok Eng ; et al. | 2017-01-19 |
Embedded Die-down Package-on-package Device
App 20170012020 - Ooi; Toong Erh ; et al. | 2017-01-12 |
Electrostatic Discharge For Electronic Device Coupling
App 20160380386 - Kong; Jackson Chung Peng ; et al. | 2016-12-29 |
Electronic device with flexible hinge
Grant D773,452 - Cheah , et al. December 6, 2 | 2016-12-06 |
Integrated Circuit Packaging Techniques And Configurations For Small Form-factor Or Wearable Devices
App 20160343686 - Kong; Jackson Chung Peng ; et al. | 2016-11-24 |
Flexible System-in-package Solutions For Wearable Devices
App 20160327977 - Tang; Jiamiao ; et al. | 2016-11-10 |
Multi-die semiconductor structure with intermediate vertical side chip and semiconductor package for same
Grant 9,478,524 - Cheah , et al. October 25, 2 | 2016-10-25 |
Embedded die-down package-on-package device
Grant 9,455,218 - Ooi , et al. September 27, 2 | 2016-09-27 |
Electrostatic Discharge For Electronic Device Coupling
App 20160211619 - Kong; Jackson Chung Peng ; et al. | 2016-07-21 |
Vertical Trench Routing In A Substrate
App 20160174374 - Kong; Jackson ; et al. | 2016-06-16 |
Computer on a stick
Grant D759,029 - Loo , et al. June 14, 2 | 2016-06-14 |
Low-profile hinge for an electronic device
Grant 9,360,896 - Lim , et al. June 7, 2 | 2016-06-07 |
Electrical Interconnect For An Electronic Package
App 20160148866 - Yong; Khang Choong ; et al. | 2016-05-26 |
Portable computing device with low profile hinge
Grant D756,349 - Lim , et al. May 17, 2 | 2016-05-17 |
Micro-hinge for an electronic device
App 20160130849 - Cheah; Bok Eng ; et al. | 2016-05-12 |
Micro-hinge For An Electronic Device
App 20160132077 - Cheah; Bok Eng ; et al. | 2016-05-12 |
Multi-die Semiconductor Structure With Intermediate Vertical Side Chip And Semiconductor Package For Same
App 20160005718 - CHEAH; Bok Eng ; et al. | 2016-01-07 |
Micro-hinge For An Electronic Device
App 20150277506 - Cheah; Bok Eng ; et al. | 2015-10-01 |
Low-profile Hinge For An Electronic Device
App 20150277505 - Lim; Min Suet ; et al. | 2015-10-01 |
Method to enable controlled side chip interconnection for 3D integrated packaging system
Grant 9,136,251 - Cheah , et al. September 15, 2 | 2015-09-15 |
High-density Inter-package Connections For Ultra-thin Package-on-package Structures, And Processes Of Forming Same
App 20150201497 - Cheah; Bok Eng ; et al. | 2015-07-16 |
High-density inter-package connections for ultra-thin package-on-package structures, and processes of forming same
Grant 8,987,896 - Cheah , et al. March 24, 2 | 2015-03-24 |
Embedded Die-down Package-on-package Device
App 20140291866 - Ooi; Toong Erh ; et al. | 2014-10-02 |
Stacked Die Package
App 20140175670 - Cheah; Bok Eng ; et al. | 2014-06-26 |
Stacked die package
Grant 8,697,495 - Cheah , et al. April 15, 2 | 2014-04-15 |
High Density Second Level Interconnection For Bumpless Build Up Layer (bbul) Packaging Technology
App 20140091442 - Cheah; Bok Eng ; et al. | 2014-04-03 |
Method To Enable Controlled Side Chip Interconnection For 3d Integrated Packaging System
App 20130341803 - Cheah; Bok Eng ; et al. | 2013-12-26 |
Microelectronic Device, Stacked Die Package And Computing System Containing Same, Method Of Manufacturing A Multi-channel Communication Pathway In Same, And Method Of Enabling Electrical Communication Between Components Of A Stacked-die Package
App 20120319293 - Cheah; Bok Eng ; et al. | 2012-12-20 |
Firmware verification using system memory error check logic
Grant 8,281,229 - Chew , et al. October 2, 2 | 2012-10-02 |
Die backside wire bond technology for single or stacked die package
Grant 8,198,716 - Periaman , et al. June 12, 2 | 2012-06-12 |
Die backside metallization and surface activated bonding for stacked die packages
Grant 8,110,930 - Periaman , et al. February 7, 2 | 2012-02-07 |
Stacked Die Package
App 20120003792 - CHEAH; Bok Eng ; et al. | 2012-01-05 |
Stacked die package
Grant 8,044,497 - Cheah , et al. October 25, 2 | 2011-10-25 |
High-density Inter-package Connections For Ultra-thin Package-on-package Structures, And Processes Of Forming Same
App 20110140268 - Cheah; Bok Eng ; et al. | 2011-06-16 |
Bandwidth allocation for network packet traffic
Grant 7,773,504 - Chew , et al. August 10, 2 | 2010-08-10 |
Firmware Verification Using System Memory Error Check Logic
App 20100169750 - Chew; Yen Hsiang ; et al. | 2010-07-01 |
Quality of service (QoS) processing of data packets
Grant 7,743,181 - Chew , et al. June 22, 2 | 2010-06-22 |
Stacked-die packages with silicon vias and surface activated bonding
Grant 7,692,278 - Periaman , et al. April 6, 2 | 2010-04-06 |
Bandwidth allocation for network packet traffic
App 20090122702 - Chew; Yen Hsiang ; et al. | 2009-05-14 |
Stacked Die Package
App 20090065951 - CHEAH; Bok Eng ; et al. | 2009-03-12 |
Quality of Service (QoS) Processing of Data Packets
App 20090019196 - Chew; Yen Hsiang ; et al. | 2009-01-15 |
Vertical Controlled Side Chip Connection For 3d Processor Package
App 20080315388 - Periaman; Shanggar ; et al. | 2008-12-25 |
Die backside metallization and surface activated bonding for stacked die packages
App 20080315421 - Periaman; Shanggar ; et al. | 2008-12-25 |
Die backside wire bond technology for single or stacked die package
App 20080237310 - Periaman; Shanggar ; et al. | 2008-10-02 |
Package on package design to improve functionality and efficiency
Grant 7,400,033 - Cheah , et al. July 15, 2 | 2008-07-15 |
Package On Package Design To Improve Functionality And Efficiency
App 20080157350 - Cheah; Bok Eng ; et al. | 2008-07-03 |
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