Chea; Bok Eng
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chea; Bok Eng.The latest application filed is for "stiffener for a package substrate".
- Chea; Bok Eng - Gelugor MY
| Patent | Date |
|---|---|
| Stiffener For A Package Substrate App 20190006294 - Ong; Jenny Shio Yin ; et al. | 2019-01-03 |
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