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Patent applications and USPTO patent grants for CHE; Lufeng.The latest application filed is for "low-stress packaging structure for mems acceleration sensor chip".
Patent | Date |
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Low-stress Packaging Structure For Mems Acceleration Sensor Chip App 20220306458 - CHE; Lufeng | 2022-09-29 |
Variable area capacitive lateral acceleration sensor and preparation method thereof Grant 9,625,488 - Che , et al. April 18, 2 | 2017-04-18 |
Capacitive acceleration sensor with a bending elastic beam and preparation method thereof Grant 9,625,487 - Che , et al. April 18, 2 | 2017-04-18 |
Capacitive acceleration sensor with an H-shaped beam and preparation method thereof Grant 9,476,906 - Che , et al. October 25, 2 | 2016-10-25 |
Variable Area Capacitive Lateral Acceleration Sensor and Preparation Method Thereof App 20150114118 - Che; Lufeng ;   et al. | 2015-04-30 |
Capacitive Acceleration Sensor with a Bending Elastic Beam and Preparation Method Thereof App 20150075283 - Che; Lufeng ;   et al. | 2015-03-19 |
Capacitive Acceleration Sensor with an H-Shaped Beam and Preparation Method Thereof App 20150075284 - Che; Lufeng ;   et al. | 2015-03-19 |
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