| Patent | Date |
|---|
Die singulation and stacked device structures
Grant 11,075,117 - Hariharan , et al. July 27, 2 | 2021-07-27 |
Stacked silicon package assembly having enhanced stiffener
Grant 10,840,192 - Zohni , et al. November 17, 2 | 2020-11-17 |
Die Singulation And Stacked Device Structures
App 20190267287 - Hariharan; Ganesh ; et al. | 2019-08-29 |
Temporary connection traces for wafer sort testing
Grant 10,204,841 - Klein , et al. Feb | 2019-02-12 |
Multi-die wafer-level test and assembly without comprehensive individual die singulation
Grant 10,032,682 - Klein , et al. July 24, 2 | 2018-07-24 |
Method and apparatus for testing interposer dies prior to assembly
Grant 9,989,572 - Chaware , et al. June 5, 2 | 2018-06-05 |
Heterogeneous integration of integrated circuit device and companion device
Grant 9,865,567 - Chaware , et al. January 9, 2 | 2018-01-09 |
Interposer-less stack die interconnect
Grant 9,761,533 - Chaware , et al. September 12, 2 | 2017-09-12 |
Interposer-less Stack Die Interconnect
App 20170110407 - Chaware; Raghunandan ; et al. | 2017-04-20 |
Stacked silicon package assembly having enhanced lid adhesion
Grant 9,418,909 - Chaware , et al. August 16, 2 | 2016-08-16 |
Method for providing charge protection to one or more dies during formation of a stacked silicon device
Grant 9,385,106 - Chaware , et al. July 5, 2 | 2016-07-05 |
Integrated circuit package testing
Grant 9,341,668 - Hariharan , et al. May 17, 2 | 2016-05-17 |
Method for removing bumps from incomplete and defective interposer dies for stacked silicon interconnect technology (SSIT) devices
Grant 8,900,987 - Singh , et al. December 2, 2 | 2014-12-02 |
System And Method For Laminating Photovoltaic Structures
App 20140312530 - MAHESHWARI; Abhay ; et al. | 2014-10-23 |
Semiconductor structure and method for interconnection of integrated circuits
Grant 8,841,752 - Chaware , et al. September 23, 2 | 2014-09-23 |
System and method for laminating photovoltaic structures
Grant 8,766,086 - Maheshwari , et al. July 1, 2 | 2014-07-01 |
Stacked die assembly
Grant 8,704,384 - Wu , et al. April 22, 2 | 2014-04-22 |
Semiconductor structure and method for interconnection of integrated circuits
Grant 8,519,528 - Nagarajan , et al. August 27, 2 | 2013-08-27 |
Stacked Die Assembly
App 20130214432 - Wu; Ephrem C. ; et al. | 2013-08-22 |
System And Method For Determining Placement Of Photovoltaic Strips Using Displacement Sensors
App 20130206208 - SHAH; Shirish ; et al. | 2013-08-15 |
Apparatus and methodology for testing stacked die
Grant 8,415,783 - Rahman , et al. April 9, 2 | 2013-04-09 |
System and method for determining placement of photovoltaic strips using displacement sensors
Grant 8,361,259 - Shah , et al. January 29, 2 | 2013-01-29 |
Photovoltaic Strip Solar Modules And Methods
App 20120211052 - MARATHE; Ajay ; et al. | 2012-08-23 |
System And Method For Forming Photovoltaic Modules
App 20120167948 - Marathe; Ajay ; et al. | 2012-07-05 |
System And Method For Laminating Photovoltaic Structures
App 20120067398 - MAHESHWARI; Abhay ; et al. | 2012-03-22 |
System And Method For Determining Placement Of Photovoltaic Strips Using Displacement Sensors
App 20120067397 - Shah; Shirish ; et al. | 2012-03-22 |
Molded integrated circuit package and method of forming a molded integrated circuit package
Grant 7,906,857 - Hoang , et al. March 15, 2 | 2011-03-15 |
Low cost bumping and bonding method for stacked die
Grant 7,863,092 - Chaware , et al. January 4, 2 | 2011-01-04 |
Process for exposing solder bumps on an underfill coated semiconductor
Grant 7,338,842 - Chaware , et al. March 4, 2 | 2008-03-04 |
Process for exposing solder bumps on an underfill coated semiconductor
App 20070020815 - Chaware; Raghunandan ; et al. | 2007-01-25 |
| 