| Patent | Date |
|---|
Coreless Electronic Substrates Having Embedded Inductors
App 20220293327 - Ganesan; Sanka ; et al. | 2022-09-15 |
Antenna Package Using Ball Attach Array To Connect Antenna And Base Substrates
App 20220216611 - Yao; Jimin ; et al. | 2022-07-07 |
Selectively Roughened Copper Architectures For Low Insertion Loss Conductive Features
App 20220102259 - Kong; Jieying ; et al. | 2022-03-31 |
High density package substrate formed with dielectric bi-layer
Grant 11,276,634 - Pietambaram , et al. March 15, 2 | 2022-03-15 |
High Density Organic Interconnect Structures
App 20220059367 - Chavali; Sri Chaitra Jyotsna ; et al. | 2022-02-24 |
High density organic interconnect structures
Grant 11,195,727 - Chavali , et al. December 7, 2 | 2021-12-07 |
Integrated Circuit Structures In Package Substrates
App 20210351116 - Ganesan; Sanka ; et al. | 2021-11-11 |
Integrated circuit structures in package substrates
Grant 11,107,757 - Ganesan , et al. August 31, 2 | 2021-08-31 |
Microelectronic Device Including Fiber-containing Build-up Layers
App 20210242132 - Chavali; Sri Chaitra Jyotsna | 2021-08-05 |
Embedded Die Architecture And Method Of Making
App 20210193579 - Ganesan; Sanka ; et al. | 2021-06-24 |
Microelectronic device including fiber-containing build-up layers
Grant 11,004,792 - Chavali May 11, 2 | 2021-05-11 |
Hybrid Core Substrate Architecture For High Speed Signaling And Fli/sli Reliability And Its Making
App 20210125932 - CHAVALI; Sri Chaitra Jyotsna | 2021-04-29 |
Package Embedded Magnetic Inductor Structures And Manufacturing Techniques For 5-50 Mhz Smps Operations
App 20210125944 - LAMBERT; William J. ; et al. | 2021-04-29 |
Asymmetric electronic substrate and method of manufacture
Grant 10,980,129 - Chavali , et al. April 13, 2 | 2021-04-13 |
Scalable High Speed High Bandwidth Io Signaling Package Architecture And Method Of Making
App 20210028116 - GANESAN; Sanka ; et al. | 2021-01-28 |
Electrical interconnections with improved compliance due to stress relaxation and method of making
Grant 10,903,137 - Alur , et al. January 26, 2 | 2021-01-26 |
Inductors For Package Substrates
App 20210005550 - CHAVALI; Sri Chaitra Jyotsna ; et al. | 2021-01-07 |
High Density Organic Interconnect Structures
App 20200312675 - Chavali; Sri Chaitra Jyotsna ; et al. | 2020-10-01 |
Integrated Circuit Structures In Package Substrates
App 20200251411 - Kind Code | 2020-08-06 |
Asymmetric Electronic Substrate And Method Of Manufacture
App 20200221577 - Chavali; Sri Chaitra Jyotsna ; et al. | 2020-07-09 |
High density organic interconnect structures
Grant 10,685,850 - Chavali , et al. | 2020-06-16 |
Integrated circuit structures in package substrates
Grant 10,672,693 - Ganesan , et al. | 2020-06-02 |
Edge-firing antenna walls built into substrate
Grant 10,658,765 - Chavali , et al. | 2020-05-19 |
Asymmetric electronic substrate and method of manufacture
Grant 10,624,213 - Chavali , et al. | 2020-04-14 |
Microelectronic Device Including Fiber-containing Build-up Layers
App 20200105674 - Chavali; Sri Chaitra Jyotsna | 2020-04-02 |
Stacked Wire-bond Dice Attached By Pillars Or Bumps Above A Flip-chip Die On A Semiconductor Package Substrate
App 20200098727 - Mallik; Debendra ; et al. | 2020-03-26 |
High Density Package Substrate Formed With Dielectric Bi-layer
App 20200075473 - Pietambaram; Srinivas V. ; et al. | 2020-03-05 |
Edge-firing Antenna Walls Built Into Substrate
App 20200006866 - Chavali; Sri Chaitra Jyotsna ; et al. | 2020-01-02 |
Microelectronic Device Interconnect Structure
App 20200006273 - Dubey; Manish ; et al. | 2020-01-02 |
Electrical Interconnections With Improved Compliance Due To Stress Relaxation And Method Of Making
App 20190393129 - Alur; Siddharth K. ; et al. | 2019-12-26 |
Integrated Circuit Structures In Package Substrates
App 20190304887 - Ganesan; Sanka ; et al. | 2019-10-03 |
Electrical interconnections with improved compliance due to stress relaxation and method of making
Grant 10,424,530 - Alur , et al. Sept | 2019-09-24 |
Integrated circuit structures with recessed conductive contacts for package on package
Grant 10,424,561 - Lee , et al. Sept | 2019-09-24 |
High Density Organic Interconnect Structures
App 20190221447 - Chavali; Sri Chaitra Jyotsna ; et al. | 2019-07-18 |
Integrated Circuit Structures With Recessed Conductive Contacts For Package On Package
App 20180226381 - LEE; KYU-OH ; et al. | 2018-08-09 |
Metal protected fan-out cavity
Grant 9,953,959 - Darmawikarta , et al. April 24, 2 | 2018-04-24 |
Integrated circuit structures with recessed conductive contacts for package on package
Grant 9,865,568 - Lee , et al. January 9, 2 | 2018-01-09 |
Integrated Circuit Structures With Recessed Conductive Contacts For Package On Package
App 20170207196 - LEE; KYU-OH ; et al. | 2017-07-20 |
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