Chau; Keung
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chau; Keung.The latest application filed is for "die bonding method utilizing rotary wafer table".
- Chau; Keung - Kwai Chung N/A HK
- Chau; Keung - Quarry Bay CN
- Chau; Keung - Hong Kong CN
| Patent | Date |
|---|---|
| Die bonding method utilizing rotary wafer table Grant 8,633,089 - Ng , et al. January 21, 2 | 2014-01-21 |
| Transfer apparatus for multiple adhesives Grant 8,397,785 - Chau , et al. March 19, 2 | 2013-03-19 |
| Die Bonding Method Utilizing Rotary Wafer Table App 20120252161 - NG; Man Chung ; et al. | 2012-10-04 |
| Electromagnetic valve Grant 7,975,982 - Chan , et al. July 12, 2 | 2011-07-12 |
| Transfer Apparatus For Multiple Adhesives App 20110114258 - CHAU; Keung ; et al. | 2011-05-19 |
| Electromagnetic Valve App 20100051844 - Chan; Chi Wai ; et al. | 2010-03-04 |
| Die sorting apparatus and method Grant 7,345,254 - Zhong , et al. March 18, 2 | 2008-03-18 |
| Die sorting apparatus and method App 20050130333 - Zhong, Wei Min ; et al. | 2005-06-16 |
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