Chatterjee; Ritwik
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chatterjee; Ritwik.The latest application filed is for "unified events framework".
- Chatterjee; Ritwik - Jharkhand IN
- - unknown
- Chatterjee; Ritwik - Austin TX US
| Patent | Date |
|---|---|
| Unified events framework Grant 10,922,151 - Lube , et al. February 16, 2 | 2021-02-16 |
| Unified Events Framework App 20200012541 - Lube; Harry ; et al. | 2020-01-09 |
| Systems and methods for multi-objective evolutionary algorithms with category discovery Grant 10311358 - | 2019-06-04 |
| Method to form a via Grant 8,586,474 - Chatterjee , et al. November 19, 2 | 2013-11-19 |
| 3-D semiconductor die structure with containing feature and method Grant 8,581,383 - Pozder , et al. November 12, 2 | 2013-11-12 |
| Method for forming interconnects for 3-D applications Grant 8,003,517 - Mathew , et al. August 23, 2 | 2011-08-23 |
| Forming a 3-D semiconductor die structure with an intermetallic formation Grant 7,993,971 - Chatterjee , et al. August 9, 2 | 2011-08-09 |
| Method To Form A Via App 20110151663 - Chatterjee; Ritwik ; et al. | 2011-06-23 |
| Method to form a via Grant 7,932,175 - Chatterjee , et al. April 26, 2 | 2011-04-26 |
| 3-d Semiconductor Die Structure With Containing Feature And Method App 20100327440 - POZDER; SCOTT K. ; et al. | 2010-12-30 |
| 3-D semiconductor die structure with containing feature and method Grant 7,811,932 - Pozder , et al. October 12, 2 | 2010-10-12 |
| Micropad formation for a semiconductor Grant 7,807,572 - Mathew , et al. October 5, 2 | 2010-10-05 |
| Method for forming a through silicon via layout Grant 7,799,678 - Kropewnicki , et al. September 21, 2 | 2010-09-21 |
| Dual plasma treatment barrier film to reduce low-k damage Grant 7,763,538 - Turner , et al. July 27, 2 | 2010-07-27 |
| Semiconductor interconnect having adjacent reservoir for bonding and method for formation Grant 7,579,258 - Chatterjee August 25, 2 | 2009-08-25 |
| Micropad for bonding and a method therefor Grant 7,572,723 - Mathew , et al. August 11, 2 | 2009-08-11 |
| Method For Forming A Through Silicon Via Layout App 20090191708 - Kropewnicki; Thomas J. ; et al. | 2009-07-30 |
| Micropad Formation For A Semiconductor App 20090176366 - Mathew; Varughese ; et al. | 2009-07-09 |
| 3-d Semiconductor Die Structure With Containing Feature And Method App 20090166888 - Pozder; Scott K. ; et al. | 2009-07-02 |
| Forming A 3-d Semiconductor Die Structure With An Intermetallic Formation App 20090170246 - Chatterjee; Ritwik ; et al. | 2009-07-02 |
| Method for forming interconnects for 3-D applications App 20080299762 - Mathew; Varughese ; et al. | 2008-12-04 |
| Method to form a via App 20080299759 - Chatterjee; Ritwik ; et al. | 2008-12-04 |
| Method of forming a semiconductor device having a diffusion barrier stack and structure thereof Grant 7,422,979 - Michaelson , et al. September 9, 2 | 2008-09-09 |
| Method Of Forming A Through-substrate Via App 20080113505 - Sparks; Terry G. ; et al. | 2008-05-15 |
| Micropad For Bonding And A Method Therefor App 20080099799 - Mathew; Varughese ; et al. | 2008-05-01 |
| Semiconductor interconnect having adjacent reservoir for bonding and method for formation App 20070170584 - Chatterjee; Ritwik | 2007-07-26 |
| Dual plasma treatment barrier film to reduce low-k damage App 20070161229 - Turner; Michael D. ; et al. | 2007-07-12 |
| Method of forming a semiconductor device having a diffusion barrier stack and structure thereof App 20060202339 - Michaelson; Lynne M. ; et al. | 2006-09-14 |
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