Chatterjee; Prithwish

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chatterjee; Prithwish.The latest application filed is for "coreless electronic substrates having embedded inductors".

Company Profile

19.10.27

Chatterjee; Prithwish - Tempe AZ
CHATTERJEE; Prithwish - Chandler AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Thin film barrier seed metallization in magnetic-plugged through hole inductor Grant 11,443,885 - Darmawikarta , et al. September 13, 2	2022-09-13
Coreless Electronic Substrates Having Embedded Inductors App 20220285079 - Pietambaram; Srinivas ; et al.	2022-09-08
Methods for attaching large components in a package substrate for advanced power delivery Grant 11,432,405 - Jain , et al. August 30, 2	2022-08-30
Magnetic Inductor Structures For Package Devices App 20220230951 - Chatterjee; Prithwish ; et al.	2022-07-21
Magnetic inductor structures for package devices Grant 11,335,632 - Chatterjee , et al. May 17, 2	2022-05-17
Methods Of Embedding Magnetic Structures In Substrates App 20220130748 - Vadlamani; Sai ; et al.	2022-04-28
Electronic substrates having embedded magnetic material using photo-imagable dielectric layers Grant 11,289,263 - Vadlamani , et al. March 29, 2	2022-03-29
Enabling magnetic films in inductors integrated into semiconductor packages Grant 11,270,959 - Darmawikarta , et al. March 8, 2	2022-03-08
Coreless Organic Packages With Embedded Die And Magnetic Inductor Structures App 20220068847 - Brown; Andrew J. ; et al.	2022-03-03
Methods of embedding magnetic structures in substrates Grant 11,251,113 - Vadlamani , et al. February 15, 2	2022-02-15
Electronic Substrates Having Embedded Dielectric Magnetic Material To Form Inductors App 20220013265 - Brown; Andrew J. ; et al.	2022-01-13
Coreless organic packages with embedded die and magnetic inductor structures Grant 11,205,626 - Brown , et al. December 21, 2	2021-12-21
Electronic substrates having embedded dielectric magnetic material to form inductors Grant 11,189,409 - Brown , et al. November 30, 2	2021-11-30
In-plane Inductors In Ic Packages App 20210273036 - Marin; Brandon C. ; et al.	2021-09-02
Package Architecture Utilizing Photoimageable Dielectric (pid) For Reduced Bump Pitch App 20210134727 - May; Robert A. ; et al.	2021-05-06
Substrate For An Electronic Device App 20200411413 - Alur; Amruthavalli Pallavi ; et al.	2020-12-31
Coreless Organic Packages With Embedded Die And Magnetic Inductor Structures App 20200279819 - Brown; Andrew J. ; et al.	2020-09-03
Coreless organic packages with embedded die and magnetic inductor structures Grant 10,700,021 - Brown , et al.	2020-06-30
Substrate Embedded Heat Pipe App 20200176355 - May; Robert A. ; et al.	2020-06-04
Asymmetric Cored Integrated Circuit Package Supports App 20200168536 - Link; Lauren Ashley ; et al.	2020-05-28
Coreless Organic Packages With Embedded Die And Magnetic Inductor Structures App 20200075511 - Brown; Andrew J. ; et al.	2020-03-05
Substrate Assembly Region With Ceramic Or Boron Fiber App 20200006211 - BROWN; Andrew J. ; et al.	2020-01-02
Substrate Integrated Thin Film Capacitors Using Amorphous High-k Dielectrics App 20200006258 - ALEKSOV; Aleksandar ; et al.	2020-01-02
Methods For Attaching Large Components In A Package Substrate For Advanced Power Delivery App 20200008302 - JAIN; Rahul ; et al.	2020-01-02
Patterning Of Thin Film Capacitors In Organic Substrate Packages App 20200006005 - JAIN; Rahul ; et al.	2020-01-02
Edible supercapacitors Grant 10,468,203 - Jiang , et al. No	2019-11-05
Enabling Magnetic Films In Inductors Integrated Into Semiconductor Packages App 20190295967 - DARMAWIKARTA; Kirstof ; et al.	2019-09-26
Thin Film Barrier Seed Matallization In Magnetic-plugged Through Hole Inductor App 20190279806 - DARMAWIKARTA; Kristof ; et al.	2019-09-12
Release Layer-assisted Selective Embedding Of Magnetic Material In Cored And Coreless Organic Substrates App 20190221345 - Vadlamani; Sai ; et al.	2019-07-18
Magnetic Inductor Structures For Package Devices App 20190206780 - Chatterjee; Prithwish ; et al.	2019-07-04
Electronic Substrates Having Embedded Dielectric Magnetic Material To Form Inductors App 20190206597 - Brown; Andrew J. ; et al.	2019-07-04
Electronic Substrates Having Embedded Magnetic Material Using Photo-imagable Dielectric Layers App 20190198228 - Vadlamani; Sai ; et al.	2019-06-27
Methods Of Embedding Magnetic Structures In Substrates App 20190198436 - Vadlamani; Sai ; et al.	2019-06-27
Edible Supercapacitors App 20180235881 - Jiang; Hanqing ; et al.	2018-08-23

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