Charvat; Peter K.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Charvat; Peter K..The latest application filed is for "via hole profile and method of fabrication".
- Charvat; Peter K. - Portland OR
| Patent | Date |
|---|---|
| Via hole profile and method of fabrication Grant 5,874,358 - Myers , et al. February 23, 1 | 1999-02-23 |
| Anchored via connection Grant 5,619,071 - Myers , et al. April 8, 1 | 1997-04-08 |
| Method for etching silicon oxide films in a reactive ion etch system to prevent gate oxide damage Grant 5,549,784 - Carmody , et al. August 27, 1 | 1996-08-27 |
| Via hole profile and method of fabrication Grant 5,470,790 - Myers , et al. November 28, 1 | 1995-11-28 |
| Dry process for stripping photoresist from a polyimide surface Grant 5,262,279 - Tsang , et al. November 16, 1 | 1993-11-16 |
| Polyimide process for protecting integrated circuits Grant 5,242,864 - Fassberg , et al. September 7, 1 | 1993-09-07 |
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