loadpatents
name:-0.0058979988098145
name:-0.012619018554688
name:-0.00063085556030273
Chartered Semiconductor Manufacturing, Inc. Patent Filings

Chartered Semiconductor Manufacturing, Inc.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chartered Semiconductor Manufacturing, Inc..The latest application filed is for "method of extreme ultraviolet mask engineering".

Company Profile
0.12.4
  • Chartered Semiconductor Manufacturing, Inc. - Singapore SG
  • Chartered Semiconductor Manufacturing Inc. -
  • Chartered Semiconductor Manufacturing Inc. - Milpitas CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method and apparatus for performing nickel salicidation
Grant 6,890,854 - Lee , et al. May 10, 2
2005-05-10
Method of extreme ultraviolet mask engineering
App 20020115000 - Gupta, Subhash ;   et al.
2002-08-22
Method for forming variable-K gate dielectric
App 20020100947 - Lee, James Yong Meng ;   et al.
2002-08-01
Method for cleaning semiconductor structures using hydrocarbon and solvents in a repetitive vapor phase/liquid phase sequence
App 20020096190 - Roy, Sudipto Ranendra ;   et al.
2002-07-25
Method for fabricating void-free epitaxial-CoSi2 with ultra-shallow junctions
Grant 6,410,429 - Ho , et al. June 25, 2
2002-06-25
Method for fabricating an air gap shallow trench isolation (STI) structure
Grant 6,406,975 - Lim , et al. June 18, 2
2002-06-18
Method to form zirconium oxide and hafnium oxide for high dielectric constant materials
App 20020064970 - Chooi, Simon ;   et al.
2002-05-30
Method to form a recessed source drain on a trench side wall with a replacement gate technique
Grant 6,380,088 - Chan , et al. April 30, 2
2002-04-30
Method to form high performance copper damascene interconnects by de-coupling via and metal line filling
Grant 6,380,084 - Lim , et al. April 30, 2
2002-04-30
Method for fabricating an air gap metallization scheme that reduces inter-metal capacitance of interconnect structures
Grant 6,380,106 - Lim , et al. April 30, 2
2002-04-30
Method of copper transport prevention by a sputtered gettering layer on backside of wafer
Grant 6,358,821 - Gupta , et al. March 19, 2
2002-03-19
Method to improve adhesion of organic dielectrics in dual damascene interconnects
Grant 6,348,407 - Gupta , et al. February 19, 2
2002-02-19
Method to form a balloon shaped STI using a micro machining technique to remove heavily doped silicon
Grant 6,313,008 - Leung , et al. November 6, 2
2001-11-06
Method to form transistors with multiple threshold voltages (VT) using a combination of different work function gate materials
Grant 6,300,177 - Sundaresan , et al. October 9, 2
2001-10-09
Flash memory cell structure with improved channel punch-through characteristics
Grant 6,284,603 - Ho Simon , et al. September 4, 2
2001-09-04
Method of forming MOS/CMOS devices with dual or triple gate oxide
Grant 6,268,251 - Zhong , et al. July 31, 2
2001-07-31

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