Charneski; Lawrence J.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Charneski; Lawrence J..The latest application filed is for "nanorod sensor with single-plane electrodes".

Company Profile

0.17.12

Charneski; Lawrence J. - Vancouver WA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Nanorod sensor with single-plane electrodes Grant 7,759,150 - Zhang , et al. July 20, 2	2010-07-20
Bipolar switching PCMO capacitor Grant 7,696,550 - Li , et al. April 13, 2	2010-04-13
Nanorod sensor with single-plane electrodes App 20080290431 - Zhang; Fengyan ; et al.	2008-11-27
Bipolar switching PCMO capacitor App 20070221975 - Li; Tingkai ; et al.	2007-09-27
System and method for forming a bipolar switching PCMO film Grant 7,235,407 - Li , et al. June 26, 2	2007-06-26
Method of buffer layer formation for RRAM thin film deposition App 20070048990 - Zhuang; Wei-Wei ; et al.	2007-03-01
Method of forming Pr.sub.xCa.sub.1-xMnO.sub.3 thin films having a PrMnO.sub.3/CaMnO.sub.3 super lattice structure using metalorganic chemical vapor deposition Grant 7,098,101 - Li , et al. August 29, 2	2006-08-29
Grading PrxCa1-xMnO3 thin films by metalorganic chemical vapor deposition App 20060068099 - Li; Tingkai ; et al.	2006-03-30
System and method for forming a bipolar switching PCMO film App 20050275064 - Li, Tingkai ; et al.	2005-12-15
Low temperature MOCVD processes for fabrication of Pr.sub.X Ca.sub.1-x MnO.sub.3 thin films Grant 6,972,239 - Li , et al. December 6, 2	2005-12-06
Precursor solution and method for controlling the composition of MOCVD deposited PCMO App 20040170761 - Li, Tingkai ; et al.	2004-09-02
Copper metal precursor Grant 6,764,537 - Zhuang , et al. July 20, 2	2004-07-20
Substituted phenylethylene precursor synthesis method Grant 6,669,870 - Zhuang , et al. December 30, 2	2003-12-30
Adhesion promotion method for CVD copper metallization in IC applications Grant 6,645,860 - Charneski , et al. November 11, 2	2003-11-11
Copper metal precursor App 20030203111 - Zhuang, Wei-Wei ; et al.	2003-10-30
Method of depositing a high-adhesive copper thin film on a metal nitride substrate Grant 6,596,344 - Zhuang , et al. July 22, 2	2003-07-22
Method of depositing a high-adhesive copper thin film on a metal nitride substrate App 20020143202 - Zhuang, Wei-Wei ; et al.	2002-10-03
Adhesion promotion method for CVD copper metallization in IC applications App 20020086528 - Charneski, Lawrence J. ; et al.	2002-07-04
Integrated circuit prepared by selectively cleaning copper substrates, in-situ, to remove copper oxides App 20020047144 - Nguyen, Tue ; et al.	2002-04-25
In-situ Method Of Cleaning A Metal-organic Chemical Vapor Deposition Chamber App 20010009154 - NGUYEN, TUE ; et al.	2001-07-26
Substituted phenylethylene precursor synthesis method App 20010009274 - Zhuang, Wei-Wei ; et al.	2001-07-26
Precursor with (methoxy) (methyl) silylolefin ligand to deposit copper and method same Grant 6,090,960 - Senzaki , et al. July 18, 2	2000-07-18
Substituted ethylene precursor and synthesis method Grant 5,994,571 - Zhuang , et al. November 30, 1	1999-11-30
Enhanced CVD copper adhesion by two-step deposition process Grant 5,948,467 - Nguyen , et al. September 7, 1	1999-09-07
System and method of selectively cleaning copper substrate surfaces, in-situ, to remove copper oxides Grant 5,939,334 - Nguyen , et al. August 17, 1	1999-08-17
Oxidized diffusion barrier surface for the adherence of copper and method for same Grant 5,913,144 - Nguyen , et al. June 15, 1	1999-06-15
Copper adhesion to a diffusion barrier surface and method for same Grant 5,909,637 - Charneski , et al. June 1, 1	1999-06-01
Differential copper deposition on integrated circuit surfaces and method for same Grant 5,851,367 - Nguyen , et al. December 22, 1	1998-12-22
Precursor with (alkyloxy)(alkyl)-silylolefin ligand to deposit copper Grant 5,767,301 - Senzaki , et al. June 16, 1	1998-06-16

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