loadpatents
name:-0.014033079147339
name:-0.024208068847656
name:-0.00047802925109863
Chapple-Sokol; Jonathan D. Patent Filings

Chapple-Sokol; Jonathan D.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chapple-Sokol; Jonathan D..The latest application filed is for "titanium tungsten liner used with copper interconnects".

Company Profile
0.19.11
  • Chapple-Sokol; Jonathan D. - Essex Junction VT
  • Chapple-Sokol; Jonathan D. - Burlington VT
  • Chapple-Sokol; Jonathan D. - Poughkeepsie NY
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Titanium tungsten liner used with copper interconnects
Grant 9,685,370 - Chapple-Sokol , et al. June 20, 2
2017-06-20
Titanium Tungsten Liner Used With Copper Interconnects
App 20160181151 - Chapple-Sokol; Jonathan D. ;   et al.
2016-06-23
Achieving uniform capacitance between an electrostatic chuck and a semiconductor wafer
Grant 9,196,519 - Adderly , et al. November 24, 2
2015-11-24
Achieving Uniform Capacitance Between An Electrostatic Chuck And A Semiconductor Wafer
App 20150138686 - Adderly; Shawn A. ;   et al.
2015-05-21
Electromigration resistant aluminum-based metal interconnect structure
Grant 8,084,864 - Chapple-Sokol , et al. December 27, 2
2011-12-27
Electromigration Resistant Aluminum-based Metal Interconnect Structure
App 20110221064 - Chapple-Sokol; Jonathan D. ;   et al.
2011-09-15
Electromigration resistant aluminum-based metal interconnect structure
Grant 8,003,536 - Chapple-Sokol , et al. August 23, 2
2011-08-23
Metal seed layer deposition
Grant 7,879,716 - Barkyoumb , et al. February 1, 2
2011-02-01
Electromigration Resistant Aluminum-based Metal Interconnect Structure
App 20100237503 - Chapple-Sokol; Jonathan D. ;   et al.
2010-09-23
Suppression of localized metal precipitate formation and corresponding metallization depletion in semiconductor processing
Grant 7,649,262 - Chapple-Sokol , et al. January 19, 2
2010-01-19
Suppression Of Localized Metal Precipitate Formation And Corresponding Metallization Depletion In Semiconductor Processing
App 20090294968 - Chapple-Sokol; Jonathan D. ;   et al.
2009-12-03
Tungsten Liner For Aluminum-based Electromigration Resistant Interconnect Structure
App 20090230555 - Chapple-Sokol; Jonathan D. ;   et al.
2009-09-17
Suppression of localized metal precipitate formation and corresponding metallization depletion in semiconductor processing
Grant 7,572,650 - Chapple-Sokol , et al. August 11, 2
2009-08-11
Metal Seed Layer Deposition
App 20070155164 - Barkyoumb; Steven P. ;   et al.
2007-07-05
Metal seed layer deposition
Grant 7,235,487 - Barkyoumb , et al. June 26, 2
2007-06-26
Suppression Of Localized Metal Precipitate Formation And Corresponding Metallization Depletion In Semiconductor Processing
App 20070040277 - Chapple-Sokol; Jonathan D. ;   et al.
2007-02-22
Suppression of localized metal precipitate formation and corresponding metallization depletion in semiconductor processing
Grant 7,173,338 - Chapple-Sokol , et al. February 6, 2
2007-02-06
Metal Seed Layer Deposition
App 20050253265 - Barkyoumb, Steven P. ;   et al.
2005-11-17
Suppression Of Localized Metal Precipitate Formation And Corresponding Metallization Depletion In Semiconductor Processing
App 20050194689 - Chapple-Sokol, Jonathan D. ;   et al.
2005-09-08
Method of forming refractory metal contact in an opening, and resulting structure
Grant 6,762,121 - Chapple-Sokol , et al. July 13, 2
2004-07-13
Method of forming refractory metal contact in an opening, and resulting structure
App 20030165705 - Chapple-Sokol, Jonathan D. ;   et al.
2003-09-04
One dimensional silicon quantum wire devices and the method of manufacture thereof
Grant 5,612,255 - Chapple-Sokol , et al. March 18, 1
1997-03-18
Etching of silicon dioxide selectively to silicon nitride and polysilicon
Grant 5,505,816 - Barnes , et al. April 9, 1
1996-04-09
Fluid delivery apparatus and method having an infrared feedline sensor
Grant 5,492,718 - O'Neill , et al. February 20, 1
1996-02-20
Aluminum oxide low pressure chemical vapor deposition (LPCVD) system-fourier transform infrared (FTIR) source chemical control
Grant 5,431,734 - Chapple-Sokol , et al. July 11, 1
1995-07-11
Storage capacitor with a conducting oxide electrode for metal-oxide dielectrics
Grant 5,383,088 - Chapple-Sokol , et al. January 17, 1
1995-01-17
Method of making semiconductor quantum dot light emitting/detecting devices
Grant 5,354,707 - Chapple-Sokol , et al. October 11, 1
1994-10-11
Semiconductor quantum dot light emitting/detecting devices
Grant 5,293,050 - Chapple-Sokol , et al. March 8, 1
1994-03-08
Safe method for etching silicon dioxide
Grant 5,268,069 - Chapple-Sokol , et al. December 7, 1
1993-12-07
LPCVD reactor for high efficiency, high uniformity deposition
Grant 5,134,963 - Barbee , et al. August 4, 1
1992-08-04

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.

© 2024 USPTO.report | Privacy Policy | Resources | RSS Feed of Trademarks | Trademark Filings Twitter Feed