Patent | Date |
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Titanium tungsten liner used with copper interconnects Grant 9,685,370 - Chapple-Sokol , et al. June 20, 2 | 2017-06-20 |
Titanium Tungsten Liner Used With Copper Interconnects App 20160181151 - Chapple-Sokol; Jonathan D. ;   et al. | 2016-06-23 |
Achieving uniform capacitance between an electrostatic chuck and a semiconductor wafer Grant 9,196,519 - Adderly , et al. November 24, 2 | 2015-11-24 |
Achieving Uniform Capacitance Between An Electrostatic Chuck And A Semiconductor Wafer App 20150138686 - Adderly; Shawn A. ;   et al. | 2015-05-21 |
Electromigration resistant aluminum-based metal interconnect structure Grant 8,084,864 - Chapple-Sokol , et al. December 27, 2 | 2011-12-27 |
Electromigration Resistant Aluminum-based Metal Interconnect Structure App 20110221064 - Chapple-Sokol; Jonathan D. ;   et al. | 2011-09-15 |
Electromigration resistant aluminum-based metal interconnect structure Grant 8,003,536 - Chapple-Sokol , et al. August 23, 2 | 2011-08-23 |
Metal seed layer deposition Grant 7,879,716 - Barkyoumb , et al. February 1, 2 | 2011-02-01 |
Electromigration Resistant Aluminum-based Metal Interconnect Structure App 20100237503 - Chapple-Sokol; Jonathan D. ;   et al. | 2010-09-23 |
Suppression of localized metal precipitate formation and corresponding metallization depletion in semiconductor processing Grant 7,649,262 - Chapple-Sokol , et al. January 19, 2 | 2010-01-19 |
Suppression Of Localized Metal Precipitate Formation And Corresponding Metallization Depletion In Semiconductor Processing App 20090294968 - Chapple-Sokol; Jonathan D. ;   et al. | 2009-12-03 |
Tungsten Liner For Aluminum-based Electromigration Resistant Interconnect Structure App 20090230555 - Chapple-Sokol; Jonathan D. ;   et al. | 2009-09-17 |
Suppression of localized metal precipitate formation and corresponding metallization depletion in semiconductor processing Grant 7,572,650 - Chapple-Sokol , et al. August 11, 2 | 2009-08-11 |
Metal Seed Layer Deposition App 20070155164 - Barkyoumb; Steven P. ;   et al. | 2007-07-05 |
Metal seed layer deposition Grant 7,235,487 - Barkyoumb , et al. June 26, 2 | 2007-06-26 |
Suppression Of Localized Metal Precipitate Formation And Corresponding Metallization Depletion In Semiconductor Processing App 20070040277 - Chapple-Sokol; Jonathan D. ;   et al. | 2007-02-22 |
Suppression of localized metal precipitate formation and corresponding metallization depletion in semiconductor processing Grant 7,173,338 - Chapple-Sokol , et al. February 6, 2 | 2007-02-06 |
Metal Seed Layer Deposition App 20050253265 - Barkyoumb, Steven P. ;   et al. | 2005-11-17 |
Suppression Of Localized Metal Precipitate Formation And Corresponding Metallization Depletion In Semiconductor Processing App 20050194689 - Chapple-Sokol, Jonathan D. ;   et al. | 2005-09-08 |
Method of forming refractory metal contact in an opening, and resulting structure Grant 6,762,121 - Chapple-Sokol , et al. July 13, 2 | 2004-07-13 |
Method of forming refractory metal contact in an opening, and resulting structure App 20030165705 - Chapple-Sokol, Jonathan D. ;   et al. | 2003-09-04 |
One dimensional silicon quantum wire devices and the method of manufacture thereof Grant 5,612,255 - Chapple-Sokol , et al. March 18, 1 | 1997-03-18 |
Etching of silicon dioxide selectively to silicon nitride and polysilicon Grant 5,505,816 - Barnes , et al. April 9, 1 | 1996-04-09 |
Fluid delivery apparatus and method having an infrared feedline sensor Grant 5,492,718 - O'Neill , et al. February 20, 1 | 1996-02-20 |
Aluminum oxide low pressure chemical vapor deposition (LPCVD) system-fourier transform infrared (FTIR) source chemical control Grant 5,431,734 - Chapple-Sokol , et al. July 11, 1 | 1995-07-11 |
Storage capacitor with a conducting oxide electrode for metal-oxide dielectrics Grant 5,383,088 - Chapple-Sokol , et al. January 17, 1 | 1995-01-17 |
Method of making semiconductor quantum dot light emitting/detecting devices Grant 5,354,707 - Chapple-Sokol , et al. October 11, 1 | 1994-10-11 |
Semiconductor quantum dot light emitting/detecting devices Grant 5,293,050 - Chapple-Sokol , et al. March 8, 1 | 1994-03-08 |
Safe method for etching silicon dioxide Grant 5,268,069 - Chapple-Sokol , et al. December 7, 1 | 1993-12-07 |
LPCVD reactor for high efficiency, high uniformity deposition Grant 5,134,963 - Barbee , et al. August 4, 1 | 1992-08-04 |