Chao; Yeong-Ching
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chao; Yeong-Ching.The latest application filed is for "package structure of image sensor device".
- Chao; Yeong-Ching - Taichung TW
- Chao; Yeong-Ching - Tainan TW
- Chao; Yeong-Ching - Beituen Chiu TW
- Chao; Yeong-Ching - Taichung City TW
| Patent | Date |
|---|---|
| Electronic device with a warped spring connector Grant 7,696,443 - Lee , et al. April 13, 2 | 2010-04-13 |
| Method for fabricating a plurality of elastic probes in a row Grant 7,477,065 - Lee , et al. January 13, 2 | 2009-01-13 |
| Image sensor assembly and method for fabricating the same Grant 7,420,267 - Chao , et al. September 2, 2 | 2008-09-02 |
| Method of manufacturing an injector plate Grant 7,370,416 - Wang , et al. May 13, 2 | 2008-05-13 |
| Multi-chip image sensor module Grant 7,372,135 - Chao , et al. May 13, 2 | 2008-05-13 |
| Pillar grid array package Grant 7,368,809 - Huang , et al. May 6, 2 | 2008-05-06 |
| Method for fabricating a plurality of elastic probes in a row Grant 7,316,065 - Lee , et al. January 8, 2 | 2008-01-08 |
| Package structure of image sensor device App 20070152148 - Chao; Yeong-Ching ; et al. | 2007-07-05 |
| Method for fabricating a plurality of elastic probes in a row App 20070069749 - Lee; Yi-Chang ; et al. | 2007-03-29 |
| Method for fabricating a plurality of elastic probes in a row App 20070069750 - Lee; Yi-Chang ; et al. | 2007-03-29 |
| Method for fabricating a plurality of elastic probes in a row App 20060267607 - Lee; Yi-Chang ; et al. | 2006-11-30 |
| Probe card assembly Grant 7,129,730 - Liu , et al. October 31, 2 | 2006-10-31 |
| Pillar grid array package App 20060231941 - Huang; Hsiang-Ming ; et al. | 2006-10-19 |
| Image sensor module package App 20060231750 - Chao; Yeong-Ching ; et al. | 2006-10-19 |
| Method of manufacturing an injector plate App 20060211273 - Wang; Jiun-Heng ; et al. | 2006-09-21 |
| Modularized probe card for high frequency probing Grant 7,088,118 - Liu , et al. August 8, 2 | 2006-08-08 |
| Modularized probe head App 20060125501 - Liu; An-Hong ; et al. | 2006-06-15 |
| Modularized Probe Card For High Frequency Probing App 20060125498 - Liu; An-Hong ; et al. | 2006-06-15 |
| Package structure of image sensor device App 20060086890 - Chao; Yeong-Ching ; et al. | 2006-04-27 |
| Image sensor assembly and method for fabricating the same App 20060087022 - Chao; Yeong-Ching ; et al. | 2006-04-27 |
| Structure of image sensor package App 20060086899 - Chao; Yeong-Ching ; et al. | 2006-04-27 |
| Image sensor package App 20060087017 - Chao; Yeong-Ching ; et al. | 2006-04-27 |
| Multi-chip image sensor module App 20060087018 - Chao; Yeong-Ching ; et al. | 2006-04-27 |
| Electronic device with a warped spring connector App 20060042834 - Lee; Yi-Chang ; et al. | 2006-03-02 |
| Bump structure of an opto-electronic chip App 20060043538 - Lee; Yi-Chang ; et al. | 2006-03-02 |
| Modularized probe head Grant 6,946,860 - Cheng , et al. September 20, 2 | 2005-09-20 |
| Modularized probe head App 20050088190 - Cheng, S.J. ; et al. | 2005-04-28 |
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