Chao; Shin-Hua
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chao; Shin-Hua.The latest application filed is for "semiconductor packages".
- Chao; Shin-Hua - Kaohsiung TW
- CHAO; Shin-Hua - Kaohsiung City TW
- Chao; Shin-Hua - Tzuoying Chiu TW
| Patent | Date |
|---|---|
| Semiconductor packages Grant 10,867,899 - Sung , et al. December 15, 2 | 2020-12-15 |
| Semiconductor Packages App 20190067181 - SUNG; Yuan-Fu ; et al. | 2019-02-28 |
| Semiconductor packages Grant 10,141,252 - Sung , et al. Nov | 2018-11-27 |
| Semiconductor Packages App 20180233443 - SUNG; Yuan-Fu ; et al. | 2018-08-16 |
| Method for manufacturing semiconductor package Grant 8,889,488 - Chao , et al. November 18, 2 | 2014-11-18 |
| Method For Manufacturing Semiconductor Package App 20140011325 - CHAO; Shin-Hua ; et al. | 2014-01-09 |
| Semiconductor package and manufacturing method thereof Grant 8,546,950 - Chao , et al. October 1, 2 | 2013-10-01 |
| Semiconductor Package And Manufacturing Method Thereof App 20120032341 - CHAO; Shin-Hua ; et al. | 2012-02-09 |
| Thermally enhanced package structure Grant 8,059,422 - Tong , et al. November 15, 2 | 2011-11-15 |
| Stackable Package Having Embedded Interposer and Method for Making the Same App 20100289133 - Chao; Shin-Hua ; et al. | 2010-11-18 |
| Flip chip package process Grant 7,614,888 - Tong , et al. November 10, 2 | 2009-11-10 |
| Flip Chip Package Process App 20090087947 - Tong; Ho-Ming ; et al. | 2009-04-02 |
| Manufacturing Process And Structure Of A Thermally Enhanced Package App 20090075027 - Tong; Ho-Ming ; et al. | 2009-03-19 |
| Packaging substrate and manufacturing method thereof Grant 7,445,944 - Tong , et al. November 4, 2 | 2008-11-04 |
| Packaging substrate and manufacturing method thereof App 20080124836 - Tong; Ho-Ming ; et al. | 2008-05-29 |
| Packaging substrate and method of manufacturing the same App 20080044931 - Tong; Ho-Ming ; et al. | 2008-02-21 |
| Process for testing IC wafer App 20070046314 - Chao; Shin-Hua ; et al. | 2007-03-01 |
| Multi-chip package structure Grant 7,151,317 - Chao , et al. December 19, 2 | 2006-12-19 |
| Circuit substrate and fabrication method thereof Grant 7,060,595 - Ou , et al. June 13, 2 | 2006-06-13 |
| Redistribution Layer And Circuit Structure Thereof App 20060103020 - Tong; Ho-Ming ; et al. | 2006-05-18 |
| Semiconductor chip package and method for making the same Grant 7,041,534 - Chao , et al. May 9, 2 | 2006-05-09 |
| Multi-chip Package Structure App 20050199991 - Chao, Shin-Hua ; et al. | 2005-09-15 |
| Method of attaching a heat sink to an IC package Grant 6,918,178 - Chao , et al. July 19, 2 | 2005-07-19 |
| Wafer level transparent packaging App 20050095750 - Lo, Jian-Wen ; et al. | 2005-05-05 |
| Semiconductor chip package and method for manufacturing the same App 20050087859 - Chao, Shin Hua ; et al. | 2005-04-28 |
| Process for testing IC wafer App 20050019965 - Chao, Shin-Hua ; et al. | 2005-01-27 |
| Circuit substrate and fabrication method thereof App 20040080052 - Ou, In-De ; et al. | 2004-04-29 |
| Structure and package of a heat spreader substrate Grant 6,624,523 - Chao , et al. September 23, 2 | 2003-09-23 |
| Method of attaching a heat sink to an IC package App 20030106212 - Chao, Shin-Hua ; et al. | 2003-06-12 |
| Heat-spread substrate Grant 6,483,187 - Chao , et al. November 19, 2 | 2002-11-19 |
| Semiconductor chip package and manufacturing method thereof App 20020056903 - Li, Sai Man ; et al. | 2002-05-16 |
| Structure and package of a heat spreader substrate App 20020053731 - Chao, Shin-Hua ; et al. | 2002-05-09 |
| Ball grid array semiconductor package having improved heat dissipation efficiency, overall electrical performance and enhanced bonding capability Grant 6,229,702 - Tao , et al. May 8, 2 | 2001-05-08 |
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