Chao; Nien-Hua
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chao; Nien-Hua.The latest application filed is for "enhanced protective layering process to accommodate circuit board heat dissipation".
- Chao; Nien-Hua - Parsippany NJ
| Patent | Date |
|---|---|
| Enhanced protective layering process to accommodate circuit board heat dissipation Grant 10,631,413 - Chao , et al. | 2020-04-21 |
| Protective layering process for circuit board EMI sheilding and thermal management Grant 9,900,988 - Chao , et al. February 20, 2 | 2018-02-20 |
| Protective layering process for circuit boards Grant 9,860,992 - Chao , et al. January 2, 2 | 2018-01-02 |
| Protective layering process for circuit boards Grant 9,254,588 - Chao , et al. February 9, 2 | 2016-02-09 |
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