Chao; Lan-Lin
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chao; Lan-Lin.The latest application filed is for "3d integrated circuit and methods of forming the same".
Company Profile
14.95.93
- Chao; Lan-Lin - Sindian City TW
- Chao; Lan-Lin - Sindian TW
- Chao; Lan-Lin - Taipei County TW
- Chao; Lan-Lin - Sindlan TW
- Chao; Lan-Lin - Taipei TW
Patent Activity
| Patent | Date |
|---|---|
| 3D Integrated Circuit and Methods of Forming the Same App 20220310449 - Kuang; Hsun-Chung ; et al. | 2022-09-29 |
| Integrate Rinse Module in Hybrid Bonding Platform App 20220216052 - Huang; Xin-Hua ; et al. | 2022-07-07 |
| 3D Integrated Circuit and Methods of Forming the Same App 20220208607 - Kuang; Hsun-Chung ; et al. | 2022-06-30 |
| Integrate rinse module in hybrid bonding platform Grant 11,282,697 - Huang , et al. March 22, 2 | 2022-03-22 |
| Semiconductor Device And Fabrication Method Thereof App 20210343849 - Tsao; Chun-Han ; et al. | 2021-11-04 |
| Semiconductor device and fabrication method thereof Grant 11,069,785 - Tsao , et al. July 20, 2 | 2021-07-20 |
| Method of forming semiconductor package and semiconductor package Grant 11,014,805 - Cheng , et al. May 25, 2 | 2021-05-25 |
| 3D Integrated Circuit and Methods of Forming the Same App 20210151353 - Kuang; Hsun-Chung ; et al. | 2021-05-20 |
| 3D Integrated Circuit and Methods of Forming the Same App 20210013098 - Kuang; Hsun-Chung ; et al. | 2021-01-14 |
| 3D integrated circuit and methods of forming the same Grant 10,790,189 - Kuang , et al. September 29, 2 | 2020-09-29 |
| Integrate rinse module in hybrid bonding platform Grant 10,665,449 - Huang , et al. | 2020-05-26 |
| Integrate Rinse Module in Hybrid Bonding Platform App 20200006052 - Huang; Xin-Hua ; et al. | 2020-01-02 |
| Method Of Forming Semiconductor Package And Semiconductor Package App 20200002161 - CHENG; Chun-wen ; et al. | 2020-01-02 |
| Semiconductor Device And Fabrication Method Thereof App 20190259848 - TSAO; Chun-Han ; et al. | 2019-08-22 |
| Method of forming micro electromechanical system sensor Grant 10,384,933 - Cheng , et al. A | 2019-08-20 |
| Hybrid bonding systems and methods for semiconductor wafers Grant 10,354,972 - Liu , et al. July 16, 2 | 2019-07-16 |
| Multiple metal layer semiconductor device and low temperature stacking method of fabricating the same Grant 10,283,448 - Liu , et al. | 2019-05-07 |
| Semiconductor device and fabrication method thereof Grant 10,276,678 - Tsao , et al. | 2019-04-30 |
| Hybrid Bonding Systems and Methods for Semiconductor Wafers App 20190051628 - Liu; Ping-Yin ; et al. | 2019-02-14 |
| 3D Integrated Circuit and Methods of Forming the Same App 20190035681 - Kuang; Hsun-Chung ; et al. | 2019-01-31 |
| Method and apparatus for a semiconductor structure Grant 10,160,638 - Chu , et al. Dec | 2018-12-25 |
| Wafer bonding process and structure Grant 10,128,209 - Liu , et al. November 13, 2 | 2018-11-13 |
| Biological sensing structures Grant 10,119,909 - Lin , et al. November 6, 2 | 2018-11-06 |
| Hybrid bonding systems and methods for semiconductor wafers Grant 10,103,122 - Liu , et al. October 16, 2 | 2018-10-16 |
| Method and apparatus for image sensor packaging Grant 10,096,645 - Chen , et al. October 9, 2 | 2018-10-09 |
| 3D integrated circuit and methods of forming the same Grant 10,090,196 - Kuang , et al. October 2, 2 | 2018-10-02 |
| Apparatus and method for wafer level bonding Grant 10,049,901 - Liu , et al. August 14, 2 | 2018-08-14 |
| Multiple Metal Layer Semiconductor Device and Low Temperature Stacking Method of Fabricating the Same App 20180226337 - Liu; Ping-Yin ; et al. | 2018-08-09 |
| Alignment systems and wafer bonding systems and methods Grant 10,037,968 - Huang , et al. July 31, 2 | 2018-07-31 |
| Hybrid bonding mechanisms for semiconductor wafers Grant 9,960,129 - Liu , et al. May 1, 2 | 2018-05-01 |
| Apparatus and method for cleaning Grant 9,953,847 - Liu , et al. April 24, 2 | 2018-04-24 |
| Multiple metal layer semiconductor device and low temperature stacking method of fabricating the same Grant 9,887,155 - Liu , et al. February 6, 2 | 2018-02-06 |
| Semiconductor Device And Fabrication Method Thereof App 20170365514 - TSAO; Chun-Han ; et al. | 2017-12-21 |
| Hybrid Bonding Systems and Methods for Semiconductor Wafers App 20170358551 - Liu; Ping-Yin ; et al. | 2017-12-14 |
| Apparatus and method for verification of bonding alignment Grant 9,842,785 - Huang , et al. December 12, 2 | 2017-12-12 |
| Method Of Forming Micro Electromechanical System Sensor App 20170313581 - CHENG; Chun-wen ; et al. | 2017-11-02 |
| Air trench in packages incorporating hybrid bonding Grant 9,786,628 - Chou , et al. October 10, 2 | 2017-10-10 |
| Semiconductor device and fabrication method thereof Grant 9,754,827 - Tsao , et al. September 5, 2 | 2017-09-05 |
| Hybrid bonding systems and methods for semiconductor wafers Grant 9,748,198 - Liu , et al. August 29, 2 | 2017-08-29 |
| Alignment Systems And Wafer Bonding Systems And Methods App 20170243853 - Huang; Xin-Hua ; et al. | 2017-08-24 |
| Debonding schemes Grant 9,741,681 - Huang , et al. August 22, 2 | 2017-08-22 |
| Multiple swivel arm design in hybrid bonder Grant 9,735,033 - Huang , et al. August 15, 2 | 2017-08-15 |
| Micro electromechanical system sensor and method of forming the same Grant 9,725,310 - Cheng , et al. August 8, 2 | 2017-08-08 |
| Method of improving getter efficiency by increasing superficial area Grant 9,708,179 - Hsieh , et al. July 18, 2 | 2017-07-18 |
| Apparatus And Method For Wafer Level Bonding App 20170140955 - Liu; Ping-Yin ; et al. | 2017-05-18 |
| Alignment systems and wafer bonding systems and methods Grant 9,646,860 - Huang , et al. May 9, 2 | 2017-05-09 |
| Self-removal anti-stiction coating for bonding process Grant 9,611,141 - Liu , et al. April 4, 2 | 2017-04-04 |
| Debonding Schemes App 20170077062 - Huang; Xin-Hua ; et al. | 2017-03-16 |
| Air Trench in Packages Incorporating Hybrid Bonding App 20170069593 - Chou; Bruce C.S. ; et al. | 2017-03-09 |
| Apparatus and method for wafer level bonding Grant 9,576,827 - Liu , et al. February 21, 2 | 2017-02-21 |
| Apparatus And Method For Verification Of Bonding Alignment App 20170047260 - Huang; Xin-Hua ; et al. | 2017-02-16 |
| Integrate Rinse Module in Hybrid Bonding Platform App 20170004964 - Huang; Xin-Hua ; et al. | 2017-01-05 |
| MEMS structures and methods for forming the same Grant 9,533,876 - Liu , et al. January 3, 2 | 2017-01-03 |
| Grinding wheel for wafer edge trimming Grant 9,527,188 - Huang , et al. December 27, 2 | 2016-12-27 |
| Wafer Bonding Process and Structure App 20160358882 - Liu; Ping-Yin ; et al. | 2016-12-08 |
| Multiple Swivel Arm Design in Hybrid Bonder App 20160351422 - Huang; Xin-Hua ; et al. | 2016-12-01 |
| Debonding schemes Grant 9,508,586 - Huang , et al. November 29, 2 | 2016-11-29 |
| Air trench in packages incorporating hybrid bonding Grant 9,502,396 - Chou , et al. November 22, 2 | 2016-11-22 |
| Apparatus and method for verification of bonding alignment Grant 9,478,471 - Huang , et al. October 25, 2 | 2016-10-25 |
| Method and Apparatus for Image Sensor Packaging App 20160307944 - Chen; Szu-Ying ; et al. | 2016-10-20 |
| Semiconductor having a high aspect ratio via Grant 9,472,504 - Hsieh , et al. October 18, 2 | 2016-10-18 |
| Biological Sensing Structures App 20160299068 - Lin; Hung-Hua ; et al. | 2016-10-13 |
| Integrate rinse module in hybrid bonding platform Grant 9,446,467 - Huang , et al. September 20, 2 | 2016-09-20 |
| Air trench in packages incorporating hybrid bonding Grant 9,443,796 - Chou , et al. September 13, 2 | 2016-09-13 |
| Wafer bonding process and structure Grant 9,425,155 - Liu , et al. August 23, 2 | 2016-08-23 |
| Self-removal Anti-stiction Coating For Bonding Process App 20160229693 - Liu; Ping-Yin ; et al. | 2016-08-11 |
| Method and apparatus for image sensor packaging Grant 9,412,725 - Chen , et al. August 9, 2 | 2016-08-09 |
| Apparatus and method for backside illuminated image sensors Grant 9,406,711 - Chen , et al. August 2, 2 | 2016-08-02 |
| Multiple swivel arm design in hybrid bonder Grant 9,385,010 - Huang , et al. July 5, 2 | 2016-07-05 |
| Biological sensing structures Grant 9,377,401 - Lin , et al. June 28, 2 | 2016-06-28 |
| Low Contamination Chamber for Surface Activation App 20160181073 - Liu; Ping-Yin ; et al. | 2016-06-23 |
| Air Trench in Packages Incorporating Hybrid Bonding App 20160163684 - Chou; Bruce C.S. ; et al. | 2016-06-09 |
| 3D Integrated Circuit and Methods of Forming the Same App 20160155665 - Kuang; Hsun-Chung ; et al. | 2016-06-02 |
| Transfer module for bowed wafers Grant 9,355,882 - Wu , et al. May 31, 2 | 2016-05-31 |
| Hermetic wafer level packaging Grant 9,337,168 - Chu , et al. May 10, 2 | 2016-05-10 |
| Hybrid bonding and apparatus for performing the same Grant 9,331,032 - Liu , et al. May 3, 2 | 2016-05-03 |
| Debonding Schemes App 20160111316 - Huang; Xin-Hua ; et al. | 2016-04-21 |
| Method Of Improving Getter Efficiency By Increasing Superficial Area App 20160101976 - Hsieh; Yuan-Chih ; et al. | 2016-04-14 |
| Low contamination chamber for surface activation Grant 9,293,303 - Liu , et al. March 22, 2 | 2016-03-22 |
| 3D integrated circuit and methods of forming the same Grant 9,257,399 - Kuang , et al. February 9, 2 | 2016-02-09 |
| Method of improving getter efficiency by increasing superficial area Grant 9,242,853 - Hsieh , et al. January 26, 2 | 2016-01-26 |
| Hybrid Bonding Mechanisms For Semiconductor Wafers App 20150357296 - LIU; Ping-Yin ; et al. | 2015-12-10 |
| Apparatus and Method for Wafer Level Bonding App 20150357226 - Liu; Ping-Yin ; et al. | 2015-12-10 |
| Semiconductor Having A High Aspect Ratio Via App 20150332968 - Hsieh; Yuan-Chih ; et al. | 2015-11-19 |
| Multiple Swivel Arm Design In Hybrid Bonder App 20150332939 - Huang; Xin-Hua ; et al. | 2015-11-19 |
| Hybrid Bonding Systems and Methods for Semiconductor Wafers App 20150287694 - Liu; Ping-Yin ; et al. | 2015-10-08 |
| MEMS Structures and Methods for Forming the Same App 20150266722 - Liu; Ping-Yin ; et al. | 2015-09-24 |
| Hybrid bonding mechanisms for semiconductor wafers Grant 9,142,517 - Liu , et al. September 22, 2 | 2015-09-22 |
| Apparatus for vertically integrated backside illuminated image sensors Grant 9,136,302 - Wang , et al. September 15, 2 | 2015-09-15 |
| Wafer Bonding Process and Structure App 20150243611 - Liu; Ping-Yin ; et al. | 2015-08-27 |
| Apparatus And Method For Verification Of Bonding Alignment App 20150233698 - Huang; Xin-Hua ; et al. | 2015-08-20 |
| Semiconductor having a high aspect ratio via Grant 9,099,476 - Hsieh , et al. August 4, 2 | 2015-08-04 |
| Micro Electromechanical System Sensor And Method Of Forming The Same App 20150175407 - CHENG; Chun-wen ; et al. | 2015-06-25 |
| MEMS structures and methods for forming the same Grant 9,054,121 - Liu , et al. June 9, 2 | 2015-06-09 |
| Transfer Module for Bowed Wafers App 20150155196 - Wu; Ming-Tung ; et al. | 2015-06-04 |
| Hybrid bonding systems and methods for semiconductor wafers Grant 9,048,283 - Liu , et al. June 2, 2 | 2015-06-02 |
| 3D Integrated Circuit and Methods of Forming the Same App 20150108644 - Kuang; Hsun-Chung ; et al. | 2015-04-23 |
| Method of Improving Getter Efficiency by Increasing Superficial Area App 20150102432 - Hsieh; Yuan-Chih ; et al. | 2015-04-16 |
| Apparatus And Method For Cleaning App 20150068552 - LIU; PING-YIN ; et al. | 2015-03-12 |
| Low Contamination Chamber for Surface Activation App 20150064810 - Liu; Ping-Yin ; et al. | 2015-03-05 |
| Alignment Systems and Wafer Bonding Systems and Methods App 20150044786 - Huang; Xin-Hua ; et al. | 2015-02-12 |
| Biological Sensing Structures App 20150044759 - LIN; Hung-Hua ; et al. | 2015-02-12 |
| Systems and methods of separating bonded wafers Grant 8,945,344 - Huang , et al. February 3, 2 | 2015-02-03 |
| Self-removal anti-stiction coating for bonding process Grant 8,905,293 - Liu , et al. December 9, 2 | 2014-12-09 |
| Biological sensing structures and methods of forming the same Grant 8,846,129 - Lin , et al. September 30, 2 | 2014-09-30 |
| Integrate Rinse Module in Hybrid Bonding Platform App 20140263586 - Huang; Xin-Hua ; et al. | 2014-09-18 |
| Air Trench in Packages Incorporating Hybrid Bonding App 20140264948 - Chou; Bruce C.S. ; et al. | 2014-09-18 |
| MEMS structures and methods for forming the same Grant 8,836,055 - Pan , et al. September 16, 2 | 2014-09-16 |
| Hybrid Bonding and Apparatus for Performing the Same App 20140256087 - Liu; Ping-Yin ; et al. | 2014-09-11 |
| Three dimensional integrated circuit structures and hybrid bonding methods for semiconductor wafers Grant 8,809,123 - Liu , et al. August 19, 2 | 2014-08-19 |
| Methods for hybrid wafer bonding Grant 8,802,538 - Liu , et al. August 12, 2 | 2014-08-12 |
| Methods of bonding caps for MEMS devices Grant 8,790,946 - Huang , et al. July 29, 2 | 2014-07-29 |
| Method and Apparatus for a Semiconductor Structure App 20140191341 - Chu; Li-Cheng ; et al. | 2014-07-10 |
| Hermetic Wafer Level Packaging App 20140154841 - Chu; Richard ; et al. | 2014-06-05 |
| Method and apparatus for selectively removing anti-stiction coating Grant 8,728,845 - Lin , et al. May 20, 2 | 2014-05-20 |
| Hybrid Bonding Mechanisms For Semiconductor Wafers App 20140117546 - LIU; Ping-Yin ; et al. | 2014-05-01 |
| Apparatus for Vertically Integrated Backside Illuminated Image Sensors App 20140113398 - Wang; Tzu-Jui ; et al. | 2014-04-24 |
| Multiple Metal Layer Semiconductor Device And Low Temperature Stacking Method Of Fabricating The Same App 20140091438 - Liu; Ping-Yin ; et al. | 2014-04-03 |
| Semiconductor Having a High Aspect Ratio Via App 20140054779 - Hsieh; Yuan-Chih ; et al. | 2014-02-27 |
| Grinding Wheel For Wafer Edge Trimming App 20140051336 - HUANG; Xin-Hua ; et al. | 2014-02-20 |
| Hermetic wafer level packaging Grant 8,648,468 - Chu , et al. February 11, 2 | 2014-02-11 |
| Wafer level packaging bond Grant 8,647,962 - Liu , et al. February 11, 2 | 2014-02-11 |
| Systems and Methods of Separating Bonded Wafers App 20140020818 - Huang; Xin-Hua ; et al. | 2014-01-23 |
| Apparatus for vertically integrated backside illuminated image sensors Grant 8,629,524 - Wang , et al. January 14, 2 | 2014-01-14 |
| Hybrid Bonding Systems and Methods for Semiconductor Wafers App 20140011324 - Liu; Ping-Yin ; et al. | 2014-01-09 |
| Apparatus and Method for Backside Illuminated Image Sensors App 20130334638 - Chen; Szu-Ying ; et al. | 2013-12-19 |
| Three Dimensional Integrated Circuit Structures and Hybrid Bonding Methods for Semiconductor Wafers App 20130320556 - Liu; Ping-Yin ; et al. | 2013-12-05 |
| Semiconductor having a high aspect ratio via Grant 8,598,687 - Hsieh , et al. December 3, 2 | 2013-12-03 |
| Method and Apparatus for Image Sensor Packaging App 20130284885 - Chen; Szu-Ying ; et al. | 2013-10-31 |
| Apparatus for Vertically Integrated Backside Illuminated Image Sensors App 20130285180 - Wang; Tzu-Jui ; et al. | 2013-10-31 |
| Biological Sensing Structures And Methods Of Forming The Same App 20130208371 - LIN; Hung-Hua ; et al. | 2013-08-15 |
| Methods of Bonding Caps for MEMS Devices App 20130203199 - Huang; Xin-Hua ; et al. | 2013-08-08 |
| Semiconductor having a high aspect ratio via Grant 8,445,380 - Hsieh , et al. May 21, 2 | 2013-05-21 |
| MEMS Structures and Methods for Forming the Same App 20130099355 - Liu; Ping-Yin ; et al. | 2013-04-25 |
| MEMS Structures and Methods for Forming the Same App 20130082338 - Pan; Lung Yuan ; et al. | 2013-04-04 |
| Handling layer for transparent substrate Grant 8,405,169 - Cheng , et al. March 26, 2 | 2013-03-26 |
| Method And Apparatus For Selectively Removing Anti-stiction Coating App 20120244677 - Lin; Shih-Wei ; et al. | 2012-09-27 |
| Semiconductor Having A High Aspect Ratio Via App 20120235300 - Hsieh; Yuan-Chih ; et al. | 2012-09-20 |
| Semiconductor Having A High Aspect Ratio Via App 20120238091 - Hsieh; Yuan-Chih ; et al. | 2012-09-20 |
| Semiconductor having a high aspect ratio via Grant 8,207,595 - Hsieh , et al. June 26, 2 | 2012-06-26 |
| Self-removal Anti-stiction Coating For Bonding Process App 20120148870 - Liu; Ping-Yin ; et al. | 2012-06-14 |
| Handling Layer For Transparent Substrate App 20120091598 - Cheng; Chun-Ren ; et al. | 2012-04-19 |
| Semiconductor Having A High Aspect Ratio Via App 20120080761 - Hsieh; Yuan-Chih ; et al. | 2012-04-05 |
| Hermetic Wafer Level Packaging App 20120025389 - Chu; Richard ; et al. | 2012-02-02 |
| Wafer Level Packaging Bond App 20110233621 - Liu; Martin ; et al. | 2011-09-29 |
| Method of forming metal-insulator-metal structure Grant 7,851,324 - Wang , et al. December 14, 2 | 2010-12-14 |
| Magnetic memory cells and manufacturing methods Grant 7,554,145 - Liu , et al. June 30, 2 | 2009-06-30 |
| Metal-insulator-metal structure and method of forming the same App 20080188055 - Wang; Yu-Jen ; et al. | 2008-08-07 |
| Magnetic memory cells and manufacturing methods App 20070096230 - Liu; Yuan-Hung ; et al. | 2007-05-03 |
| Method of forming MIM capacitor electrodes Grant 7,199,001 - Wu , et al. April 3, 2 | 2007-04-03 |
| Magnetic memory cells and manufacturing methods Grant 7,172,908 - Liu , et al. February 6, 2 | 2007-02-06 |
| DRAM capacitor structure with increased electrode support for preventing process damage and exposed electrode surface for increasing capacitor area Grant 7,161,204 - Lin , et al. January 9, 2 | 2007-01-09 |
| Magnetic Memory Cells And Manufacturing Methods App 20060183318 - Liu; Yuan-Hung ; et al. | 2006-08-17 |
| Method of forming MIM capacitor electrodes App 20050215004 - Wu, Chih-Ta ; et al. | 2005-09-29 |
| Method of forming DRAM capactiors with protected outside crown surface for more robust structures App 20050179076 - Lin, Chun-Chieh ; et al. | 2005-08-18 |
| Method of forming DRAM capacitors with protected outside crown surface for more robust structures Grant 6,875,655 - Lin , et al. April 5, 2 | 2005-04-05 |
| Method of forming dram capacitors with protected outside crown surface for more robust structures App 20040185613 - Lin, Chun-Chieh ; et al. | 2004-09-23 |
| Atomic layer deposition and plasma treatment method for forming microelectronic capacitor structure with aluminum oxide containing dual dielectric layer App 20040077142 - Chao, Lan-Lin ; et al. | 2004-04-22 |
| Method for forming a dielectric-constant-enchanced capacitor Grant 6,640,403 - Shih , et al. November 4, 2 | 2003-11-04 |
| Method of producing low thermal budget high dielectric constant structures Grant 6,620,702 - Shih , et al. September 16, 2 | 2003-09-16 |
| Method of producing low thermal budget high dielectric constant structures App 20020197818 - Shih, Wong-Cheng ; et al. | 2002-12-26 |
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