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name:-0.012896060943604
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CHAO; Chia-Chang Patent Filings

CHAO; Chia-Chang

Patent Applications and Registrations

Patent applications and USPTO patent grants for CHAO; Chia-Chang.The latest application filed is for "adjustable cervical collar".

Company Profile
0.10.11
  • CHAO; Chia-Chang - Taipei TW
  • CHAO; Chia-Chang - Taipei City TW
  • Chao-Chia; Chang - Kaohsiung TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Adjustable Cervical Collar
App 20180140455 - CHAO; Chia-Chang
2018-05-24
Linked waist support for waist belt
Grant 9,345,279 - Chao May 24, 2
2016-05-24
Linked Waist Support For Waist Belt
App 20140123370 - CHAO; Chia-Chang
2014-05-08
Tourniquet
Grant 8,439,943 - Chao May 14, 2
2013-05-14
Adjustable tourniquet
Grant 8,065,781 - Chao November 29, 2
2011-11-29
Joint brace adjustable device
Grant 7,988,652 - Chao August 2, 2
2011-08-02
Tourniquet
App 20100312271 - CHAO; Chia-Chang
2010-12-09
Fast loosed belt structure
Grant 7,743,473 - Lin , et al. June 29, 2
2010-06-29
Adjustable Tourniquet
App 20100137900 - CHAO; Chia-Chang
2010-06-03
Joint Brace Adjustable Device
App 20100130899 - CHAO; Chia-Chang
2010-05-27
Belt structure
Grant 7,712,192 - Lin , et al. May 11, 2
2010-05-11
Fast loosed belt structure
App 20080216291 - Lin; Chin-Liang ;   et al.
2008-09-11
Belt structure
App 20080216213 - Lin; Chin-Liang ;   et al.
2008-09-11
Method for manufacturing wafer level chip size package
Grant 6,521,485 - Su , et al. February 18, 2
2003-02-18
Semiconductor package for fixed surface mounting
App 20030006055 - Chien-Hung, Lai ;   et al.
2003-01-09
Method for underfilling bonding gap between flip-chip and circuit substrate
App 20020173074 - Chun-Jen, Su ;   et al.
2002-11-21
QFN semiconductor package
Grant 6,459,148 - Chun-Jen , et al. October 1, 2
2002-10-01
Method for manufacturing chip size package and its structure
App 20020094683 - Su, Spencer ;   et al.
2002-07-18
Method for manufacturing wafer level chip size package
App 20020094601 - Su, Spencer ;   et al.
2002-07-18
Stackable QFN semiconductor package
Grant 6,337,510 - Chun-Jen , et al. January 8, 2
2002-01-08

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