loadpatents
Patent applications and USPTO patent grants for CHAO; Chia-Chang.The latest application filed is for "adjustable cervical collar".
Patent | Date |
---|---|
Adjustable Cervical Collar App 20180140455 - CHAO; Chia-Chang | 2018-05-24 |
Linked waist support for waist belt Grant 9,345,279 - Chao May 24, 2 | 2016-05-24 |
Linked Waist Support For Waist Belt App 20140123370 - CHAO; Chia-Chang | 2014-05-08 |
Tourniquet Grant 8,439,943 - Chao May 14, 2 | 2013-05-14 |
Adjustable tourniquet Grant 8,065,781 - Chao November 29, 2 | 2011-11-29 |
Joint brace adjustable device Grant 7,988,652 - Chao August 2, 2 | 2011-08-02 |
Tourniquet App 20100312271 - CHAO; Chia-Chang | 2010-12-09 |
Fast loosed belt structure Grant 7,743,473 - Lin , et al. June 29, 2 | 2010-06-29 |
Adjustable Tourniquet App 20100137900 - CHAO; Chia-Chang | 2010-06-03 |
Joint Brace Adjustable Device App 20100130899 - CHAO; Chia-Chang | 2010-05-27 |
Belt structure Grant 7,712,192 - Lin , et al. May 11, 2 | 2010-05-11 |
Fast loosed belt structure App 20080216291 - Lin; Chin-Liang ;   et al. | 2008-09-11 |
Belt structure App 20080216213 - Lin; Chin-Liang ;   et al. | 2008-09-11 |
Method for manufacturing wafer level chip size package Grant 6,521,485 - Su , et al. February 18, 2 | 2003-02-18 |
Semiconductor package for fixed surface mounting App 20030006055 - Chien-Hung, Lai ;   et al. | 2003-01-09 |
Method for underfilling bonding gap between flip-chip and circuit substrate App 20020173074 - Chun-Jen, Su ;   et al. | 2002-11-21 |
QFN semiconductor package Grant 6,459,148 - Chun-Jen , et al. October 1, 2 | 2002-10-01 |
Method for manufacturing chip size package and its structure App 20020094683 - Su, Spencer ;   et al. | 2002-07-18 |
Method for manufacturing wafer level chip size package App 20020094601 - Su, Spencer ;   et al. | 2002-07-18 |
Stackable QFN semiconductor package Grant 6,337,510 - Chun-Jen , et al. January 8, 2 | 2002-01-08 |
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