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Patent applications and USPTO patent grants for Chantraine; Philippe.The latest application filed is for "method for interconnection of metal layers of the multilayer network of an electronic board, and the resultant board".
Patent | Date |
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Method for interconnection of metal layers of the multilayer network of an electronic board, and the resultant board Grant 5,464,653 - Chantraine , et al. November 7, 1 | 1995-11-07 |
Method for depositing an insulating layer on a conductive layer of a multi-layer connection board of one very large scale integrated circuit Grant 5,082,718 - Chantraine , et al. January 21, 1 | 1992-01-21 |
Method for forming a multilayered metal network for bonding components of a high-density integrated circuit using a spin on glass layer Grant 4,906,592 - Merenda , et al. March 6, 1 | 1990-03-06 |
Method for forming a multilayered metal network for bonding components of a high-density integrated circuit, and integrated circuit produced thereby Grant 4,826,786 - Merenda , et al. May 2, 1 | 1989-05-02 |
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