loadpatents
Patent applications and USPTO patent grants for Chang; Yueh-Chiung.The latest application filed is for "method for fabricating electronic package structure".
Patent | Date |
---|---|
Method For Fabricating Electronic Package Structure App 20200161756 - Shih; Chih-Yuan ;   et al. | 2020-05-21 |
Electronic package structure and fabrication method thereof Grant 10,587,041 - Shih , et al. | 2020-03-10 |
Electronic module Grant 10,115,712 - Hu , et al. October 30, 2 | 2018-10-30 |
Electronic Package Structure And Fabrication Method Thereof App 20180090835 - Shih; Chih-Yuan ;   et al. | 2018-03-29 |
Electronic Stack Structure Having Passive Elements And Method For Fabricating The Same App 20180047711 - Chiu; Chih-Hsien ;   et al. | 2018-02-15 |
Electronic Module App 20170048981 - Hu; Shao-Chueh ;   et al. | 2017-02-16 |
Fabrication method of packaging substrate Grant 9,269,677 - Chen , et al. February 23, 2 | 2016-02-23 |
Fabrication Method Of Packaging Substrate App 20150050782 - Chen; Chia-Yin ;   et al. | 2015-02-19 |
Semiconductor package, packaging substrate and fabrication method thereof Grant 8,901,729 - Chen , et al. December 2, 2 | 2014-12-02 |
Semiconductor Package, Packaging Substrate And Fabrication Method Thereof App 20130161837 - Chen; Chia-Yin ;   et al. | 2013-06-27 |
Surface-mount-enhanced lead frame and method for fabricating semiconductor package with the same App 20040238923 - Lee, Te-Haw ;   et al. | 2004-12-02 |
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