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Patent applications and USPTO patent grants for Chang; Yu-Tzu.The latest application filed is for "integrated circuit package and method".
Patent | Date |
---|---|
Method of fabricating package structure Grant 11,450,641 - Kuo , et al. September 20, 2 | 2022-09-20 |
Integrated circuit package and method Grant 11,121,106 - Kuo , et al. September 14, 2 | 2021-09-14 |
Integrated Circuit Package and Method App 20210134749 - Kuo; Hung-Jui ;   et al. | 2021-05-06 |
Method Of Fabrcating Package Structure App 20210098417 - Kuo; Hung-Jui ;   et al. | 2021-04-01 |
Coaxial Microwave Rotary Applicator For Material Processing App 20200281395 - CHAO; HSEIN-WEN ;   et al. | 2020-09-10 |
Seatpost with connecting mount and connecting mount for the same Grant 10,252,763 - Yu , et al. | 2019-04-09 |
Seatpost With Connecting Mount And Connecting Mount For The Same App 20170334498 - YU; An-Fu ;   et al. | 2017-11-23 |
Two voltage input level shifter with switches for core power off application Grant 7,800,426 - Chang September 21, 2 | 2010-09-21 |
Two Voltage Input Level Shifter with Switches for Core Power Off Application App 20090243692 - Chang; Yu-Tzu | 2009-10-01 |
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