| Patent | Date |
|---|
Electronic Device And Grounding Assembly Thereof
App 20220248528 - Chu; Chia-Hsien ; et al. | 2022-08-04 |
Transmission and distribution system with electric shock protection function and method of operating the same
Grant 11,356,012 - Liu , et al. June 7, 2 | 2022-06-07 |
Light Sensing Device Packaging Structure And Packaging Method Thereof
App 20220140172 - TSOU; WEN-CHIEH ; et al. | 2022-05-05 |
Transmission And Distribution System With Electric Shock Protection Function And Method Of Operating The Same
App 20210351690 - LIU; Chien-Hung ; et al. | 2021-11-11 |
Complex sensing device packaging structure and packaging method
Grant 11,056,607 - Tsou , et al. July 6, 2 | 2021-07-06 |
Complex Sensing Device Packaging Structure and Packaging Method
App 20200044112 - Tsou; Wen-Chieh ; et al. | 2020-02-06 |
Inverter and control method thereof
Grant 10,069,298 - Lee , et al. September 4, 2 | 2018-09-04 |
Sensor capable of detecting wide-range ambient signals and ensuring proximity sensing accuracy and method for fabricating the same
Grant 9,971,060 - Weng , et al. May 15, 2 | 2018-05-15 |
Package structure with optical barrier, optical package structure and manufacturing methods thereof
Grant 9,865,765 - Hsu , et al. January 9, 2 | 2018-01-09 |
Power supply device and high potential test method thereof
Grant 9,812,854 - Yang , et al. November 7, 2 | 2017-11-07 |
Inverter And Control Method Thereof
App 20170201096 - LEE; Wen-Chang ; et al. | 2017-07-13 |
Sensor and Method for Fabricating the Same
App 20170186886 - Weng; Huan-Hsiang ; et al. | 2017-06-29 |
Power Supply Device And High Potential Test Method Thereof
App 20160359316 - YANG; Shan-Chun ; et al. | 2016-12-08 |
Package Structure With Optical Barrier, Optical Package Structure And Manufacturing Methods Thereof
App 20160111561 - Hsu; Feng-Jung ; et al. | 2016-04-21 |
Optical Proximity Sensor And Manufacturing Method Thereof
App 20150357505 - Chang; Yi-Hua ; et al. | 2015-12-10 |
Optical Proximity Sensor And Manufacturing Method Thereof
App 20130292553 - Chang; Yi-Hua ; et al. | 2013-11-07 |
Semiconductor device for testing semiconductor process and method thereof
Grant 7,603,598 - Hong , et al. October 13, 2 | 2009-10-13 |
Semiconductor Device For Testing Semiconductor Process And Method Thereof
App 20080246502 - Hong; Chia-Nan ; et al. | 2008-10-09 |
Power supply clamp circuit
Grant 7,050,282 - Chuang , et al. May 23, 2 | 2006-05-23 |
Power Supply Clamp Circuit
App 20050013072 - Chuang, Chien-Hui ; et al. | 2005-01-20 |
Method of packaging a quad flat no-lead semiconductor and a quad flat no-lead semiconductor
App 20040178483 - Hsu, Cheng-Ho ; et al. | 2004-09-16 |
Flat lead package for a semiconductor device
App 20040130007 - Hsu, Cheng-Ho ; et al. | 2004-07-08 |
Electrostatic discharge protection circuit
Grant 6,744,610 - Chang , et al. June 1, 2 | 2004-06-01 |
Ultra thin semiconductor device
App 20040089926 - Hsu, Cheng-Ho ; et al. | 2004-05-13 |
Semiconductor packaging structure
Grant 6,703,700 - Hsu , et al. March 9, 2 | 2004-03-09 |
Semiconductor packaging structure
App 20030071332 - Hsu, Cheng-Ho ; et al. | 2003-04-17 |
Electrostatic discharge protective circuit
App 20030007298 - Chang, Hung-Yi ; et al. | 2003-01-09 |
Electrostatic discharge protection circuit layout
Grant 6,462,601 - Chang , et al. October 8, 2 | 2002-10-08 |
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