Chang; Yi-Chun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chang; Yi-Chun.The latest application filed is for "conductive capping for work function layer and method forming same".

Company Profile

5.5.9

Chang; Yi-Chun - Hsinchu TW
CHANG; Yi-Chun - Taipei City TW
CHANG; Yi-Chun - Hsinchu City TW
Chang; Yi-Chun - Taipei TW
Chang; Yi-Chun - Kinmen County TW
Chang; Yi-Chun - Chung-Li TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Conductive Capping For Work Function Layer and Method Forming Same App 20220310814 - Hsiung; Te-Chih ; et al.	2022-09-29
Building Assembly App 20220251831 - HUANG; Chian-Chi ; et al.	2022-08-11
Etch Profile Control Of Gate Contact Opening App 20220102202 - HSIUNG; Te-Chih ; et al.	2022-03-31
Etch Profile Control Of Via Opening App 20220102511 - HSIUNG; Te-Chih ; et al.	2022-03-31
Thermo-shapeable Fabrics And Articles Made Therefrom App 20210108341 - HUANG; Chian-Chi ; et al.	2021-04-15
Mobile plastic recycling system and recycling method using the same Grant 10,384,373 - Chan , et al. A	2019-08-20
Composite Laminated Article And Method For Manufacturing The Same App 20190016087 - HUANG; Chian-Chi ; et al.	2019-01-17
Mobile Plastic Recycling System And Recycling Method Using The Same App 20180290340 - CHAN; Kong-Sang Jackie ; et al.	2018-10-11
Supporting assembly and furniture comprising the same Grant 9,949,565 - Huang , et al. April 24, 2	2018-04-24
Real-time fault detection and classification system in use with a semiconductor fabrication process Grant 7,640,070 - Chang , et al. December 29, 2	2009-12-29
Real-time fault detection and classification system in use with a semiconductor fabrication process App 20080154421 - Chang; Yi-Chun ; et al.	2008-06-26
Alarm analysis methods and systems capable of multi-purpose function Grant 7,318,006 - You , et al. January 8, 2	2008-01-08
Alarm analysis methods and systems capable of multi-purpose function App 20060156967 - You; Huei-Shyang ; et al.	2006-07-20
Method for preventing corrosion of bonding pad on a surface of a semiconductor wafer Grant 6,232,238 - Chang , et al. May 15, 2	2001-05-15

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