CHANG; Yi-Chang

Patent Applications and Registrations

Patent applications and USPTO patent grants for CHANG; Yi-Chang.The latest application filed is for "miniaturized optical sensor package and manufacturing method thereof".

Company Profile

3.7.13

CHANG; Yi-Chang - Hsin-Chu County TW
CHANG; YI-CHANG - HSIN-CHU TW
CHANG; Yi-Chang - Yunlin County TW
Chang; Yi-Chang - Yuanlin TW
Chang; Yi-Chang - Hsinchu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Miniaturized Optical Sensor Package And Manufacturing Method Thereof App 20220140173 - SHEN; Chi-Chih ; et al.	2022-05-05
Optical Component Packaging Structure App 20210091238 - CHANG; YI-CHANG ; et al.	2021-03-25
Optical component packaging structure Grant 10,896,983 - Chang , et al. January 19, 2	2021-01-19
Optical Component Packaging Structure App 20190363199 - CHANG; YI-CHANG ; et al.	2019-11-28
Optical component packaging structure Grant 10,439,077 - Chang , et al. O	2019-10-08
Apparatus And Method For Removing Photoresist Layer From Alignment Mark App 20180292758 - CHAO; Yuan-Chun ; et al.	2018-10-11
Optical Component Packaging Structure App 20180269337 - CHANG; YI-CHANG ; et al.	2018-09-20
Optical component packaging structure Grant 10,002,975 - Chang , et al. June 19, 2	2018-06-19
Optical Component Packaging Structure App 20180122960 - CHANG; YI-CHANG ; et al.	2018-05-03
Sensor chip package structure and manufacturing method thereof Grant 9,741,875 - Shen , et al. August 22, 2	2017-08-22
Display Device App 20170090145 - Lin; Shiuan-Ting ; et al.	2017-03-30
Sensor Chip Package Structure And Manufacturing Method Thereof App 20170062628 - SHEN; CHI-CHIH ; et al.	2017-03-02
Front side illuminated semiconductor structure with improved light absorption efficiency Grant 9,536,914 - Huang , et al. January 3, 2	2017-01-03
Front Side Illuminated Semiconductor Structure With Improved Light Absorption Efficiency And Manufacturing Method Thereof App 20150325616 - HUANG; SEN-HUANG ; et al.	2015-11-12
Chip package with improved heat dissipation and manufacturing method thereof Grant 9,142,529 - Chang , et al. September 22, 2	2015-09-22
Chip Package And Manufacturing Method Thereof App 20140210069 - Chang; Yi-Chang ; et al.	2014-07-31
Communication Method And System Of Internet App 20090268718 - Liao; Wan-Jiun ; et al.	2009-10-29
Method For Storage Space Allocation And Data Recording On A Dvd Re-writable Disc App 20060248243 - Chang; Kun-Chang ; et al.	2006-11-02

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