Chang; Wen-Hsiung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chang; Wen-Hsiung.The latest application filed is for "semiconductor package structure and manufacturing method thereof".

Company Profile

2.29.40

Chang; Wen-Hsiung - Hsinchu County TW
Chang; Wen-Hsiung - New Taipei TW
Chang; Wen-Hsiung - Taichung TW
Chang; Wen-Hsiung - Chiayi TW
Chang; Wen-Hsiung - Hsinchu TW
CHANG; WEN-HSIUNG - Tu-Cheng TW
Chang; Wen-Hsiung - Yunlin County TW
Chang; Wen-Hsiung - Hsinchu City TW
Chang; Wen Hsiung - Yunlin Hsien TW
Chang; Wen-Hsiung - Taipei TW
Chang, Wen-Hsiung - Tainan City TW
Chang; Wen-Hsiung - Tainan TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor package and manufacturing method thereof Grant 11,309,296 - Lin , et al. April 19, 2	2022-04-19
Optoelectronic Chip Scale Package With Patterned Dam Structure App 20210098324 - Hsu; Hung-Hsin ; et al.	2021-04-01
Semiconductor Package Structure And Manufacturing Method Thereof App 20210098517 - Hsu; Hung-Hsin ; et al.	2021-04-01
Semiconductor Package And Manufacturing Method Thereof App 20200091126 - Lin; Nan-Chun ; et al.	2020-03-19
Chip package structure and manufacturing method thereof Grant 10,424,526 - Wang , et al. Sept	2019-09-24
Semiconductor Package And Manufacturing Method Thereof App 20190096866 - Hsu; Ching-Ming ; et al.	2019-03-28
Manufacturing method for metallic housing of electronic device Grant 10,124,405 - Wang , et al. November 13, 2	2018-11-13
Manufacturing method for metallic housing of electronic device Grant 10,040,120 - Wang , et al. August 7, 2	2018-08-07
Metallic Article App 20180141114 - YANG; JUN-JUN ; et al.	2018-05-24
Wafer level chip scale package having continuous through hole via configuration and fabrication method thereof Grant 9,972,554 - Fang , et al. May 15, 2	2018-05-15
Chip Package Structure And Manufacturing Method Thereof App 20180114734 - Wang; Chi-An ; et al.	2018-04-26
Metallic article and method for manufacturing metallic article Grant 9,901,979 - Yang , et al. February 27, 2	2018-02-27
Wafer Level Chip Scale Package Having Continuous Through Hole Via Configuration And Fabrication Method Thereof App 20170256471 - Fang; Li-Chih ; et al.	2017-09-07
Folding Stool App 20160309903 - HUANG; BO ; et al.	2016-10-27
Manufacturing Method For Metallic Housing Of Electronic Device App 20160263650 - WANG; CAI-HUA ; et al.	2016-09-15
Manufacturing Method For Metallic Housing Of Electronic Device App 20160207104 - WANG; CAI-HUA ; et al.	2016-07-21
Metallic housing of electronic device and manufacturing method thereof Grant 9,370,823 - Wang , et al. June 21, 2	2016-06-21
Resistive memory apparatus Grant 9,373,391 - Chen , et al. June 21, 2	2016-06-21
Metallic housing of electronic device and manufacturing method thereof Grant 9,358,606 - Wang , et al. June 7, 2	2016-06-07
Package process of backside illumination image sensor Grant 9,281,332 - Chang March 8, 2	2016-03-08
Metallic Article And Method For Manufacturing Metallic Article App 20150306661 - YANG; JUN-JUN ; et al.	2015-10-29
Semiconductor device packaging structure and packaging method Grant 9,070,672 - Chang June 30, 2	2015-06-30
Semiconductor process and structure Grant 8,946,085 - Chang February 3, 2	2015-02-03
Metallic Housing Of Electronic Device And Manufacturing Method Thereof App 20150021064 - WANG; CAI-HUA ; et al.	2015-01-22
Metallic Housing Of Electronic Device And Manufacturing Method Thereof App 20150021065 - WANG; CAI-HUA ; et al.	2015-01-22
Filter device Grant 8,747,532 - Chang , et al. June 10, 2	2014-06-10
Semiconductor structure and manufacturing method thereof Grant 8,685,860 - Chang April 1, 2	2014-04-01
Package process of backside illumination image sensor Grant 8,623,689 - Chang January 7, 2	2014-01-07
Method for manufacturing semiconductor device Grant 8,563,405 - Chang October 22, 2	2013-10-22
Semiconductor Device Packaging Structure And Packaging Method App 20130256842 - Chang; Wen-Hsiung	2013-10-03
Semiconductor device packaging structure and packaging method Grant 8,460,971 - Chang June 11, 2	2013-06-11
Semiconductor Structure And Manufacturing Method Thereof App 20130113100 - CHANG; Wen-Hsiung	2013-05-09
Package Process Of Backside Illumination Image Sensor App 20130065348 - CHANG; Wen-Hsiung	2013-03-14
Filter Device App 20130032032 - CHANG; CHUN-CHUNG ; et al.	2013-02-07
Lens driving device, flexible piece and the method for manufacturing the flexible piece Grant 8,351,138 - Kuo , et al. January 8, 2	2013-01-08
Semiconductor structure and manufacturing method thereof Grant 8,293,640 - Chang October 23, 2	2012-10-23
Package process Grant 8,258,007 - Shen , et al. September 4, 2	2012-09-04
Packaging Structure App 20120205800 - Shen; Chi-Chih ; et al.	2012-08-16
Semiconductor Package And Method For Manufacturing The Same App 20120049332 - Chen; Jen-Chuan ; et al.	2012-03-01
Stackable Semiconductor Device Packages App 20120049338 - Chen; Kuang-Hsiung ; et al.	2012-03-01
Package Process Of Backside Illumination Image Sensor App 20120009716 - CHANG; Wen-Hsiung	2012-01-12
Stackable semiconductor device packages including openings partially exposing connecting elements, conductive bumps, or conductive conductors Grant 8,076,765 - Chen , et al. December 13, 2	2011-12-13
Packaging Method Of Semiconductor Device App 20110294237 - CHANG; Wen-Hsiung	2011-12-01
Packaging Structure And Package Process App 20110285014 - Shen; Chi-Chih ; et al.	2011-11-24
Semiconductor Device Packaging Structure And Packaging Method App 20110272795 - CHANG; Wen-Hsiung	2011-11-10
Semiconductor Structure And Manufacturing Method Thereof App 20110272809 - CHANG; Wen-Hsiung	2011-11-10
Semiconductor Process And Structure App 20110272808 - CHANG; Wen-Hsiung	2011-11-10
Method For Manufacturing Semiconductor Device App 20110275194 - Chang; Wen-Hsiung	2011-11-10
Method for forming stackable semiconductor device packages including openings with conductive bumps of specified geometries Grant 8,012,797 - Shen , et al. September 6, 2	2011-09-06
Lens Displacement Device, Flexible Piece And The Manufacturing Process Thereof App 20110080661 - KUO; LI-TE ; et al.	2011-04-07
Stackable Semiconductor Device Packages App 20100171205 - CHEN; Kuang-Hsiung ; et al.	2010-07-08
Stackable Semiconductor Device Packages App 20100171207 - Shen; Chi-Chih ; et al.	2010-07-08
Computer device capable of playing DVD films without the need of executing an operating system Grant 7,260,318 - Wang , et al. August 21, 2	2007-08-21
Telecommunication notebook computer App 20070129101 - Wang; Ming-Chang ; et al.	2007-06-07
One-click video recording system and method App 20070104452 - Wang; Ming-Chang ; et al.	2007-05-10
Method of manufacturing DRAM capable of avoiding bit line leakage App 20060292775 - Hsu; Ping ; et al.	2006-12-28
Computer device capable of playing DVD films without the need of executing an operating system App 20040258401 - Wang, Ming-Chang ; et al.	2004-12-23
Computer device capable of displaying television programs without the need of executing an operating system App 20040257320 - Wang, Ming-Chang ; et al.	2004-12-23
Hair clip App 20040040569 - Chang, Wen-Hsiung	2004-03-04
Notebook computer having temperature adjustment function App 20040030936 - Wang, Ming Chang ; et al.	2004-02-12
Computer remotely controlled by remote controller App 20040030937 - Wang, Ming Chang ; et al.	2004-02-12
Hairclip with a twistable pivot App 20030196675 - Chang, Wen-Hsiung	2003-10-23
Spring fixing structure for a hairgrip Grant 5,549,127 - Chang August 27, 1	1996-08-27