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Chip package structure and manufacturing method thereof Grant 10,424,526 - Wang , et al. Sept | 2019-09-24 |
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Manufacturing method for metallic housing of electronic device Grant 10,124,405 - Wang , et al. November 13, 2 | 2018-11-13 |
Manufacturing method for metallic housing of electronic device Grant 10,040,120 - Wang , et al. August 7, 2 | 2018-08-07 |
Metallic Article App 20180141114 - YANG; JUN-JUN ;   et al. | 2018-05-24 |
Wafer level chip scale package having continuous through hole via configuration and fabrication method thereof Grant 9,972,554 - Fang , et al. May 15, 2 | 2018-05-15 |
Chip Package Structure And Manufacturing Method Thereof App 20180114734 - Wang; Chi-An ;   et al. | 2018-04-26 |
Metallic article and method for manufacturing metallic article Grant 9,901,979 - Yang , et al. February 27, 2 | 2018-02-27 |
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Folding Stool App 20160309903 - HUANG; BO ;   et al. | 2016-10-27 |
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Manufacturing Method For Metallic Housing Of Electronic Device App 20160207104 - WANG; CAI-HUA ;   et al. | 2016-07-21 |
Metallic housing of electronic device and manufacturing method thereof Grant 9,370,823 - Wang , et al. June 21, 2 | 2016-06-21 |
Resistive memory apparatus Grant 9,373,391 - Chen , et al. June 21, 2 | 2016-06-21 |
Metallic housing of electronic device and manufacturing method thereof Grant 9,358,606 - Wang , et al. June 7, 2 | 2016-06-07 |
Package process of backside illumination image sensor Grant 9,281,332 - Chang March 8, 2 | 2016-03-08 |
Metallic Article And Method For Manufacturing Metallic Article App 20150306661 - YANG; JUN-JUN ;   et al. | 2015-10-29 |
Semiconductor device packaging structure and packaging method Grant 9,070,672 - Chang June 30, 2 | 2015-06-30 |
Semiconductor process and structure Grant 8,946,085 - Chang February 3, 2 | 2015-02-03 |
Metallic Housing Of Electronic Device And Manufacturing Method Thereof App 20150021064 - WANG; CAI-HUA ;   et al. | 2015-01-22 |
Metallic Housing Of Electronic Device And Manufacturing Method Thereof App 20150021065 - WANG; CAI-HUA ;   et al. | 2015-01-22 |
Filter device Grant 8,747,532 - Chang , et al. June 10, 2 | 2014-06-10 |
Semiconductor structure and manufacturing method thereof Grant 8,685,860 - Chang April 1, 2 | 2014-04-01 |
Package process of backside illumination image sensor Grant 8,623,689 - Chang January 7, 2 | 2014-01-07 |
Method for manufacturing semiconductor device Grant 8,563,405 - Chang October 22, 2 | 2013-10-22 |
Semiconductor Device Packaging Structure And Packaging Method App 20130256842 - Chang; Wen-Hsiung | 2013-10-03 |
Semiconductor device packaging structure and packaging method Grant 8,460,971 - Chang June 11, 2 | 2013-06-11 |
Semiconductor Structure And Manufacturing Method Thereof App 20130113100 - CHANG; Wen-Hsiung | 2013-05-09 |
Package Process Of Backside Illumination Image Sensor App 20130065348 - CHANG; Wen-Hsiung | 2013-03-14 |
Filter Device App 20130032032 - CHANG; CHUN-CHUNG ;   et al. | 2013-02-07 |
Lens driving device, flexible piece and the method for manufacturing the flexible piece Grant 8,351,138 - Kuo , et al. January 8, 2 | 2013-01-08 |
Semiconductor structure and manufacturing method thereof Grant 8,293,640 - Chang October 23, 2 | 2012-10-23 |
Package process Grant 8,258,007 - Shen , et al. September 4, 2 | 2012-09-04 |
Packaging Structure App 20120205800 - Shen; Chi-Chih ;   et al. | 2012-08-16 |
Semiconductor Package And Method For Manufacturing The Same App 20120049332 - Chen; Jen-Chuan ;   et al. | 2012-03-01 |
Stackable Semiconductor Device Packages App 20120049338 - Chen; Kuang-Hsiung ;   et al. | 2012-03-01 |
Package Process Of Backside Illumination Image Sensor App 20120009716 - CHANG; Wen-Hsiung | 2012-01-12 |
Stackable semiconductor device packages including openings partially exposing connecting elements, conductive bumps, or conductive conductors Grant 8,076,765 - Chen , et al. December 13, 2 | 2011-12-13 |
Packaging Method Of Semiconductor Device App 20110294237 - CHANG; Wen-Hsiung | 2011-12-01 |
Packaging Structure And Package Process App 20110285014 - Shen; Chi-Chih ;   et al. | 2011-11-24 |
Semiconductor Device Packaging Structure And Packaging Method App 20110272795 - CHANG; Wen-Hsiung | 2011-11-10 |
Semiconductor Structure And Manufacturing Method Thereof App 20110272809 - CHANG; Wen-Hsiung | 2011-11-10 |
Semiconductor Process And Structure App 20110272808 - CHANG; Wen-Hsiung | 2011-11-10 |
Method For Manufacturing Semiconductor Device App 20110275194 - Chang; Wen-Hsiung | 2011-11-10 |
Method for forming stackable semiconductor device packages including openings with conductive bumps of specified geometries Grant 8,012,797 - Shen , et al. September 6, 2 | 2011-09-06 |
Lens Displacement Device, Flexible Piece And The Manufacturing Process Thereof App 20110080661 - KUO; LI-TE ;   et al. | 2011-04-07 |
Stackable Semiconductor Device Packages App 20100171205 - CHEN; Kuang-Hsiung ;   et al. | 2010-07-08 |
Stackable Semiconductor Device Packages App 20100171207 - Shen; Chi-Chih ;   et al. | 2010-07-08 |
Computer device capable of playing DVD films without the need of executing an operating system Grant 7,260,318 - Wang , et al. August 21, 2 | 2007-08-21 |
Telecommunication notebook computer App 20070129101 - Wang; Ming-Chang ;   et al. | 2007-06-07 |
One-click video recording system and method App 20070104452 - Wang; Ming-Chang ;   et al. | 2007-05-10 |
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Computer device capable of playing DVD films without the need of executing an operating system App 20040258401 - Wang, Ming-Chang ;   et al. | 2004-12-23 |
Computer device capable of displaying television programs without the need of executing an operating system App 20040257320 - Wang, Ming-Chang ;   et al. | 2004-12-23 |
Hair clip App 20040040569 - Chang, Wen-Hsiung | 2004-03-04 |
Notebook computer having temperature adjustment function App 20040030936 - Wang, Ming Chang ;   et al. | 2004-02-12 |
Computer remotely controlled by remote controller App 20040030937 - Wang, Ming Chang ;   et al. | 2004-02-12 |
Hairclip with a twistable pivot App 20030196675 - Chang, Wen-Hsiung | 2003-10-23 |
Spring fixing structure for a hairgrip Grant 5,549,127 - Chang August 27, 1 | 1996-08-27 |