Chang; Tien-Chang
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chang; Tien-Chang.The latest application filed is for "semiconductor package with improved reliability".
- Chang; Tien-Chang - Hsinchu City TW
- Chang; Tien-Chang - Hsinchu TW
- Chang, Tien-Chang - Taiepi Hsien TW
| Patent | Date |
|---|---|
| Semiconductor Package With Improved Reliability App 20220181228 - Chang; Tien-Chang ; et al. | 2022-06-09 |
| Semiconductor device allowing metal layer routing formed directly under metal pad Grant 9,847,294 - Chen , et al. December 19, 2 | 2017-12-19 |
| Semiconductor Device App 20170162505 - Chen; Chun-Liang ; et al. | 2017-06-08 |
| Semiconductor device allowing metal layer routing formed directly under metal pad Grant 9,627,336 - Chen , et al. April 18, 2 | 2017-04-18 |
| Semiconductor Device App 20160372431 - Chen; Chun-Liang ; et al. | 2016-12-22 |
| Semiconductor device allowing metal layer routing formed directly under metal pad Grant 9,455,226 - Chen , et al. September 27, 2 | 2016-09-27 |
| Method For Including Decoupling Capacitors Into Semiconductor Circuit Having Logic Circuit Therein And Semiconductor Circuit Thereof App 20150001675 - Chang; Tien-Chang ; et al. | 2015-01-01 |
| Semiconductor Device App 20140217601 - Chen; Chun-Liang ; et al. | 2014-08-07 |
| Integrated circuit chip with reduced IR drop Grant 8,766,417 - Tu , et al. July 1, 2 | 2014-07-01 |
| Method For Including Decoupling Capacitors Into Semiconductor Circuit Having Logic Circuit Therein And Semiconductor Circuit Thereof App 20140175608 - Chang; Tien-Chang ; et al. | 2014-06-26 |
| Semiconductor structure with multi-layer contact etch stop layer structure Grant 8,669,619 - Chang , et al. March 11, 2 | 2014-03-11 |
| Die seal ring structure Grant 8,587,090 - Chang , et al. November 19, 2 | 2013-11-19 |
| Integrated Circuit Chip With Reduced Ir Drop App 20130264681 - Tu; Chao-Chun ; et al. | 2013-10-10 |
| Integrated circuit chip with reduced IR drop Grant 8,476,745 - Tu , et al. July 2, 2 | 2013-07-02 |
| Die Seal Ring Structure App 20130026718 - Chang; Tien-Chang ; et al. | 2013-01-31 |
| Integrated circuit chip with seal ring structure Grant 8,242,586 - Chang , et al. August 14, 2 | 2012-08-14 |
| Seal ring structure for integrated circuits Grant 8,212,323 - Lee , et al. July 3, 2 | 2012-07-03 |
| Seal ring structure for integrated circuits Grant 8,188,578 - Lee , et al. May 29, 2 | 2012-05-29 |
| Semiconductor Structure With Multi-layer Contact Etch Stop Layer Structure App 20120112289 - Chang; Tien-Chang ; et al. | 2012-05-10 |
| Bond pad structure Grant 8,138,616 - Chang , et al. March 20, 2 | 2012-03-20 |
| Seal Ring Structure For Integrated Circuits App 20100295146 - Lee; Tung-Hsing ; et al. | 2010-11-25 |
| Integrated Circuit Chip With Reduced Ir Drop App 20100276805 - Tu; Chao-Chun ; et al. | 2010-11-04 |
| Integrated Circuit Chip With Seal Ring Structure App 20100102421 - Chang; Tien-Chang ; et al. | 2010-04-29 |
| Method For Including Decoupling Capacitors Into Semiconductor Circuit Having Logic Circuit Therein And Semiconductor Circuit Thereof App 20100065943 - Chang; Tien-Chang ; et al. | 2010-03-18 |
| Integrated Circuit Chip With Seal Ring Structure App 20100059867 - Chang; Tien-Chang ; et al. | 2010-03-11 |
| SiGe device with SiGe-embedded dummy pattern for alleviating micro-loading effect Grant 7,671,469 - Lee , et al. March 2, 2 | 2010-03-02 |
| Integrated circuit chip with seal ring structure Grant 7,667,302 - Chang , et al. February 23, 2 | 2010-02-23 |
| Bond Pad Structure App 20100001412 - Chang; Tien-Chang ; et al. | 2010-01-07 |
| Seal Ring Structure For Integrated Circuits App 20090294897 - Lee; Tung-Hsing ; et al. | 2009-12-03 |
| Seal Ring Structure For Integrated Circuits App 20090294929 - Lee; Tung-Hsing ; et al. | 2009-12-03 |
| Dual Contact Etch Stop Layer Process App 20090215277 - Lee; Tung-Hsing ; et al. | 2009-08-27 |
| Sige Device With Sige-embedded Dummy Pattern For Alleviating Micro-loading Effect App 20090166676 - Lee; Tung-Hsing ; et al. | 2009-07-02 |
| Interconnection Structure App 20090057907 - Yang; Ming-Tzong ; et al. | 2009-03-05 |
| Method of ion implantation App 20020109105 - Lin, Chien-Chih ; et al. | 2002-08-15 |
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