Chang; Tao-Chih
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chang; Tao-Chih.The latest application filed is for "chip package".
Company Profile
11.31.46
- Chang; Tao-Chih - Taoyuan City TW
- Chang; Tao-Chih - Taoyuan TW
- Chang; Tao-Chih - Hsinchu TW
- Chang; Tao-Chih - Taoyuan County TW
- Chang; Tao-Chih - Longtan Township Taoyuan County TW
Patent Activity
| Patent | Date |
|---|---|
| Chip Package App 20220310473 - Kao; Kuo-Shu ; et al. | 2022-09-29 |
| Chip package Grant 11,387,159 - Kao , et al. July 12, 2 | 2022-07-12 |
| Package structure and method for connecting components Grant 11,355,472 - Lin , et al. June 7, 2 | 2022-06-07 |
| Electronic device having a curved portion between a plurality of conductive portions on a substrate Grant 11,239,211 - Han , et al. February 1, 2 | 2022-02-01 |
| Chip package structure Grant 11,239,168 - Lin , et al. February 1, 2 | 2022-02-01 |
| Electronic packaging structure Grant 11,114,387 - Chang , et al. September 7, 2 | 2021-09-07 |
| Power Module App 20210210409 - Han; Wei-Kuo ; et al. | 2021-07-08 |
| Hetero-integrated structure Grant 11,004,816 - Lin , et al. May 11, 2 | 2021-05-11 |
| Package Substrate And Method Of Fabricating The Same And Chip Package Structure App 20210082810 - Chen; Yu-Hua ; et al. | 2021-03-18 |
| Electronic Device Package Structure App 20210066257 - Han; Wei-Kuo ; et al. | 2021-03-04 |
| Chip Package Structure App 20210035914 - Lin; Hsin-Han ; et al. | 2021-02-04 |
| Chip Scale Package Structures App 20210013256 - LIN; Yu-Min ; et al. | 2021-01-14 |
| Chip scale package structures Grant 10,784,297 - Lin , et al. Sept | 2020-09-22 |
| Ceramic substrate component/assembly with raised thermal metal pad, and method for fabricating the component Grant 10,743,411 - Yu , et al. A | 2020-08-11 |
| Ceramic Substrate Component/Assembly with Raised Thermal Metal Pad, and Method for Fabricating the Component App 20200245456 - Kind Code | 2020-07-30 |
| Chip Package App 20200203246 - Kao; Kuo-Shu ; et al. | 2020-06-25 |
| Semiconductor package structure Grant 10,672,677 - Chang , et al. | 2020-06-02 |
| Chip package Grant 10,622,274 - Kao , et al. | 2020-04-14 |
| Semiconductor Device And Method For Fabricating The Same App 20200083332 - Lee; Heng ; et al. | 2020-03-12 |
| Hetero-integrated Structure And Mehod Of Fabricating The Same App 20200075519 - Lin; Yu-Min ; et al. | 2020-03-05 |
| Chip package module and circuit board structure comprising the same Grant 10,490,473 - Huang , et al. Nov | 2019-11-26 |
| Chip packaging and composite system board Grant 10,490,478 - Lin , et al. Nov | 2019-11-26 |
| Package Structure And Method For Connecting Components App 20190252345 - Lin; Yu-Min ; et al. | 2019-08-15 |
| Chip Package Module And Circuit Board Structure Comprising The Same App 20190237373 - HUANG; Shin-Yi ; et al. | 2019-08-01 |
| Chip Scale Package Structures App 20190206916 - LIN; Yu-Min ; et al. | 2019-07-04 |
| Chip Package App 20190109064 - Kao; Kuo-Shu ; et al. | 2019-04-11 |
| Electronic Packaging Structure App 20180358307 - Chang; Jing-Yao ; et al. | 2018-12-13 |
| Semiconductor Package Structure App 20180261519 - CHANG; Jing-Yao ; et al. | 2018-09-13 |
| Electronic Packaging Structure App 20180233477 - Chang; Jing-Yao ; et al. | 2018-08-16 |
| Fabricating method of a semiconductor light emitting device Grant 10,037,980 - Huang , et al. July 31, 2 | 2018-07-31 |
| Package Structure For Light Emitting Device App 20180145236 - Huang; Yu-Wei ; et al. | 2018-05-24 |
| Chip Packaging And Composite System Board App 20180019178 - Lin; Yu-Min ; et al. | 2018-01-18 |
| Fabricating Method Of A Semiconductor Light Emitting Device App 20170294421 - Huang; Yu-Wei ; et al. | 2017-10-12 |
| Semiconductor light emitting device and fabricating method thereof Grant 9,721,931 - Huang , et al. August 1, 2 | 2017-08-01 |
| Signal transmission board and method for manufacturing the same Grant 9,706,656 - Hsu , et al. July 11, 2 | 2017-07-11 |
| Light-emitting device and manufacturing method of a display Grant 9,647,029 - Lo , et al. May 9, 2 | 2017-05-09 |
| Light-emitting Device And Manufacturing Method Of A Display App 20170104027 - Lo; Wei-Chung ; et al. | 2017-04-13 |
| Semiconductor Package Structure App 20170084521 - CHANG; Jing-Yao ; et al. | 2017-03-23 |
| Semiconductor Light Emitting Device And Fabricating Method Thereof App 20160211415 - Huang; Yu-Wei ; et al. | 2016-07-21 |
| Signal Transmission Board And Method For Manufacturing The Same App 20160174360 - HSU; Chien-Min ; et al. | 2016-06-16 |
| Package Structure For Light Emitting Device App 20160163940 - Huang; Yu-Wei ; et al. | 2016-06-09 |
| Solder, solder joint structure and method of forming solder joint structure Grant 9,308,603 - Kao , et al. April 12, 2 | 2016-04-12 |
| Stacked type power device module Grant 9,142,473 - Hung , et al. September 22, 2 | 2015-09-22 |
| Power module for high/low voltage insulation Grant 9,143,243 - Huang , et al. September 22, 2 | 2015-09-22 |
| Bump structure and electronic packaging solder joint structure and fabricating method thereof Grant 9,024,441 - Lin , et al. May 5, 2 | 2015-05-05 |
| Power Module For High/low Voltage Insulation App 20140374629 - Huang; Shin-Yi ; et al. | 2014-12-25 |
| Chip package structure Grant 8,866,309 - Chang , et al. October 21, 2 | 2014-10-21 |
| Stacked Type Power Device Module App 20140159212 - Hung; Yin-Po ; et al. | 2014-06-12 |
| Dual-phase intermetallic interconnection structure and method of fabricating the same Grant 8,742,600 - Chang , et al. June 3, 2 | 2014-06-03 |
| Solder, Solder Joint Structure And Method Of Forming Solder Joint Structure App 20140134459 - Kao; Kuo-Shu ; et al. | 2014-05-15 |
| Dual-phase Intermetallic Interconnection Structure And Method Of Fabricating The Same App 20140097534 - Chang; Jing-Yao ; et al. | 2014-04-10 |
| Electronic device package structure with a hydrophilic protection layer and method for fabricating the same Grant 8,598,686 - Chang , et al. December 3, 2 | 2013-12-03 |
| Micro-bump structure Grant 8,575,754 - Tsai , et al. November 5, 2 | 2013-11-05 |
| Package unit and stacking structure thereof Grant 8,502,378 - Hung , et al. August 6, 2 | 2013-08-06 |
| Chip Package Structure App 20130168798 - Chang; Jing-Yao ; et al. | 2013-07-04 |
| Bump Structure And Electronic Packaging Solder Joint Structure And Fabricating Method Thereof App 20130168851 - Lin; Yu-Min ; et al. | 2013-07-04 |
| Chip Package Process And Chip Package Structure App 20130043599 - Huang; Yu-Wei ; et al. | 2013-02-21 |
| Package Carrier App 20120125669 - Tsai; Tsung-Fu ; et al. | 2012-05-24 |
| Package Unit And Stacking Structure Thereof App 20120091581 - Hung; Yin-Po ; et al. | 2012-04-19 |
| Package carrier Grant 8,130,509 - Tsai , et al. March 6, 2 | 2012-03-06 |
| Semiconductor Device Module Package Structure And Series Connection Method Thereof App 20120048355 - Hsieh; Hsin-Hsin ; et al. | 2012-03-01 |
| Chip structure and stacked structure of chips Grant 8,093,718 - Chang January 10, 2 | 2012-01-10 |
| Electronic Device Package Structure And Method For Fabricating The Same App 20110227190 - Chang; Tao-Chih ; et al. | 2011-09-22 |
| Micro-bump Structure App 20110156253 - Tsai; Tsung-Fu ; et al. | 2011-06-30 |
| Chip Package Structure App 20100207266 - Chang; Tao-Chih ; et al. | 2010-08-19 |
| Package Carrier App 20100163292 - Tsai; Tsung-Fu ; et al. | 2010-07-01 |
| Artificial Optic Nerve Network Module, Artificial Retina Chip Module, And Method For Fabricating The Same App 20090210055 - Chang; Tao-Chih ; et al. | 2009-08-20 |
| Chip Structure And Fabrication Process Thereof And Flip Chip Package Structure And Fabrication Process Thereof App 20090152741 - Chang; Tao-Chih ; et al. | 2009-06-18 |
| Chip Structure And Process Thereof And Stacked Structure Of Chips And Process Thereof App 20090121348 - Chang; Tao-Chih | 2009-05-14 |
| Method And Device For Enhancing Solderability App 20090050470 - Chang; Tao-Chih ; et al. | 2009-02-26 |
| Method And Device For Enhancing Solderability App 20070036952 - Chang; Tao-Chih ; et al. | 2007-02-15 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 