Chang; Tae Eun
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chang; Tae Eun.The latest application filed is for "prepreg, copper clad laminate, and printed circuit board".
- Chang; Tae Eun - Gyunggi-do KR
- Chang; Tae Eun - Suwon KR
- CHANG; Tae-Eun - Gyeonggi-do KR
- Chang; Tae-Eun - Suwon-si KR
| Patent | Date |
|---|---|
| Prepreg, Copper Clad Laminate, And Printed Circuit Board App 20140060899 - Park; Jung Hwan ; et al. | 2014-03-06 |
| Carrier For Manufacturing Printed Circuit Board And Method For Manufacturing The Carrier App 20130199035 - Kim; Kwang Yune ; et al. | 2013-08-08 |
| Method For Manufacturing Multilayer Circuit Board App 20120174394 - CHANG; Tae-Eun ; et al. | 2012-07-12 |
| Method Of Manufacturing Printed Circuit Board App 20120152753 - LEE; Suk Won ; et al. | 2012-06-21 |
| Carrier For Manufacturing Printed Circuit Board And Method Of Manufacturing The Same And Method Of Manufacturing Printed Circuit Board Using The Same App 20110138615 - Sohn; Keung Jin ; et al. | 2011-06-16 |
| Package substrate including solder resist layer having pattern parts and method of fabricating the same App 20100132982 - Cho; Seung Hyun ; et al. | 2010-06-03 |
| Conductive Paste Including A Carbon Nanotube And Printed Circuit Board Using The Same App 20090294739 - Lee; Eung-Suek ; et al. | 2009-12-03 |
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