| Patent | Date |
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Contact structure and forming method thereof and connecting structure thereof
Grant 8,215,969 - Yang , et al. July 10, 2 | 2012-07-10 |
Method of fabricating bonding structure
Grant 8,211,788 - Chang , et al. July 3, 2 | 2012-07-03 |
Contact Structure Having A Compliant Bump And A Testing Area And Manufacturing Method For The Same
App 20110230044 - Chang; Shyh-Ming ; et al. | 2011-09-22 |
Bonding structure with buffer layer and method of forming the same
Grant 7,988,808 - Lu , et al. August 2, 2 | 2011-08-02 |
Contact structure having a compliant bump and a testing area
Grant 7,977,788 - Chang , et al. July 12, 2 | 2011-07-12 |
Manufacturing method of contact structure
Grant 7,871,918 - Chang January 18, 2 | 2011-01-18 |
Contact structure having a compliant bump and a test pad
Grant 7,834,453 - Chang November 16, 2 | 2010-11-16 |
Structure for protecting electronic packaging contacts from stress
Grant 7,732,928 - Chang , et al. June 8, 2 | 2010-06-08 |
Method Of Fabricating Bonding Structure
App 20090253233 - Chang; Shyh-Ming ; et al. | 2009-10-08 |
Contact Structure And Forming Method Thereof And Connecting Structure Thereof
App 20090246988 - Yang; Sheng-Shu ; et al. | 2009-10-01 |
Contact Structure And Connecting Structure
App 20090243093 - Chang; Shyh-Ming | 2009-10-01 |
Bonding structure
Grant 7,576,430 - Chang , et al. August 18, 2 | 2009-08-18 |
Manufacturing Method Of Contact Structure
App 20090149015 - Chang; Shyh-Ming | 2009-06-11 |
Package structure for electronic device
Grant 7,531,900 - Lin , et al. May 12, 2 | 2009-05-12 |
Bonding Structure With Buffer Layer And Method Of Forming The Same
App 20080305624 - Lu; Su-Tsai ; et al. | 2008-12-11 |
Bonding structure with buffer layer and method of forming the same
Grant 7,459,055 - Lu , et al. December 2, 2 | 2008-12-02 |
Bump Structure
App 20080284011 - Chang; Shyh-Ming ; et al. | 2008-11-20 |
Bond quality indication by bump structure on substrate
Grant 7,449,716 - Chen , et al. November 11, 2 | 2008-11-11 |
Bonding structure with buffer layer and method of forming the same
Grant 7,446,421 - Lu , et al. November 4, 2 | 2008-11-04 |
Compliant Bump Structure And Bonding Structure
App 20080237850 - Chang; Shyh-Ming | 2008-10-02 |
Bump Structure On Substrate
App 20080197352 - Chen; Ming-Yao ; et al. | 2008-08-21 |
Composite bump
Grant 7,378,746 - Lin , et al. May 27, 2 | 2008-05-27 |
Bonding Structure And Method Of Fabricating The Same
App 20080099916 - Chang; Shyh-Ming ; et al. | 2008-05-01 |
Method for fabricating conductive bumps with non-conductive juxtaposed sidewalls
Grant 7,348,271 - Huang , et al. March 25, 2 | 2008-03-25 |
Contact structure having a compliant bump and a testing area and manufacturing method for the same
App 20080023830 - Chang; Shyh-Ming ; et al. | 2008-01-31 |
Contact Structure And Manufacturing Method Thereof
App 20080023832 - Chang; Shyh-Ming | 2008-01-31 |
Method for bonding IC chips to substrates incorporating dummy bumps and non-conductive adhesive
Grant 7,300,865 - Hsieh , et al. November 27, 2 | 2007-11-27 |
Package Structure For Electronic Device
App 20070210429 - Lin; Ji-Cheng ; et al. | 2007-09-13 |
Composite Bump
App 20070210457 - Lin; Ji-Cheng ; et al. | 2007-09-13 |
Bonding Structure With Buffer Layer And Method Of Forming The Same
App 20070122635 - Lu; Su-Tsai ; et al. | 2007-05-31 |
Method for fabricating conductive bumps with non-conductive juxtaposed sidewalls
App 20070111382 - Huang; Yuan-Chang ; et al. | 2007-05-17 |
Protecting structure and manufacturing method for electronic packaging contacts
App 20070096279 - Chang; Shyh-Ming ; et al. | 2007-05-03 |
Bonding Structure With Buffer Layer And Method Of Forming The Same
App 20070056163 - Lu; Su-Tsai ; et al. | 2007-03-15 |
Bonding structure with buffer layer and method of forming the same
Grant 7,183,494 - Lu , et al. February 27, 2 | 2007-02-27 |
Conductive bumps with non-conductive juxtaposed sidewalls
Grant 7,154,176 - Huang , et al. December 26, 2 | 2006-12-26 |
Bonding structure with compliant bumps
Grant 6,972,490 - Chang , et al. December 6, 2 | 2005-12-06 |
Method for bonding IC chips to substrates incorporating dummy bumps and non-conductive adhesive
App 20050250303 - Hsieh, Yu-Te ; et al. | 2005-11-10 |
Method for bonding IC chips to substrates incorporating dummy bumps and non-conductive adhesive and structures formed
Grant 6,919,642 - Hsieh , et al. July 19, 2 | 2005-07-19 |
Bonding structure with buffer layer and method of forming the same
App 20050112340 - Lu, Su-Tsai ; et al. | 2005-05-26 |
Conductive bumps with non-conductive juxtaposed sidewalls and method for fabricating
App 20050104223 - Huang, Yuan-Chang ; et al. | 2005-05-19 |
Bonding structure with compliant bumps
App 20050098901 - Chang, Shyh-Ming ; et al. | 2005-05-12 |
Method for forming electrically conductive bumps and devices formed
Grant 6,767,818 - Chang , et al. July 27, 2 | 2004-07-27 |
Method for bonding IC chips to substrates incorporating dummy bumps and non-conductive adhesive and structures formed
App 20040004292 - Hsieh, Yu-Te ; et al. | 2004-01-08 |
Method for bonding IC chips to substrates with non-conductive adhesive
Grant 6,605,491 - Hsieh , et al. August 12, 2 | 2003-08-12 |
Method for bonding IC chips having multi-layered bumps with corrugated surfaces and devices formed
Grant 6,537,854 - Chang , et al. March 25, 2 | 2003-03-25 |
Composite bump bonding
App 20020070463 - Chang, Shyh-Ming ; et al. | 2002-06-13 |
Composite bump bonding
Grant 6,365,500 - Chang , et al. April 2, 2 | 2002-04-02 |
Composite bump flip chip bonding
Grant 6,249,051 - Chang , et al. June 19, 2 | 2001-06-19 |
Composite bump structures
Grant 6,084,301 - Chang , et al. July 4, 2 | 2000-07-04 |
Method for tape automated bonding to composite bumps
Grant 6,024,274 - Chang , et al. February 15, 2 | 2000-02-15 |
Composite bump tape automated bonding method and bonded structure
Grant 5,749,997 - Tang , et al. May 12, 1 | 1998-05-12 |
Composite bump structure and methods of fabrication
Grant 5,707,902 - Chang , et al. January 13, 1 | 1998-01-13 |
Connection construction and method of manufacturing the same
Grant 5,578,527 - Chang , et al. November 26, 1 | 1996-11-26 |
Composite bump flip chip bonding
Grant 5,431,328 - Chang , et al. July 11, 1 | 1995-07-11 |
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