CHANG; Shu-Ming
Patent Applications and Registrations
Patent applications and USPTO patent grants for CHANG; Shu-Ming.The latest application filed is for "chip package and method for forming the same".
Company Profile
6.111.117
- CHANG; Shu-Ming - New Taipei City TW
- Chang; Shu-Ming - New Taipei TW
- Chang; Shu Ming - Taipei TW
- CHANG; Shu-Ming - Taoyuan TW
- CHANG; SHU MING - Taipei City TW
- Chang; Shu-Ming - Taoyuan County TW
- Chang; Shu-Ming - Tucheng Dist TW
- Chang; Shu-Ming - Jhongli TW
- Chang; Shu-Ming - Tucheng TW
- CHANG; Shu-Ming - Tucheng City TW
- Chang; Shu-Ming - Nantou N/A TW
- Chang; Shu-Ming - Taipei County N/A TW
- Chang; Shu-Ming - Jhongli City TW
- Chang; Shu-Ming - US
- Chang; Shu-Ming - Tainan County TW
- Chang; Shu-Ming - Sinjhuang JP
- Chang; Shu-Ming - Hsinchu TW
- Chang; Shu-Ming - Hsin Chu Hsien TW
- CHANG; SHU-MING - YANGMEI TOWN TW
- Chang; Shu Ming - Tai Pei TW
- Chang; Shu-Ming - Tainan TW
- Chang; Shu-Ming - Sinjhuang City TW
- Chang; Shu-Ming - Hsinhua TW
- Chang; Shu Ming - Tai Pei City TW
- Chang; Shu-Ming - Taichung City TW
Patent Activity
| Patent | Date |
|---|---|
| Chip Package And Method For Forming The Same App 20220285423 - LIU; Tsang-Yu ; et al. | 2022-09-08 |
| Chip Package And Manufacturing Method Thereof App 20220219970 - LIU; Tsang-Yu ; et al. | 2022-07-14 |
| Chip package and manufacturing method thereof Grant 11,319,208 - Liu , et al. May 3, 2 | 2022-05-03 |
| Method for detecting SNP site on SMA gene Grant 11,312,995 - Chang , et al. April 26, 2 | 2022-04-26 |
| Printed Circuit Board Mesh Routing To Reduce Solder Ball Joint Failure During Reflow App 20210410277 - RODRIGUEZ; Benito Joseph ; et al. | 2021-12-30 |
| Printed circuit board mesh routing to reduce solder ball joint failure during reflow Grant 11,212,912 - Rodriguez , et al. December 28, 2 | 2021-12-28 |
| Chip package and manufacturing method thereof Grant 11,164,853 - Cheng , et al. November 2, 2 | 2021-11-02 |
| Chip Package App 20210210436 - CHENG; Chia-Ming ; et al. | 2021-07-08 |
| Chip Package And Manufacturing Method Thereof App 20210210445 - CHENG; Chia-Ming ; et al. | 2021-07-08 |
| Chip package and method for forming the same Grant 10,950,738 - Chang , et al. March 16, 2 | 2021-03-16 |
| Chip Package And Manufacturing Method Thereof App 20210032096 - LIU; Tsang-Yu ; et al. | 2021-02-04 |
| Chip Package And Method For Forming The Same App 20200044099 - CHANG; Shu-Ming ; et al. | 2020-02-06 |
| Method For Detecting Snp Site On Sma Gene App 20190360046 - CHANG; HUNG MING ; et al. | 2019-11-28 |
| Chip package and method for forming the same Grant 10,446,504 - Cheng , et al. Oc | 2019-10-15 |
| Touch panel-sensing chip package module complex and a manufacturing method thereof Grant 10,318,784 - Chang , et al. | 2019-06-11 |
| Chip scale sensing chip package and a manufacturing method thereof Grant 10,152,180 - Chang , et al. Dec | 2018-12-11 |
| Chip Package And Method For Forming The Same App 20180337142 - CHENG; Chia-Ming ; et al. | 2018-11-22 |
| Methods For Working Collaboratively And Systems Using The Same App 20180337988 - CHANG; Shu-Ming | 2018-11-22 |
| Chip package and fabrication method thereof Grant 10,049,252 - Ho , et al. August 14, 2 | 2018-08-14 |
| Chip package and manufacturing method thereof Grant 9,947,716 - Ho , et al. April 17, 2 | 2018-04-17 |
| Chip package and method for fabricating the same Grant 9,881,889 - Huang , et al. January 30, 2 | 2018-01-30 |
| Chip package and manufacturing method thereof Grant 9,793,234 - Ho , et al. October 17, 2 | 2017-10-17 |
| Sensing module and method for forming the same Grant 9,711,425 - Chang , et al. July 18, 2 | 2017-07-18 |
| Chip Package And Manufacturing Method Thereof App 20170148844 - HO; Yen-Shih ; et al. | 2017-05-25 |
| Chip package and method for forming the same Grant 9,640,488 - Lin , et al. May 2, 2 | 2017-05-02 |
| Chip package including recess in side edge Grant 9,601,460 - Ho , et al. March 21, 2 | 2017-03-21 |
| Sensing Module And Method For Forming The Same App 20170053848 - CHANG; Shu-Ming ; et al. | 2017-02-23 |
| Chip package and method for forming the same Grant 9,570,398 - Chang , et al. February 14, 2 | 2017-02-14 |
| Chip package and manufacturing method thereof Grant 9,548,265 - Ho , et al. January 17, 2 | 2017-01-17 |
| Touch Panel-sensing Chip Package Module Complex And A Manufacturing Method Thereof App 20160379040 - CHANG; Shu-Ming ; et al. | 2016-12-29 |
| Semiconductor Electroplating System App 20160315048 - HO; Yen-Shih ; et al. | 2016-10-27 |
| Chip Package And Manufacturing Method Thereof App 20160315043 - HO; Yen-Shih ; et al. | 2016-10-27 |
| Chip Package And Manufacturing Method Thereof App 20160315061 - HO; Yen-Shih ; et al. | 2016-10-27 |
| Chip Scale Sensing Chip Package And A Manufacturing Method Thereof App 20160266680 - CHANG; Shu-Ming ; et al. | 2016-09-15 |
| Chip package and method for forming the same Grant 9,437,478 - Ho , et al. September 6, 2 | 2016-09-06 |
| Chip package Grant 9,425,134 - Ho , et al. August 23, 2 | 2016-08-23 |
| Chip Scale Sensing Chip Package And A Manufacturing Method Thereof App 20160239699 - CHANG; Shu-Ming ; et al. | 2016-08-18 |
| Chip Package And Manufacturing Method Thereof App 20160240520 - Ho; Yen-Shih ; et al. | 2016-08-18 |
| Manufacturing method of semiconductor structure with protein tape Grant 9,419,050 - Ho , et al. August 16, 2 | 2016-08-16 |
| Chip package and method of manufacturing the same Grant 9,406,818 - Liu , et al. August 2, 2 | 2016-08-02 |
| Chip package and method thereof Grant 9,373,597 - Ho , et al. June 21, 2 | 2016-06-21 |
| Chip Package And Fabrication Method Thereof App 20160171273 - HO; Yen-Shih ; et al. | 2016-06-16 |
| Chip package and method for forming the same Grant 9,355,975 - Ho , et al. May 31, 2 | 2016-05-31 |
| Chip Package And Method For Forming The Same App 20160141254 - LIN; Yi-Min ; et al. | 2016-05-19 |
| Chip package and method for forming the same Grant 9,334,158 - Huang , et al. May 10, 2 | 2016-05-10 |
| IC wafer having electromagnetic shielding effects and method for making the same Grant 9,331,024 - Chen , et al. May 3, 2 | 2016-05-03 |
| Chip Package And Method Of Manufacturing The Same App 20160111555 - LIU; Tsang-Yu ; et al. | 2016-04-21 |
| Chip package and method for forming the same Grant 9,305,843 - Chen , et al. April 5, 2 | 2016-04-05 |
| Semiconductor chip package and method for manufacturing thereof Grant 9,287,417 - Suen , et al. March 15, 2 | 2016-03-15 |
| Chip package and method for forming the same Grant 9,275,958 - Lin , et al. March 1, 2 | 2016-03-01 |
| Semiconductor structure having stage difference surface and manufacturing method thereof Grant 9,275,963 - Tsai , et al. March 1, 2 | 2016-03-01 |
| Capacitive touch panel with electrode pairs Grant 9,268,443 - Chang , et al. February 23, 2 | 2016-02-23 |
| Chip package and method of manufacturing the same Grant 9,269,837 - Liu , et al. February 23, 2 | 2016-02-23 |
| Manufacturing Method Of Semiconductor Structure App 20150340403 - HO; Yen-Shih ; et al. | 2015-11-26 |
| Chip Package And Method Of Manufacturing The Same App 20150295097 - LIU; Tsang-Yu ; et al. | 2015-10-15 |
| Chip Package And Method Thereof App 20150270236 - HO; Yen-Shih ; et al. | 2015-09-24 |
| Chip Package And Method For Forming The Same App 20150228536 - HO; Yen-Shih ; et al. | 2015-08-13 |
| Chip package and manufacturing method thereof Grant 9,093,450 - Perng , et al. July 28, 2 | 2015-07-28 |
| Semiconductor Device And Manufacturing Method Thereof App 20150206916 - LEE; Po-Han ; et al. | 2015-07-23 |
| Chip Package And Method For Forming The Same App 20150162245 - CHEN; Bing-Siang ; et al. | 2015-06-11 |
| Chip package structure and manufacturing method thereof Grant 9,054,114 - Lee , et al. June 9, 2 | 2015-06-09 |
| Chip package and method for forming the same Grant 9,006,896 - Huang , et al. April 14, 2 | 2015-04-14 |
| Stacked chip package and method for forming the same Grant 8,963,312 - Ho , et al. February 24, 2 | 2015-02-24 |
| Semiconductor package and fabrication method thereof Grant 8,928,098 - Lee , et al. January 6, 2 | 2015-01-06 |
| Chip package and method for forming the same Grant 8,900,924 - Chang , et al. December 2, 2 | 2014-12-02 |
| Chip Package App 20140332968 - HO; Yen-Shih ; et al. | 2014-11-13 |
| Chip Package And Method For Forming The Same App 20140332908 - HO; Yen-Shih ; et al. | 2014-11-13 |
| Stacked Chip Package And Method For Forming The Same App 20140332983 - HO; Yen-Shih ; et al. | 2014-11-13 |
| Chip Package And Method For Forming The Same App 20140332969 - HO; Yen-Shih ; et al. | 2014-11-13 |
| Chip Package And Method For Fabricating The Same App 20140306343 - HUANG; Yu-Lung ; et al. | 2014-10-16 |
| Electronic device package Grant 8,860,217 - Chen , et al. October 14, 2 | 2014-10-14 |
| Electronic Device Package App 20140284792 - CHEN; Wei-Ming ; et al. | 2014-09-25 |
| Chip Package And Method For Forming The Same App 20140264785 - LIN; Yi-Min ; et al. | 2014-09-18 |
| Chip Package Structure And Manufacturing Method Thereof App 20140264771 - LEE; Hung-Jen ; et al. | 2014-09-18 |
| Semiconductor Structure And Manufacturing Method Thereof App 20140252659 - TSAI; Yung-Tai ; et al. | 2014-09-11 |
| Semiconductor Chip Package And Method For Manufacturing Thereof App 20140203387 - SUEN; Wei-Luen ; et al. | 2014-07-24 |
| Chip package structure and manufacturing method thereof Grant 8,779,558 - Lee , et al. July 15, 2 | 2014-07-15 |
| Electronic device package and fabrication method thereof Grant 8,778,798 - Chang , et al. July 15, 2 | 2014-07-15 |
| Electronic Device Package And Fabrication Method Thereof App 20140193950 - CHANG; Shu-Ming ; et al. | 2014-07-10 |
| Electronic device package Grant 8,772,932 - Chen , et al. July 8, 2 | 2014-07-08 |
| Power MOSFET package Grant 8,766,431 - Perng , et al. July 1, 2 | 2014-07-01 |
| Touch Panel App 20140158513 - Chang; Shu-Ming ; et al. | 2014-06-12 |
| Chip Package And Method For Forming The Same App 20140154840 - CHANG; Shu-Ming ; et al. | 2014-06-05 |
| Method for fabricating electronic device package Grant 8,728,871 - Chen , et al. May 20, 2 | 2014-05-20 |
| Electronic device package and fabrication method thereof Grant 8,710,680 - Chang , et al. April 29, 2 | 2014-04-29 |
| Ic Wafer Having Electromagnetic Shielding Effects And Method For Making The Same App 20140091441 - CHEN; Yao-Hsiang ; et al. | 2014-04-03 |
| Chip package structure and manufacturing method thereof Grant 8,673,686 - Lee , et al. March 18, 2 | 2014-03-18 |
| Chip package and method for forming the same Grant 8,674,518 - Chang , et al. March 18, 2 | 2014-03-18 |
| Chip Package And Manufacturing Method Thereof App 20140073089 - PERNG; Baw-Ching ; et al. | 2014-03-13 |
| Chip package and method for forming the same Grant 8,643,070 - Chang , et al. February 4, 2 | 2014-02-04 |
| Electronic device package and method for forming the same Grant 8,643,198 - Chien , et al. February 4, 2 | 2014-02-04 |
| Chip package and fabrication method thereof Grant 8,633,582 - Chang , et al. January 21, 2 | 2014-01-21 |
| IC wafer having electromagnetic shielding effects and method for making the same Grant 8,624,362 - Chen , et al. January 7, 2 | 2014-01-07 |
| Package structure and method for making the same Grant 8,624,351 - Liu , et al. January 7, 2 | 2014-01-07 |
| Chip package and method for forming the same Grant 8,614,488 - Wen , et al. December 24, 2 | 2013-12-24 |
| Chip package and manufacturing method thereof Grant 8,610,271 - Perng , et al. December 17, 2 | 2013-12-17 |
| Chip Package And Method For Forming The Same App 20130320559 - HUANG; Yu-Ting ; et al. | 2013-12-05 |
| Chip Package And Method For Forming The Same App 20130307161 - CHANG; Shu-Ming ; et al. | 2013-11-21 |
| Chip Package And Method For Forming The Same App 20130292825 - HUANG; Yu-Lung ; et al. | 2013-11-07 |
| Safety syringe with retractable rotation Grant 8,562,561 - Chang October 22, 2 | 2013-10-22 |
| Chip package and method for forming the same Grant 8,564,133 - Wen , et al. October 22, 2 | 2013-10-22 |
| Electronic device package and method for forming the same Grant 8,552,547 - Chien , et al. October 8, 2 | 2013-10-08 |
| Electronic device package and method for fabricating the same Grant 8,541,877 - Tsai , et al. September 24, 2 | 2013-09-24 |
| Image sensor package and fabrication method thereof Grant 8,536,672 - Chang , et al. September 17, 2 | 2013-09-17 |
| Package structure of three-dimensional stacking dice and method for manufacturing the same Grant 8,531,009 - Lin , et al. September 10, 2 | 2013-09-10 |
| Chip Package Structure And Manufacturing Method Thereof App 20130207240 - LEE; Hung-Jen ; et al. | 2013-08-15 |
| Power Mosfet Package App 20130193520 - PERNG; Baw-Ching ; et al. | 2013-08-01 |
| Semiconductor Package And Fabrication Method Thereof App 20130168784 - Lee; Hung-Jen ; et al. | 2013-07-04 |
| Electronic Device Package And Method For Forming The Same App 20130127022 - CHIEN; Wen-Cheng ; et al. | 2013-05-23 |
| Electronic Device Package And Method For Forming The Same App 20130126086 - CHIEN; Wen-Cheng ; et al. | 2013-05-23 |
| Power MOSFET package Grant 8,410,599 - Perng , et al. April 2, 2 | 2013-04-02 |
| Chip package structure and manufacturing method thereof Grant 8,409,925 - Lee , et al. April 2, 2 | 2013-04-02 |
| Electronic Device Package App 20130062759 - CHEN; Wei-Ming ; et al. | 2013-03-14 |
| Method For Fabricating Electronic Device Package App 20130045571 - CHEN; Wei-Ming ; et al. | 2013-02-21 |
| Electronic device package and method for forming the same Grant 8,367,477 - Chien , et al. February 5, 2 | 2013-02-05 |
| Chip Package Structure And Manufacturing Method Thereof App 20120313222 - LEE; Hung-Jen ; et al. | 2012-12-13 |
| Chip Package Structure And Manufacturing Method Thereof App 20120313261 - LEE; Hung-Jen ; et al. | 2012-12-13 |
| Electronic device package and fabrication method thereof Grant 8,310,050 - Chen , et al. November 13, 2 | 2012-11-13 |
| Chip Package And Method For Forming The Same App 20120267780 - CHEN; Bing-Siang ; et al. | 2012-10-25 |
| Ic Wafer Having Electromagnetic Shielding Effects And Method For Making The Same App 20120241923 - CHEN; Yao-Hsiang ; et al. | 2012-09-27 |
| Safety Syringe With Retractable Rotation App 20120226241 - Chang; Shu-Ming | 2012-09-06 |
| Chip package and fabrication method thereof Grant 8,227,927 - Chen , et al. July 24, 2 | 2012-07-24 |
| Chip Package And Method For Forming The Same App 20120168939 - CHANG; Shu-Ming ; et al. | 2012-07-05 |
| Chip Package And Manufacturing Method Thereof App 20120146111 - CHANG; Shu-Ming ; et al. | 2012-06-14 |
| Chip Package And Method For Forming The Same App 20120146108 - CHANG; Shu-Ming ; et al. | 2012-06-14 |
| Chip Package And Method For Forming The Same App 20120146153 - WEN; Ying-Nan ; et al. | 2012-06-14 |
| Three-dimensional conducting structure and method of fabricating the same Grant 8,193,632 - Chang , et al. June 5, 2 | 2012-06-05 |
| LCD power supply Grant 8,164,587 - Chang , et al. April 24, 2 | 2012-04-24 |
| Fluorescent lamp driver circuit Grant 8,115,406 - Wang , et al. February 14, 2 | 2012-02-14 |
| Package Structure And Method For Making The Same App 20110291228 - Liu; Chien-Hung ; et al. | 2011-12-01 |
| Wafer level chip scale packaging structure and method of fabricating the same Grant 8,039,935 - Chang , et al. October 18, 2 | 2011-10-18 |
| Disposable safety syringe Grant 8,034,025 - Chang October 11, 2 | 2011-10-11 |
| Inverter circuit of driving a lamp and backlight module using the same Grant 8,035,608 - Bai , et al. October 11, 2 | 2011-10-11 |
| Electronic Device Package And Fabrication Method Thereof App 20110233782 - CHANG; Shu-Ming ; et al. | 2011-09-29 |
| Image Sensor Package And Fabrication Method Thereof App 20110227186 - Chang; Shu-Ming ; et al. | 2011-09-22 |
| Electronic Device Package And Fabrication Method Thereof App 20110193225 - CHEN; Wei-Ming ; et al. | 2011-08-11 |
| Bonding structure with buffer layer and method of forming the same Grant 7,988,808 - Lu , et al. August 2, 2 | 2011-08-02 |
| Electronic Device Package And Method For Fabricating The Same App 20110140267 - TSAI; Chia-Lun ; et al. | 2011-06-16 |
| Capacitor device and method for manufacturing the same Grant 7,960,773 - Chang , et al. June 14, 2 | 2011-06-14 |
| Disposable safety syringe with retractable needle Grant 7,955,300 - Chang June 7, 2 | 2011-06-07 |
| Chip Package And Manufacturing Method Thereof App 20110127670 - PERNG; Baw-Ching ; et al. | 2011-06-02 |
| Wafer-to-wafer stacking Grant 7,948,072 - Tain , et al. May 24, 2 | 2011-05-24 |
| Chip Package And Fabrication Method Thereof App 20110084382 - Chen; Wei-Ming ; et al. | 2011-04-14 |
| Three-dimensional die-stacking package structure Grant 7,902,674 - Chang , et al. March 8, 2 | 2011-03-08 |
| Chip Package And Fabrication Method Thereof App 20110042796 - CHANG; Shu-Ming ; et al. | 2011-02-24 |
| Chip Package And Method For Forming The Same App 20110042819 - WEN; Ying-Nan ; et al. | 2011-02-24 |
| Display Panel And Driving Method Thereof App 20110007062 - CHANG; SHU-MING ; et al. | 2011-01-13 |
| Power Mosfet Package App 20100289092 - PERNG; Baw-Ching ; et al. | 2010-11-18 |
| Disposable safety syringe with retractable needle App 20100286610 - Chang; Shu-Ming | 2010-11-11 |
| Power control apparatus and method for an optical drive Grant 7,808,871 - Wang , et al. October 5, 2 | 2010-10-05 |
| Electronic Device Package And Method For Forming The Same App 20100230803 - CHIEN; Wen-Cheng ; et al. | 2010-09-16 |
| High efficiency and low cost cold cathode fluorescent lamp driving apparatus for LCD backlight Grant 7,786,680 - Bai , et al. August 31, 2 | 2010-08-31 |
| Magnetic shielding package structure of a magnetic memory device Grant 7,772,679 - Chang , et al. August 10, 2 | 2010-08-10 |
| Backlight module and current providing circuit thereof Grant 7,759,875 - Bai , et al. July 20, 2 | 2010-07-20 |
| Driving system for electronic device and current balancing circuit thereof Grant 7,759,877 - Bai , et al. July 20, 2 | 2010-07-20 |
| Thermoelectric Device And Fabrication Method Thereof, Chip Stack Structure, And Chip Package Structure App 20100163090 - Liu; Chun-Kai ; et al. | 2010-07-01 |
| DC-AC converter Grant 7,701,737 - Bai , et al. April 20, 2 | 2010-04-20 |
| Capacitor Device And Method For Manufacturing The Same App 20100052099 - Chang; Shu-Ming ; et al. | 2010-03-04 |
| Image sensor module with a three-dimensional die-stacking structure Grant 7,663,231 - Chang , et al. February 16, 2 | 2010-02-16 |
| Three-dimensional Conducting Structure And Method Of Fabricating The Same App 20100032830 - Chang; Hsiang-Hung ; et al. | 2010-02-11 |
| Wafer-To-Wafer Stacking App 20100020502 - Tain; Ra-Min ; et al. | 2010-01-28 |
| Package Structure Of Three-dimensional Stacking Dice And Method For Manufacturing The Same App 20090283872 - LIN; Chun-Te ; et al. | 2009-11-19 |
| Fluorescent lamp driver circuit App 20090267536 - Wang; Chen-Hsung ; et al. | 2009-10-29 |
| Dc-ac Converter App 20090244946 - Bai; Shwang-Shi ; et al. | 2009-10-01 |
| Inverter Circuit Of Driving A Lamp And Backlight Module Using The Same App 20090237346 - Bai; Shwang-Shi ; et al. | 2009-09-24 |
| High Efficiency And Low Cost Cold Cathode Fluorescent Lamp Driving Apparatus For Lcd Backlight App 20090189536 - Bai; Shwang-Shi ; et al. | 2009-07-30 |
| Inverter having single switching device Grant 7,564,191 - Chang , et al. July 21, 2 | 2009-07-21 |
| Stacked chip structure and fabrication method thereof Grant 7,541,217 - Shih , et al. June 2, 2 | 2009-06-02 |
| Structure Of Three-dimensional Stacked Dice With Vertical Electrical Self-interconnections And Method For Manufacturing The Same App 20090134527 - CHANG; Shu-Ming | 2009-05-28 |
| Driving System For Electronic Device And Current Balancing Circuit Thereof App 20090108771 - Bai; Shwang-Shi ; et al. | 2009-04-30 |
| Lamp driving device and method Grant 7,514,882 - Chang , et al. April 7, 2 | 2009-04-07 |
| High efficiency and low cost cold cathode fluorescent lamp driving apparatus for LCD backlight Grant 7,498,751 - Bai , et al. March 3, 2 | 2009-03-03 |
| Magnetic shielding package structure of a magnetic memory device App 20090045488 - Chang; Shu-Ming ; et al. | 2009-02-19 |
| Three-dimensional die-stacking package structure and method for manufacturing the same App 20090014891 - Chang; Hsiang-Hung ; et al. | 2009-01-15 |
| Image sensor module with a three-dimensional die-stacking structure App 20080308928 - Chang; Shu-Ming ; et al. | 2008-12-18 |
| Bonding Structure With Buffer Layer And Method Of Forming The Same App 20080305624 - Lu; Su-Tsai ; et al. | 2008-12-11 |
| Lcd Power Supply App 20080297499 - CHANG; Shu-Ming ; et al. | 2008-12-04 |
| Bonding structure with buffer layer and method of forming the same Grant 7,459,055 - Lu , et al. December 2, 2 | 2008-12-02 |
| Bonding structure with buffer layer and method of forming the same Grant 7,446,421 - Lu , et al. November 4, 2 | 2008-11-04 |
| Wafer level package App 20080265410 - Chang; Shu-Ming ; et al. | 2008-10-30 |
| Backlight Module And Current Providing Circuit Thereof App 20080265791 - Bai; Shwang-Shi ; et al. | 2008-10-30 |
| Backlight module driver circuit Grant 7,429,835 - Chang , et al. September 30, 2 | 2008-09-30 |
| Hardware component graph to hardware description language translation method Grant 7,430,727 - Cheng , et al. September 30, 2 | 2008-09-30 |
| Ccfl Inverter With Single Transistor App 20080061705 - Bai; Shwang-Shi ; et al. | 2008-03-13 |
| Packaging structure with protective layers and packaging method thereof App 20080014679 - Shen; Lee-Cheng ; et al. | 2008-01-17 |
| Wafer level chip scale packaging structure and method of fabricating the same Grant 7,319,050 - Chang , et al. January 15, 2 | 2008-01-15 |
| High Efficiency And Low Cost Cold Cathode Fluorescent Lamp Driving Apparatus For Lcd Backlight App 20070290624 - Bai; Shwang-Shi ; et al. | 2007-12-20 |
| Image-displaying control circuit of a scan-backlight LCD App 20070268238 - Chang; Shu-Ming ; et al. | 2007-11-22 |
| Power control apparatus and method for an optical drive App 20070217299 - Wang; Hsin Po ; et al. | 2007-09-20 |
| Backlight module driving circuit App 20070182697 - Chang; Shu-Ming ; et al. | 2007-08-09 |
| Method and system or driving a display apparatus App 20070164978 - Chang; Shu-Ming ; et al. | 2007-07-19 |
| Process of automatically translating a high level programming language into an extended activity diagram App 20070169054 - Cheng; Fu-Chiung ; et al. | 2007-07-19 |
| Inverter App 20070159114 - Chang; Shu-Ming ; et al. | 2007-07-12 |
| Lamp driving device and method App 20070159112 - Chang; Shu-Ming ; et al. | 2007-07-12 |
| Hardware component graph to hardware description language translation method App 20070157147 - Cheng; Fu-Chiung ; et al. | 2007-07-05 |
| High-level programming language to hardware component graph translation method App 20070157186 - Cheng; Fu-Chiung ; et al. | 2007-07-05 |
| Process of automatically translating a high level programming language into a hardware description language App 20070157132 - Cheng; Fu-Chiung ; et al. | 2007-07-05 |
| Protective case for electro product with apparatus to receive earphone App 20070154048 - Chang; Shu-Ming | 2007-07-05 |
| Process of automatically translating an extended activity diagram into a hardware component graph App 20070157187 - Cheng; Fu-Chiung ; et al. | 2007-07-05 |
| Bonding Structure With Buffer Layer And Method Of Forming The Same App 20070122635 - Lu; Su-Tsai ; et al. | 2007-05-31 |
| Wafer level chip scale packaging structure and method of fabricating the same App 20070108629 - Chang; Shu-Ming ; et al. | 2007-05-17 |
| Bonding Structure With Buffer Layer And Method Of Forming The Same App 20070056163 - Lu; Su-Tsai ; et al. | 2007-03-15 |
| Bonding structure with buffer layer and method of forming the same Grant 7,183,494 - Lu , et al. February 27, 2 | 2007-02-27 |
| 3-D stackable semiconductor package Grant 7,119,429 - Chang , et al. October 10, 2 | 2006-10-10 |
| Wafer level chip scale packaging structure and method of fabricating the same Grant 6,998,718 - Chang , et al. February 14, 2 | 2006-02-14 |
| 3-D stackable semiconductor package App 20060027908 - Chang; Shu-Ming ; et al. | 2006-02-09 |
| Wafer level chip scale packaging structure and method of fabricating the same App 20050230846 - Chang, Shu-Ming ; et al. | 2005-10-20 |
| Bonding structure with buffer layer and method of forming the same App 20050112340 - Lu, Su-Tsai ; et al. | 2005-05-26 |
| Wafer Level Chip Scale Packaging Structure And Method Of Fabricating The Same App 20050104226 - Chang, Shu-Ming ; et al. | 2005-05-19 |
| Error measuring device for optical disk drive mechanism App 20050083818 - Wang, Chi-Hsiang ; et al. | 2005-04-21 |
| Flexible electronic/optical interconnection film assembly and method for manufacturing App 20040218848 - Shen, Lee-Cheng ; et al. | 2004-11-04 |
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