loadpatents
Patent applications and USPTO patent grants for CHANG; Shu-Ming.The latest application filed is for "chip package and method for forming the same".
Patent | Date |
---|---|
Chip Package And Method For Forming The Same App 20220285423 - LIU; Tsang-Yu ;   et al. | 2022-09-08 |
Chip Package And Manufacturing Method Thereof App 20220219970 - LIU; Tsang-Yu ;   et al. | 2022-07-14 |
Chip package and manufacturing method thereof Grant 11,319,208 - Liu , et al. May 3, 2 | 2022-05-03 |
Method for detecting SNP site on SMA gene Grant 11,312,995 - Chang , et al. April 26, 2 | 2022-04-26 |
Printed Circuit Board Mesh Routing To Reduce Solder Ball Joint Failure During Reflow App 20210410277 - RODRIGUEZ; Benito Joseph ;   et al. | 2021-12-30 |
Printed circuit board mesh routing to reduce solder ball joint failure during reflow Grant 11,212,912 - Rodriguez , et al. December 28, 2 | 2021-12-28 |
Chip package and manufacturing method thereof Grant 11,164,853 - Cheng , et al. November 2, 2 | 2021-11-02 |
Chip Package App 20210210436 - CHENG; Chia-Ming ;   et al. | 2021-07-08 |
Chip Package And Manufacturing Method Thereof App 20210210445 - CHENG; Chia-Ming ;   et al. | 2021-07-08 |
Chip package and method for forming the same Grant 10,950,738 - Chang , et al. March 16, 2 | 2021-03-16 |
Chip Package And Manufacturing Method Thereof App 20210032096 - LIU; Tsang-Yu ;   et al. | 2021-02-04 |
Chip Package And Method For Forming The Same App 20200044099 - CHANG; Shu-Ming ;   et al. | 2020-02-06 |
Method For Detecting Snp Site On Sma Gene App 20190360046 - CHANG; HUNG MING ;   et al. | 2019-11-28 |
Chip package and method for forming the same Grant 10,446,504 - Cheng , et al. Oc | 2019-10-15 |
Touch panel-sensing chip package module complex and a manufacturing method thereof Grant 10,318,784 - Chang , et al. | 2019-06-11 |
Chip scale sensing chip package and a manufacturing method thereof Grant 10,152,180 - Chang , et al. Dec | 2018-12-11 |
Chip Package And Method For Forming The Same App 20180337142 - CHENG; Chia-Ming ;   et al. | 2018-11-22 |
Methods For Working Collaboratively And Systems Using The Same App 20180337988 - CHANG; Shu-Ming | 2018-11-22 |
Chip package and fabrication method thereof Grant 10,049,252 - Ho , et al. August 14, 2 | 2018-08-14 |
Chip package and manufacturing method thereof Grant 9,947,716 - Ho , et al. April 17, 2 | 2018-04-17 |
Chip package and method for fabricating the same Grant 9,881,889 - Huang , et al. January 30, 2 | 2018-01-30 |
Chip package and manufacturing method thereof Grant 9,793,234 - Ho , et al. October 17, 2 | 2017-10-17 |
Sensing module and method for forming the same Grant 9,711,425 - Chang , et al. July 18, 2 | 2017-07-18 |
Chip Package And Manufacturing Method Thereof App 20170148844 - HO; Yen-Shih ;   et al. | 2017-05-25 |
Chip package and method for forming the same Grant 9,640,488 - Lin , et al. May 2, 2 | 2017-05-02 |
Chip package including recess in side edge Grant 9,601,460 - Ho , et al. March 21, 2 | 2017-03-21 |
Sensing Module And Method For Forming The Same App 20170053848 - CHANG; Shu-Ming ;   et al. | 2017-02-23 |
Chip package and method for forming the same Grant 9,570,398 - Chang , et al. February 14, 2 | 2017-02-14 |
Chip package and manufacturing method thereof Grant 9,548,265 - Ho , et al. January 17, 2 | 2017-01-17 |
Touch Panel-sensing Chip Package Module Complex And A Manufacturing Method Thereof App 20160379040 - CHANG; Shu-Ming ;   et al. | 2016-12-29 |
Chip Package And Manufacturing Method Thereof App 20160315061 - HO; Yen-Shih ;   et al. | 2016-10-27 |
Semiconductor Electroplating System App 20160315048 - HO; Yen-Shih ;   et al. | 2016-10-27 |
Chip Package And Manufacturing Method Thereof App 20160315043 - HO; Yen-Shih ;   et al. | 2016-10-27 |
Chip Scale Sensing Chip Package And A Manufacturing Method Thereof App 20160266680 - CHANG; Shu-Ming ;   et al. | 2016-09-15 |
Chip package and method for forming the same Grant 9,437,478 - Ho , et al. September 6, 2 | 2016-09-06 |
Chip package Grant 9,425,134 - Ho , et al. August 23, 2 | 2016-08-23 |
Chip Scale Sensing Chip Package And A Manufacturing Method Thereof App 20160239699 - CHANG; Shu-Ming ;   et al. | 2016-08-18 |
Chip Package And Manufacturing Method Thereof App 20160240520 - Ho; Yen-Shih ;   et al. | 2016-08-18 |
Manufacturing method of semiconductor structure with protein tape Grant 9,419,050 - Ho , et al. August 16, 2 | 2016-08-16 |
Chip package and method of manufacturing the same Grant 9,406,818 - Liu , et al. August 2, 2 | 2016-08-02 |
Chip package and method thereof Grant 9,373,597 - Ho , et al. June 21, 2 | 2016-06-21 |
Chip Package And Fabrication Method Thereof App 20160171273 - HO; Yen-Shih ;   et al. | 2016-06-16 |
Chip package and method for forming the same Grant 9,355,975 - Ho , et al. May 31, 2 | 2016-05-31 |
Chip Package And Method For Forming The Same App 20160141254 - LIN; Yi-Min ;   et al. | 2016-05-19 |
Chip package and method for forming the same Grant 9,334,158 - Huang , et al. May 10, 2 | 2016-05-10 |
IC wafer having electromagnetic shielding effects and method for making the same Grant 9,331,024 - Chen , et al. May 3, 2 | 2016-05-03 |
Chip Package And Method Of Manufacturing The Same App 20160111555 - LIU; Tsang-Yu ;   et al. | 2016-04-21 |
Chip package and method for forming the same Grant 9,305,843 - Chen , et al. April 5, 2 | 2016-04-05 |
Semiconductor chip package and method for manufacturing thereof Grant 9,287,417 - Suen , et al. March 15, 2 | 2016-03-15 |
Semiconductor structure having stage difference surface and manufacturing method thereof Grant 9,275,963 - Tsai , et al. March 1, 2 | 2016-03-01 |
Chip package and method for forming the same Grant 9,275,958 - Lin , et al. March 1, 2 | 2016-03-01 |
Capacitive touch panel with electrode pairs Grant 9,268,443 - Chang , et al. February 23, 2 | 2016-02-23 |
Chip package and method of manufacturing the same Grant 9,269,837 - Liu , et al. February 23, 2 | 2016-02-23 |
Manufacturing Method Of Semiconductor Structure App 20150340403 - HO; Yen-Shih ;   et al. | 2015-11-26 |
Chip Package And Method Of Manufacturing The Same App 20150295097 - LIU; Tsang-Yu ;   et al. | 2015-10-15 |
Chip Package And Method Thereof App 20150270236 - HO; Yen-Shih ;   et al. | 2015-09-24 |
Chip Package And Method For Forming The Same App 20150228536 - HO; Yen-Shih ;   et al. | 2015-08-13 |
Chip package and manufacturing method thereof Grant 9,093,450 - Perng , et al. July 28, 2 | 2015-07-28 |
Semiconductor Device And Manufacturing Method Thereof App 20150206916 - LEE; Po-Han ;   et al. | 2015-07-23 |
Chip Package And Method For Forming The Same App 20150162245 - CHEN; Bing-Siang ;   et al. | 2015-06-11 |
Chip package structure and manufacturing method thereof Grant 9,054,114 - Lee , et al. June 9, 2 | 2015-06-09 |
Chip package and method for forming the same Grant 9,006,896 - Huang , et al. April 14, 2 | 2015-04-14 |
Stacked chip package and method for forming the same Grant 8,963,312 - Ho , et al. February 24, 2 | 2015-02-24 |
Semiconductor package and fabrication method thereof Grant 8,928,098 - Lee , et al. January 6, 2 | 2015-01-06 |
Chip package and method for forming the same Grant 8,900,924 - Chang , et al. December 2, 2 | 2014-12-02 |
Chip Package And Method For Forming The Same App 20140332969 - HO; Yen-Shih ;   et al. | 2014-11-13 |
Stacked Chip Package And Method For Forming The Same App 20140332983 - HO; Yen-Shih ;   et al. | 2014-11-13 |
Chip Package App 20140332968 - HO; Yen-Shih ;   et al. | 2014-11-13 |
Chip Package And Method For Forming The Same App 20140332908 - HO; Yen-Shih ;   et al. | 2014-11-13 |
Chip Package And Method For Fabricating The Same App 20140306343 - HUANG; Yu-Lung ;   et al. | 2014-10-16 |
Electronic device package Grant 8,860,217 - Chen , et al. October 14, 2 | 2014-10-14 |
Electronic Device Package App 20140284792 - CHEN; Wei-Ming ;   et al. | 2014-09-25 |
Chip Package Structure And Manufacturing Method Thereof App 20140264771 - LEE; Hung-Jen ;   et al. | 2014-09-18 |
Chip Package And Method For Forming The Same App 20140264785 - LIN; Yi-Min ;   et al. | 2014-09-18 |
Semiconductor Structure And Manufacturing Method Thereof App 20140252659 - TSAI; Yung-Tai ;   et al. | 2014-09-11 |
Semiconductor Chip Package And Method For Manufacturing Thereof App 20140203387 - SUEN; Wei-Luen ;   et al. | 2014-07-24 |
Chip package structure and manufacturing method thereof Grant 8,779,558 - Lee , et al. July 15, 2 | 2014-07-15 |
Electronic device package and fabrication method thereof Grant 8,778,798 - Chang , et al. July 15, 2 | 2014-07-15 |
Electronic Device Package And Fabrication Method Thereof App 20140193950 - CHANG; Shu-Ming ;   et al. | 2014-07-10 |
Electronic device package Grant 8,772,932 - Chen , et al. July 8, 2 | 2014-07-08 |
Power MOSFET package Grant 8,766,431 - Perng , et al. July 1, 2 | 2014-07-01 |
Touch Panel App 20140158513 - Chang; Shu-Ming ;   et al. | 2014-06-12 |
Chip Package And Method For Forming The Same App 20140154840 - CHANG; Shu-Ming ;   et al. | 2014-06-05 |
Method for fabricating electronic device package Grant 8,728,871 - Chen , et al. May 20, 2 | 2014-05-20 |
Electronic device package and fabrication method thereof Grant 8,710,680 - Chang , et al. April 29, 2 | 2014-04-29 |
Ic Wafer Having Electromagnetic Shielding Effects And Method For Making The Same App 20140091441 - CHEN; Yao-Hsiang ;   et al. | 2014-04-03 |
Chip package and method for forming the same Grant 8,674,518 - Chang , et al. March 18, 2 | 2014-03-18 |
Chip package structure and manufacturing method thereof Grant 8,673,686 - Lee , et al. March 18, 2 | 2014-03-18 |
Chip Package And Manufacturing Method Thereof App 20140073089 - PERNG; Baw-Ching ;   et al. | 2014-03-13 |
Chip package and method for forming the same Grant 8,643,070 - Chang , et al. February 4, 2 | 2014-02-04 |
Electronic device package and method for forming the same Grant 8,643,198 - Chien , et al. February 4, 2 | 2014-02-04 |
Chip package and fabrication method thereof Grant 8,633,582 - Chang , et al. January 21, 2 | 2014-01-21 |
IC wafer having electromagnetic shielding effects and method for making the same Grant 8,624,362 - Chen , et al. January 7, 2 | 2014-01-07 |
Package structure and method for making the same Grant 8,624,351 - Liu , et al. January 7, 2 | 2014-01-07 |
Chip package and method for forming the same Grant 8,614,488 - Wen , et al. December 24, 2 | 2013-12-24 |
Chip package and manufacturing method thereof Grant 8,610,271 - Perng , et al. December 17, 2 | 2013-12-17 |
Chip Package And Method For Forming The Same App 20130320559 - HUANG; Yu-Ting ;   et al. | 2013-12-05 |
Chip Package And Method For Forming The Same App 20130307161 - CHANG; Shu-Ming ;   et al. | 2013-11-21 |
Chip Package And Method For Forming The Same App 20130292825 - HUANG; Yu-Lung ;   et al. | 2013-11-07 |
Chip package and method for forming the same Grant 8,564,133 - Wen , et al. October 22, 2 | 2013-10-22 |
Safety syringe with retractable rotation Grant 8,562,561 - Chang October 22, 2 | 2013-10-22 |
Electronic device package and method for forming the same Grant 8,552,547 - Chien , et al. October 8, 2 | 2013-10-08 |
Electronic device package and method for fabricating the same Grant 8,541,877 - Tsai , et al. September 24, 2 | 2013-09-24 |
Image sensor package and fabrication method thereof Grant 8,536,672 - Chang , et al. September 17, 2 | 2013-09-17 |
Package structure of three-dimensional stacking dice and method for manufacturing the same Grant 8,531,009 - Lin , et al. September 10, 2 | 2013-09-10 |
Chip Package Structure And Manufacturing Method Thereof App 20130207240 - LEE; Hung-Jen ;   et al. | 2013-08-15 |
Power Mosfet Package App 20130193520 - PERNG; Baw-Ching ;   et al. | 2013-08-01 |
Semiconductor Package And Fabrication Method Thereof App 20130168784 - Lee; Hung-Jen ;   et al. | 2013-07-04 |
Electronic Device Package And Method For Forming The Same App 20130127022 - CHIEN; Wen-Cheng ;   et al. | 2013-05-23 |
Electronic Device Package And Method For Forming The Same App 20130126086 - CHIEN; Wen-Cheng ;   et al. | 2013-05-23 |
Chip package structure and manufacturing method thereof Grant 8,409,925 - Lee , et al. April 2, 2 | 2013-04-02 |
Power MOSFET package Grant 8,410,599 - Perng , et al. April 2, 2 | 2013-04-02 |
Electronic Device Package App 20130062759 - CHEN; Wei-Ming ;   et al. | 2013-03-14 |
Method For Fabricating Electronic Device Package App 20130045571 - CHEN; Wei-Ming ;   et al. | 2013-02-21 |
Electronic device package and method for forming the same Grant 8,367,477 - Chien , et al. February 5, 2 | 2013-02-05 |
Chip Package Structure And Manufacturing Method Thereof App 20120313261 - LEE; Hung-Jen ;   et al. | 2012-12-13 |
Chip Package Structure And Manufacturing Method Thereof App 20120313222 - LEE; Hung-Jen ;   et al. | 2012-12-13 |
Electronic device package and fabrication method thereof Grant 8,310,050 - Chen , et al. November 13, 2 | 2012-11-13 |
Chip Package And Method For Forming The Same App 20120267780 - CHEN; Bing-Siang ;   et al. | 2012-10-25 |
Ic Wafer Having Electromagnetic Shielding Effects And Method For Making The Same App 20120241923 - CHEN; Yao-Hsiang ;   et al. | 2012-09-27 |
Safety Syringe With Retractable Rotation App 20120226241 - Chang; Shu-Ming | 2012-09-06 |
Chip package and fabrication method thereof Grant 8,227,927 - Chen , et al. July 24, 2 | 2012-07-24 |
Chip Package And Method For Forming The Same App 20120168939 - CHANG; Shu-Ming ;   et al. | 2012-07-05 |
Chip Package And Method For Forming The Same App 20120146108 - CHANG; Shu-Ming ;   et al. | 2012-06-14 |
Chip Package And Method For Forming The Same App 20120146153 - WEN; Ying-Nan ;   et al. | 2012-06-14 |
Chip Package And Manufacturing Method Thereof App 20120146111 - CHANG; Shu-Ming ;   et al. | 2012-06-14 |
Three-dimensional conducting structure and method of fabricating the same Grant 8,193,632 - Chang , et al. June 5, 2 | 2012-06-05 |
LCD power supply Grant 8,164,587 - Chang , et al. April 24, 2 | 2012-04-24 |
Fluorescent lamp driver circuit Grant 8,115,406 - Wang , et al. February 14, 2 | 2012-02-14 |
Package Structure And Method For Making The Same App 20110291228 - Liu; Chien-Hung ;   et al. | 2011-12-01 |
Wafer level chip scale packaging structure and method of fabricating the same Grant 8,039,935 - Chang , et al. October 18, 2 | 2011-10-18 |
Inverter circuit of driving a lamp and backlight module using the same Grant 8,035,608 - Bai , et al. October 11, 2 | 2011-10-11 |
Disposable safety syringe Grant 8,034,025 - Chang October 11, 2 | 2011-10-11 |
Electronic Device Package And Fabrication Method Thereof App 20110233782 - CHANG; Shu-Ming ;   et al. | 2011-09-29 |
Image Sensor Package And Fabrication Method Thereof App 20110227186 - Chang; Shu-Ming ;   et al. | 2011-09-22 |
Electronic Device Package And Fabrication Method Thereof App 20110193225 - CHEN; Wei-Ming ;   et al. | 2011-08-11 |
Bonding structure with buffer layer and method of forming the same Grant 7,988,808 - Lu , et al. August 2, 2 | 2011-08-02 |
Electronic Device Package And Method For Fabricating The Same App 20110140267 - TSAI; Chia-Lun ;   et al. | 2011-06-16 |
Capacitor device and method for manufacturing the same Grant 7,960,773 - Chang , et al. June 14, 2 | 2011-06-14 |
Disposable safety syringe with retractable needle Grant 7,955,300 - Chang June 7, 2 | 2011-06-07 |
Chip Package And Manufacturing Method Thereof App 20110127670 - PERNG; Baw-Ching ;   et al. | 2011-06-02 |
Wafer-to-wafer stacking Grant 7,948,072 - Tain , et al. May 24, 2 | 2011-05-24 |
Chip Package And Fabrication Method Thereof App 20110084382 - Chen; Wei-Ming ;   et al. | 2011-04-14 |
Three-dimensional die-stacking package structure Grant 7,902,674 - Chang , et al. March 8, 2 | 2011-03-08 |
Chip Package And Method For Forming The Same App 20110042819 - WEN; Ying-Nan ;   et al. | 2011-02-24 |
Chip Package And Fabrication Method Thereof App 20110042796 - CHANG; Shu-Ming ;   et al. | 2011-02-24 |
Display Panel And Driving Method Thereof App 20110007062 - CHANG; SHU-MING ;   et al. | 2011-01-13 |
Power Mosfet Package App 20100289092 - PERNG; Baw-Ching ;   et al. | 2010-11-18 |
Disposable safety syringe with retractable needle App 20100286610 - Chang; Shu-Ming | 2010-11-11 |
Power control apparatus and method for an optical drive Grant 7,808,871 - Wang , et al. October 5, 2 | 2010-10-05 |
Electronic Device Package And Method For Forming The Same App 20100230803 - CHIEN; Wen-Cheng ;   et al. | 2010-09-16 |
High efficiency and low cost cold cathode fluorescent lamp driving apparatus for LCD backlight Grant 7,786,680 - Bai , et al. August 31, 2 | 2010-08-31 |
Magnetic shielding package structure of a magnetic memory device Grant 7,772,679 - Chang , et al. August 10, 2 | 2010-08-10 |
Driving system for electronic device and current balancing circuit thereof Grant 7,759,877 - Bai , et al. July 20, 2 | 2010-07-20 |
Backlight module and current providing circuit thereof Grant 7,759,875 - Bai , et al. July 20, 2 | 2010-07-20 |
Thermoelectric Device And Fabrication Method Thereof, Chip Stack Structure, And Chip Package Structure App 20100163090 - Liu; Chun-Kai ;   et al. | 2010-07-01 |
DC-AC converter Grant 7,701,737 - Bai , et al. April 20, 2 | 2010-04-20 |
Capacitor Device And Method For Manufacturing The Same App 20100052099 - Chang; Shu-Ming ;   et al. | 2010-03-04 |
Image sensor module with a three-dimensional die-stacking structure Grant 7,663,231 - Chang , et al. February 16, 2 | 2010-02-16 |
Three-dimensional Conducting Structure And Method Of Fabricating The Same App 20100032830 - Chang; Hsiang-Hung ;   et al. | 2010-02-11 |
Wafer-To-Wafer Stacking App 20100020502 - Tain; Ra-Min ;   et al. | 2010-01-28 |
Package Structure Of Three-dimensional Stacking Dice And Method For Manufacturing The Same App 20090283872 - LIN; Chun-Te ;   et al. | 2009-11-19 |
Fluorescent lamp driver circuit App 20090267536 - Wang; Chen-Hsung ;   et al. | 2009-10-29 |
Dc-ac Converter App 20090244946 - Bai; Shwang-Shi ;   et al. | 2009-10-01 |
Inverter Circuit Of Driving A Lamp And Backlight Module Using The Same App 20090237346 - Bai; Shwang-Shi ;   et al. | 2009-09-24 |
High Efficiency And Low Cost Cold Cathode Fluorescent Lamp Driving Apparatus For Lcd Backlight App 20090189536 - Bai; Shwang-Shi ;   et al. | 2009-07-30 |
Inverter having single switching device Grant 7,564,191 - Chang , et al. July 21, 2 | 2009-07-21 |
Stacked chip structure and fabrication method thereof Grant 7,541,217 - Shih , et al. June 2, 2 | 2009-06-02 |
Structure Of Three-dimensional Stacked Dice With Vertical Electrical Self-interconnections And Method For Manufacturing The Same App 20090134527 - CHANG; Shu-Ming | 2009-05-28 |
Driving System For Electronic Device And Current Balancing Circuit Thereof App 20090108771 - Bai; Shwang-Shi ;   et al. | 2009-04-30 |
Lamp driving device and method Grant 7,514,882 - Chang , et al. April 7, 2 | 2009-04-07 |
High efficiency and low cost cold cathode fluorescent lamp driving apparatus for LCD backlight Grant 7,498,751 - Bai , et al. March 3, 2 | 2009-03-03 |
Magnetic shielding package structure of a magnetic memory device App 20090045488 - Chang; Shu-Ming ;   et al. | 2009-02-19 |
Three-dimensional die-stacking package structure and method for manufacturing the same App 20090014891 - Chang; Hsiang-Hung ;   et al. | 2009-01-15 |
Image sensor module with a three-dimensional die-stacking structure App 20080308928 - Chang; Shu-Ming ;   et al. | 2008-12-18 |
Bonding Structure With Buffer Layer And Method Of Forming The Same App 20080305624 - Lu; Su-Tsai ;   et al. | 2008-12-11 |
Lcd Power Supply App 20080297499 - CHANG; Shu-Ming ;   et al. | 2008-12-04 |
Bonding structure with buffer layer and method of forming the same Grant 7,459,055 - Lu , et al. December 2, 2 | 2008-12-02 |
Bonding structure with buffer layer and method of forming the same Grant 7,446,421 - Lu , et al. November 4, 2 | 2008-11-04 |
Backlight Module And Current Providing Circuit Thereof App 20080265791 - Bai; Shwang-Shi ;   et al. | 2008-10-30 |
Wafer level package App 20080265410 - Chang; Shu-Ming ;   et al. | 2008-10-30 |
Backlight module driver circuit Grant 7,429,835 - Chang , et al. September 30, 2 | 2008-09-30 |
Hardware component graph to hardware description language translation method Grant 7,430,727 - Cheng , et al. September 30, 2 | 2008-09-30 |
Ccfl Inverter With Single Transistor App 20080061705 - Bai; Shwang-Shi ;   et al. | 2008-03-13 |
Packaging structure with protective layers and packaging method thereof App 20080014679 - Shen; Lee-Cheng ;   et al. | 2008-01-17 |
Wafer level chip scale packaging structure and method of fabricating the same Grant 7,319,050 - Chang , et al. January 15, 2 | 2008-01-15 |
High Efficiency And Low Cost Cold Cathode Fluorescent Lamp Driving Apparatus For Lcd Backlight App 20070290624 - Bai; Shwang-Shi ;   et al. | 2007-12-20 |
Image-displaying control circuit of a scan-backlight LCD App 20070268238 - Chang; Shu-Ming ;   et al. | 2007-11-22 |
Power control apparatus and method for an optical drive App 20070217299 - Wang; Hsin Po ;   et al. | 2007-09-20 |
Backlight module driving circuit App 20070182697 - Chang; Shu-Ming ;   et al. | 2007-08-09 |
Method and system or driving a display apparatus App 20070164978 - Chang; Shu-Ming ;   et al. | 2007-07-19 |
Process of automatically translating a high level programming language into an extended activity diagram App 20070169054 - Cheng; Fu-Chiung ;   et al. | 2007-07-19 |
Lamp driving device and method App 20070159112 - Chang; Shu-Ming ;   et al. | 2007-07-12 |
Inverter App 20070159114 - Chang; Shu-Ming ;   et al. | 2007-07-12 |
Process of automatically translating a high level programming language into a hardware description language App 20070157132 - Cheng; Fu-Chiung ;   et al. | 2007-07-05 |
Process of automatically translating an extended activity diagram into a hardware component graph App 20070157187 - Cheng; Fu-Chiung ;   et al. | 2007-07-05 |
Hardware component graph to hardware description language translation method App 20070157147 - Cheng; Fu-Chiung ;   et al. | 2007-07-05 |
Protective case for electro product with apparatus to receive earphone App 20070154048 - Chang; Shu-Ming | 2007-07-05 |
High-level programming language to hardware component graph translation method App 20070157186 - Cheng; Fu-Chiung ;   et al. | 2007-07-05 |
Bonding Structure With Buffer Layer And Method Of Forming The Same App 20070122635 - Lu; Su-Tsai ;   et al. | 2007-05-31 |
Wafer level chip scale packaging structure and method of fabricating the same App 20070108629 - Chang; Shu-Ming ;   et al. | 2007-05-17 |
Bonding Structure With Buffer Layer And Method Of Forming The Same App 20070056163 - Lu; Su-Tsai ;   et al. | 2007-03-15 |
Bonding structure with buffer layer and method of forming the same Grant 7,183,494 - Lu , et al. February 27, 2 | 2007-02-27 |
3-D stackable semiconductor package Grant 7,119,429 - Chang , et al. October 10, 2 | 2006-10-10 |
Wafer level chip scale packaging structure and method of fabricating the same Grant 6,998,718 - Chang , et al. February 14, 2 | 2006-02-14 |
3-D stackable semiconductor package App 20060027908 - Chang; Shu-Ming ;   et al. | 2006-02-09 |
Wafer level chip scale packaging structure and method of fabricating the same App 20050230846 - Chang, Shu-Ming ;   et al. | 2005-10-20 |
Bonding structure with buffer layer and method of forming the same App 20050112340 - Lu, Su-Tsai ;   et al. | 2005-05-26 |
Wafer Level Chip Scale Packaging Structure And Method Of Fabricating The Same App 20050104226 - Chang, Shu-Ming ;   et al. | 2005-05-19 |
Error measuring device for optical disk drive mechanism App 20050083818 - Wang, Chi-Hsiang ;   et al. | 2005-04-21 |
Flexible electronic/optical interconnection film assembly and method for manufacturing App 20040218848 - Shen, Lee-Cheng ;   et al. | 2004-11-04 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.