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name:-0.31423020362854
name:-0.18045687675476
name:-0.083083868026733
CHANG; Shu-Ming Patent Filings

CHANG; Shu-Ming

Patent Applications and Registrations

Patent applications and USPTO patent grants for CHANG; Shu-Ming.The latest application filed is for "chip package and method for forming the same".

Company Profile
6.111.117
  • CHANG; Shu-Ming - New Taipei City TW
  • Chang; Shu-Ming - New Taipei TW
  • Chang; Shu Ming - Taipei TW
  • CHANG; Shu-Ming - Taoyuan TW
  • CHANG; SHU MING - Taipei City TW
  • Chang; Shu-Ming - Taoyuan County TW
  • Chang; Shu-Ming - Tucheng Dist TW
  • Chang; Shu-Ming - Jhongli TW
  • Chang; Shu-Ming - Tucheng TW
  • CHANG; Shu-Ming - Tucheng City TW
  • Chang; Shu-Ming - Nantou N/A TW
  • Chang; Shu-Ming - Taipei County TW
  • Chang; Shu-Ming - Jhongli City TW
  • Chang; Shu-Ming - US
  • Chang; Shu-Ming - Tainan County TW
  • Chang; Shu-Ming - Sinjhuang JP
  • Chang; Shu-Ming - Hsinchu TW
  • Chang; Shu-Ming - Hsin Chu Hsien TW
  • CHANG; SHU-MING - YANGMEI TOWN TW
  • Chang; Shu Ming - Tai Pei TW
  • Chang; Shu-Ming - Tainan TW
  • Chang; Shu-Ming - Sinjhuang City TW
  • Chang; Shu-Ming - Hsinhua TW
  • Chang; Shu Ming - Tai Pei City TW
  • Chang; Shu-Ming - Taichung City TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Chip Package And Method For Forming The Same
App 20220285423 - LIU; Tsang-Yu ;   et al.
2022-09-08
Chip Package And Manufacturing Method Thereof
App 20220219970 - LIU; Tsang-Yu ;   et al.
2022-07-14
Chip package and manufacturing method thereof
Grant 11,319,208 - Liu , et al. May 3, 2
2022-05-03
Method for detecting SNP site on SMA gene
Grant 11,312,995 - Chang , et al. April 26, 2
2022-04-26
Printed Circuit Board Mesh Routing To Reduce Solder Ball Joint Failure During Reflow
App 20210410277 - RODRIGUEZ; Benito Joseph ;   et al.
2021-12-30
Printed circuit board mesh routing to reduce solder ball joint failure during reflow
Grant 11,212,912 - Rodriguez , et al. December 28, 2
2021-12-28
Chip package and manufacturing method thereof
Grant 11,164,853 - Cheng , et al. November 2, 2
2021-11-02
Chip Package
App 20210210436 - CHENG; Chia-Ming ;   et al.
2021-07-08
Chip Package And Manufacturing Method Thereof
App 20210210445 - CHENG; Chia-Ming ;   et al.
2021-07-08
Chip package and method for forming the same
Grant 10,950,738 - Chang , et al. March 16, 2
2021-03-16
Chip Package And Manufacturing Method Thereof
App 20210032096 - LIU; Tsang-Yu ;   et al.
2021-02-04
Chip Package And Method For Forming The Same
App 20200044099 - CHANG; Shu-Ming ;   et al.
2020-02-06
Method For Detecting Snp Site On Sma Gene
App 20190360046 - CHANG; HUNG MING ;   et al.
2019-11-28
Chip package and method for forming the same
Grant 10,446,504 - Cheng , et al. Oc
2019-10-15
Touch panel-sensing chip package module complex and a manufacturing method thereof
Grant 10,318,784 - Chang , et al.
2019-06-11
Chip scale sensing chip package and a manufacturing method thereof
Grant 10,152,180 - Chang , et al. Dec
2018-12-11
Chip Package And Method For Forming The Same
App 20180337142 - CHENG; Chia-Ming ;   et al.
2018-11-22
Methods For Working Collaboratively And Systems Using The Same
App 20180337988 - CHANG; Shu-Ming
2018-11-22
Chip package and fabrication method thereof
Grant 10,049,252 - Ho , et al. August 14, 2
2018-08-14
Chip package and manufacturing method thereof
Grant 9,947,716 - Ho , et al. April 17, 2
2018-04-17
Chip package and method for fabricating the same
Grant 9,881,889 - Huang , et al. January 30, 2
2018-01-30
Chip package and manufacturing method thereof
Grant 9,793,234 - Ho , et al. October 17, 2
2017-10-17
Sensing module and method for forming the same
Grant 9,711,425 - Chang , et al. July 18, 2
2017-07-18
Chip Package And Manufacturing Method Thereof
App 20170148844 - HO; Yen-Shih ;   et al.
2017-05-25
Chip package and method for forming the same
Grant 9,640,488 - Lin , et al. May 2, 2
2017-05-02
Chip package including recess in side edge
Grant 9,601,460 - Ho , et al. March 21, 2
2017-03-21
Sensing Module And Method For Forming The Same
App 20170053848 - CHANG; Shu-Ming ;   et al.
2017-02-23
Chip package and method for forming the same
Grant 9,570,398 - Chang , et al. February 14, 2
2017-02-14
Chip package and manufacturing method thereof
Grant 9,548,265 - Ho , et al. January 17, 2
2017-01-17
Touch Panel-sensing Chip Package Module Complex And A Manufacturing Method Thereof
App 20160379040 - CHANG; Shu-Ming ;   et al.
2016-12-29
Chip Package And Manufacturing Method Thereof
App 20160315061 - HO; Yen-Shih ;   et al.
2016-10-27
Semiconductor Electroplating System
App 20160315048 - HO; Yen-Shih ;   et al.
2016-10-27
Chip Package And Manufacturing Method Thereof
App 20160315043 - HO; Yen-Shih ;   et al.
2016-10-27
Chip Scale Sensing Chip Package And A Manufacturing Method Thereof
App 20160266680 - CHANG; Shu-Ming ;   et al.
2016-09-15
Chip package and method for forming the same
Grant 9,437,478 - Ho , et al. September 6, 2
2016-09-06
Chip package
Grant 9,425,134 - Ho , et al. August 23, 2
2016-08-23
Chip Scale Sensing Chip Package And A Manufacturing Method Thereof
App 20160239699 - CHANG; Shu-Ming ;   et al.
2016-08-18
Chip Package And Manufacturing Method Thereof
App 20160240520 - Ho; Yen-Shih ;   et al.
2016-08-18
Manufacturing method of semiconductor structure with protein tape
Grant 9,419,050 - Ho , et al. August 16, 2
2016-08-16
Chip package and method of manufacturing the same
Grant 9,406,818 - Liu , et al. August 2, 2
2016-08-02
Chip package and method thereof
Grant 9,373,597 - Ho , et al. June 21, 2
2016-06-21
Chip Package And Fabrication Method Thereof
App 20160171273 - HO; Yen-Shih ;   et al.
2016-06-16
Chip package and method for forming the same
Grant 9,355,975 - Ho , et al. May 31, 2
2016-05-31
Chip Package And Method For Forming The Same
App 20160141254 - LIN; Yi-Min ;   et al.
2016-05-19
Chip package and method for forming the same
Grant 9,334,158 - Huang , et al. May 10, 2
2016-05-10
IC wafer having electromagnetic shielding effects and method for making the same
Grant 9,331,024 - Chen , et al. May 3, 2
2016-05-03
Chip Package And Method Of Manufacturing The Same
App 20160111555 - LIU; Tsang-Yu ;   et al.
2016-04-21
Chip package and method for forming the same
Grant 9,305,843 - Chen , et al. April 5, 2
2016-04-05
Semiconductor chip package and method for manufacturing thereof
Grant 9,287,417 - Suen , et al. March 15, 2
2016-03-15
Semiconductor structure having stage difference surface and manufacturing method thereof
Grant 9,275,963 - Tsai , et al. March 1, 2
2016-03-01
Chip package and method for forming the same
Grant 9,275,958 - Lin , et al. March 1, 2
2016-03-01
Capacitive touch panel with electrode pairs
Grant 9,268,443 - Chang , et al. February 23, 2
2016-02-23
Chip package and method of manufacturing the same
Grant 9,269,837 - Liu , et al. February 23, 2
2016-02-23
Manufacturing Method Of Semiconductor Structure
App 20150340403 - HO; Yen-Shih ;   et al.
2015-11-26
Chip Package And Method Of Manufacturing The Same
App 20150295097 - LIU; Tsang-Yu ;   et al.
2015-10-15
Chip Package And Method Thereof
App 20150270236 - HO; Yen-Shih ;   et al.
2015-09-24
Chip Package And Method For Forming The Same
App 20150228536 - HO; Yen-Shih ;   et al.
2015-08-13
Chip package and manufacturing method thereof
Grant 9,093,450 - Perng , et al. July 28, 2
2015-07-28
Semiconductor Device And Manufacturing Method Thereof
App 20150206916 - LEE; Po-Han ;   et al.
2015-07-23
Chip Package And Method For Forming The Same
App 20150162245 - CHEN; Bing-Siang ;   et al.
2015-06-11
Chip package structure and manufacturing method thereof
Grant 9,054,114 - Lee , et al. June 9, 2
2015-06-09
Chip package and method for forming the same
Grant 9,006,896 - Huang , et al. April 14, 2
2015-04-14
Stacked chip package and method for forming the same
Grant 8,963,312 - Ho , et al. February 24, 2
2015-02-24
Semiconductor package and fabrication method thereof
Grant 8,928,098 - Lee , et al. January 6, 2
2015-01-06
Chip package and method for forming the same
Grant 8,900,924 - Chang , et al. December 2, 2
2014-12-02
Chip Package And Method For Forming The Same
App 20140332969 - HO; Yen-Shih ;   et al.
2014-11-13
Stacked Chip Package And Method For Forming The Same
App 20140332983 - HO; Yen-Shih ;   et al.
2014-11-13
Chip Package
App 20140332968 - HO; Yen-Shih ;   et al.
2014-11-13
Chip Package And Method For Forming The Same
App 20140332908 - HO; Yen-Shih ;   et al.
2014-11-13
Chip Package And Method For Fabricating The Same
App 20140306343 - HUANG; Yu-Lung ;   et al.
2014-10-16
Electronic device package
Grant 8,860,217 - Chen , et al. October 14, 2
2014-10-14
Electronic Device Package
App 20140284792 - CHEN; Wei-Ming ;   et al.
2014-09-25
Chip Package Structure And Manufacturing Method Thereof
App 20140264771 - LEE; Hung-Jen ;   et al.
2014-09-18
Chip Package And Method For Forming The Same
App 20140264785 - LIN; Yi-Min ;   et al.
2014-09-18
Semiconductor Structure And Manufacturing Method Thereof
App 20140252659 - TSAI; Yung-Tai ;   et al.
2014-09-11
Semiconductor Chip Package And Method For Manufacturing Thereof
App 20140203387 - SUEN; Wei-Luen ;   et al.
2014-07-24
Chip package structure and manufacturing method thereof
Grant 8,779,558 - Lee , et al. July 15, 2
2014-07-15
Electronic device package and fabrication method thereof
Grant 8,778,798 - Chang , et al. July 15, 2
2014-07-15
Electronic Device Package And Fabrication Method Thereof
App 20140193950 - CHANG; Shu-Ming ;   et al.
2014-07-10
Electronic device package
Grant 8,772,932 - Chen , et al. July 8, 2
2014-07-08
Power MOSFET package
Grant 8,766,431 - Perng , et al. July 1, 2
2014-07-01
Touch Panel
App 20140158513 - Chang; Shu-Ming ;   et al.
2014-06-12
Chip Package And Method For Forming The Same
App 20140154840 - CHANG; Shu-Ming ;   et al.
2014-06-05
Method for fabricating electronic device package
Grant 8,728,871 - Chen , et al. May 20, 2
2014-05-20
Electronic device package and fabrication method thereof
Grant 8,710,680 - Chang , et al. April 29, 2
2014-04-29
Ic Wafer Having Electromagnetic Shielding Effects And Method For Making The Same
App 20140091441 - CHEN; Yao-Hsiang ;   et al.
2014-04-03
Chip package and method for forming the same
Grant 8,674,518 - Chang , et al. March 18, 2
2014-03-18
Chip package structure and manufacturing method thereof
Grant 8,673,686 - Lee , et al. March 18, 2
2014-03-18
Chip Package And Manufacturing Method Thereof
App 20140073089 - PERNG; Baw-Ching ;   et al.
2014-03-13
Chip package and method for forming the same
Grant 8,643,070 - Chang , et al. February 4, 2
2014-02-04
Electronic device package and method for forming the same
Grant 8,643,198 - Chien , et al. February 4, 2
2014-02-04
Chip package and fabrication method thereof
Grant 8,633,582 - Chang , et al. January 21, 2
2014-01-21
IC wafer having electromagnetic shielding effects and method for making the same
Grant 8,624,362 - Chen , et al. January 7, 2
2014-01-07
Package structure and method for making the same
Grant 8,624,351 - Liu , et al. January 7, 2
2014-01-07
Chip package and method for forming the same
Grant 8,614,488 - Wen , et al. December 24, 2
2013-12-24
Chip package and manufacturing method thereof
Grant 8,610,271 - Perng , et al. December 17, 2
2013-12-17
Chip Package And Method For Forming The Same
App 20130320559 - HUANG; Yu-Ting ;   et al.
2013-12-05
Chip Package And Method For Forming The Same
App 20130307161 - CHANG; Shu-Ming ;   et al.
2013-11-21
Chip Package And Method For Forming The Same
App 20130292825 - HUANG; Yu-Lung ;   et al.
2013-11-07
Chip package and method for forming the same
Grant 8,564,133 - Wen , et al. October 22, 2
2013-10-22
Safety syringe with retractable rotation
Grant 8,562,561 - Chang October 22, 2
2013-10-22
Electronic device package and method for forming the same
Grant 8,552,547 - Chien , et al. October 8, 2
2013-10-08
Electronic device package and method for fabricating the same
Grant 8,541,877 - Tsai , et al. September 24, 2
2013-09-24
Image sensor package and fabrication method thereof
Grant 8,536,672 - Chang , et al. September 17, 2
2013-09-17
Package structure of three-dimensional stacking dice and method for manufacturing the same
Grant 8,531,009 - Lin , et al. September 10, 2
2013-09-10
Chip Package Structure And Manufacturing Method Thereof
App 20130207240 - LEE; Hung-Jen ;   et al.
2013-08-15
Power Mosfet Package
App 20130193520 - PERNG; Baw-Ching ;   et al.
2013-08-01
Semiconductor Package And Fabrication Method Thereof
App 20130168784 - Lee; Hung-Jen ;   et al.
2013-07-04
Electronic Device Package And Method For Forming The Same
App 20130127022 - CHIEN; Wen-Cheng ;   et al.
2013-05-23
Electronic Device Package And Method For Forming The Same
App 20130126086 - CHIEN; Wen-Cheng ;   et al.
2013-05-23
Chip package structure and manufacturing method thereof
Grant 8,409,925 - Lee , et al. April 2, 2
2013-04-02
Power MOSFET package
Grant 8,410,599 - Perng , et al. April 2, 2
2013-04-02
Electronic Device Package
App 20130062759 - CHEN; Wei-Ming ;   et al.
2013-03-14
Method For Fabricating Electronic Device Package
App 20130045571 - CHEN; Wei-Ming ;   et al.
2013-02-21
Electronic device package and method for forming the same
Grant 8,367,477 - Chien , et al. February 5, 2
2013-02-05
Chip Package Structure And Manufacturing Method Thereof
App 20120313261 - LEE; Hung-Jen ;   et al.
2012-12-13
Chip Package Structure And Manufacturing Method Thereof
App 20120313222 - LEE; Hung-Jen ;   et al.
2012-12-13
Electronic device package and fabrication method thereof
Grant 8,310,050 - Chen , et al. November 13, 2
2012-11-13
Chip Package And Method For Forming The Same
App 20120267780 - CHEN; Bing-Siang ;   et al.
2012-10-25
Ic Wafer Having Electromagnetic Shielding Effects And Method For Making The Same
App 20120241923 - CHEN; Yao-Hsiang ;   et al.
2012-09-27
Safety Syringe With Retractable Rotation
App 20120226241 - Chang; Shu-Ming
2012-09-06
Chip package and fabrication method thereof
Grant 8,227,927 - Chen , et al. July 24, 2
2012-07-24
Chip Package And Method For Forming The Same
App 20120168939 - CHANG; Shu-Ming ;   et al.
2012-07-05
Chip Package And Method For Forming The Same
App 20120146108 - CHANG; Shu-Ming ;   et al.
2012-06-14
Chip Package And Method For Forming The Same
App 20120146153 - WEN; Ying-Nan ;   et al.
2012-06-14
Chip Package And Manufacturing Method Thereof
App 20120146111 - CHANG; Shu-Ming ;   et al.
2012-06-14
Three-dimensional conducting structure and method of fabricating the same
Grant 8,193,632 - Chang , et al. June 5, 2
2012-06-05
LCD power supply
Grant 8,164,587 - Chang , et al. April 24, 2
2012-04-24
Fluorescent lamp driver circuit
Grant 8,115,406 - Wang , et al. February 14, 2
2012-02-14
Package Structure And Method For Making The Same
App 20110291228 - Liu; Chien-Hung ;   et al.
2011-12-01
Wafer level chip scale packaging structure and method of fabricating the same
Grant 8,039,935 - Chang , et al. October 18, 2
2011-10-18
Inverter circuit of driving a lamp and backlight module using the same
Grant 8,035,608 - Bai , et al. October 11, 2
2011-10-11
Disposable safety syringe
Grant 8,034,025 - Chang October 11, 2
2011-10-11
Electronic Device Package And Fabrication Method Thereof
App 20110233782 - CHANG; Shu-Ming ;   et al.
2011-09-29
Image Sensor Package And Fabrication Method Thereof
App 20110227186 - Chang; Shu-Ming ;   et al.
2011-09-22
Electronic Device Package And Fabrication Method Thereof
App 20110193225 - CHEN; Wei-Ming ;   et al.
2011-08-11
Bonding structure with buffer layer and method of forming the same
Grant 7,988,808 - Lu , et al. August 2, 2
2011-08-02
Electronic Device Package And Method For Fabricating The Same
App 20110140267 - TSAI; Chia-Lun ;   et al.
2011-06-16
Capacitor device and method for manufacturing the same
Grant 7,960,773 - Chang , et al. June 14, 2
2011-06-14
Disposable safety syringe with retractable needle
Grant 7,955,300 - Chang June 7, 2
2011-06-07
Chip Package And Manufacturing Method Thereof
App 20110127670 - PERNG; Baw-Ching ;   et al.
2011-06-02
Wafer-to-wafer stacking
Grant 7,948,072 - Tain , et al. May 24, 2
2011-05-24
Chip Package And Fabrication Method Thereof
App 20110084382 - Chen; Wei-Ming ;   et al.
2011-04-14
Three-dimensional die-stacking package structure
Grant 7,902,674 - Chang , et al. March 8, 2
2011-03-08
Chip Package And Method For Forming The Same
App 20110042819 - WEN; Ying-Nan ;   et al.
2011-02-24
Chip Package And Fabrication Method Thereof
App 20110042796 - CHANG; Shu-Ming ;   et al.
2011-02-24
Display Panel And Driving Method Thereof
App 20110007062 - CHANG; SHU-MING ;   et al.
2011-01-13
Power Mosfet Package
App 20100289092 - PERNG; Baw-Ching ;   et al.
2010-11-18
Disposable safety syringe with retractable needle
App 20100286610 - Chang; Shu-Ming
2010-11-11
Power control apparatus and method for an optical drive
Grant 7,808,871 - Wang , et al. October 5, 2
2010-10-05
Electronic Device Package And Method For Forming The Same
App 20100230803 - CHIEN; Wen-Cheng ;   et al.
2010-09-16
High efficiency and low cost cold cathode fluorescent lamp driving apparatus for LCD backlight
Grant 7,786,680 - Bai , et al. August 31, 2
2010-08-31
Magnetic shielding package structure of a magnetic memory device
Grant 7,772,679 - Chang , et al. August 10, 2
2010-08-10
Driving system for electronic device and current balancing circuit thereof
Grant 7,759,877 - Bai , et al. July 20, 2
2010-07-20
Backlight module and current providing circuit thereof
Grant 7,759,875 - Bai , et al. July 20, 2
2010-07-20
Thermoelectric Device And Fabrication Method Thereof, Chip Stack Structure, And Chip Package Structure
App 20100163090 - Liu; Chun-Kai ;   et al.
2010-07-01
DC-AC converter
Grant 7,701,737 - Bai , et al. April 20, 2
2010-04-20
Capacitor Device And Method For Manufacturing The Same
App 20100052099 - Chang; Shu-Ming ;   et al.
2010-03-04
Image sensor module with a three-dimensional die-stacking structure
Grant 7,663,231 - Chang , et al. February 16, 2
2010-02-16
Three-dimensional Conducting Structure And Method Of Fabricating The Same
App 20100032830 - Chang; Hsiang-Hung ;   et al.
2010-02-11
Wafer-To-Wafer Stacking
App 20100020502 - Tain; Ra-Min ;   et al.
2010-01-28
Package Structure Of Three-dimensional Stacking Dice And Method For Manufacturing The Same
App 20090283872 - LIN; Chun-Te ;   et al.
2009-11-19
Fluorescent lamp driver circuit
App 20090267536 - Wang; Chen-Hsung ;   et al.
2009-10-29
Dc-ac Converter
App 20090244946 - Bai; Shwang-Shi ;   et al.
2009-10-01
Inverter Circuit Of Driving A Lamp And Backlight Module Using The Same
App 20090237346 - Bai; Shwang-Shi ;   et al.
2009-09-24
High Efficiency And Low Cost Cold Cathode Fluorescent Lamp Driving Apparatus For Lcd Backlight
App 20090189536 - Bai; Shwang-Shi ;   et al.
2009-07-30
Inverter having single switching device
Grant 7,564,191 - Chang , et al. July 21, 2
2009-07-21
Stacked chip structure and fabrication method thereof
Grant 7,541,217 - Shih , et al. June 2, 2
2009-06-02
Structure Of Three-dimensional Stacked Dice With Vertical Electrical Self-interconnections And Method For Manufacturing The Same
App 20090134527 - CHANG; Shu-Ming
2009-05-28
Driving System For Electronic Device And Current Balancing Circuit Thereof
App 20090108771 - Bai; Shwang-Shi ;   et al.
2009-04-30
Lamp driving device and method
Grant 7,514,882 - Chang , et al. April 7, 2
2009-04-07
High efficiency and low cost cold cathode fluorescent lamp driving apparatus for LCD backlight
Grant 7,498,751 - Bai , et al. March 3, 2
2009-03-03
Magnetic shielding package structure of a magnetic memory device
App 20090045488 - Chang; Shu-Ming ;   et al.
2009-02-19
Three-dimensional die-stacking package structure and method for manufacturing the same
App 20090014891 - Chang; Hsiang-Hung ;   et al.
2009-01-15
Image sensor module with a three-dimensional die-stacking structure
App 20080308928 - Chang; Shu-Ming ;   et al.
2008-12-18
Bonding Structure With Buffer Layer And Method Of Forming The Same
App 20080305624 - Lu; Su-Tsai ;   et al.
2008-12-11
Lcd Power Supply
App 20080297499 - CHANG; Shu-Ming ;   et al.
2008-12-04
Bonding structure with buffer layer and method of forming the same
Grant 7,459,055 - Lu , et al. December 2, 2
2008-12-02
Bonding structure with buffer layer and method of forming the same
Grant 7,446,421 - Lu , et al. November 4, 2
2008-11-04
Backlight Module And Current Providing Circuit Thereof
App 20080265791 - Bai; Shwang-Shi ;   et al.
2008-10-30
Wafer level package
App 20080265410 - Chang; Shu-Ming ;   et al.
2008-10-30
Backlight module driver circuit
Grant 7,429,835 - Chang , et al. September 30, 2
2008-09-30
Hardware component graph to hardware description language translation method
Grant 7,430,727 - Cheng , et al. September 30, 2
2008-09-30
Ccfl Inverter With Single Transistor
App 20080061705 - Bai; Shwang-Shi ;   et al.
2008-03-13
Packaging structure with protective layers and packaging method thereof
App 20080014679 - Shen; Lee-Cheng ;   et al.
2008-01-17
Wafer level chip scale packaging structure and method of fabricating the same
Grant 7,319,050 - Chang , et al. January 15, 2
2008-01-15
High Efficiency And Low Cost Cold Cathode Fluorescent Lamp Driving Apparatus For Lcd Backlight
App 20070290624 - Bai; Shwang-Shi ;   et al.
2007-12-20
Image-displaying control circuit of a scan-backlight LCD
App 20070268238 - Chang; Shu-Ming ;   et al.
2007-11-22
Power control apparatus and method for an optical drive
App 20070217299 - Wang; Hsin Po ;   et al.
2007-09-20
Backlight module driving circuit
App 20070182697 - Chang; Shu-Ming ;   et al.
2007-08-09
Method and system or driving a display apparatus
App 20070164978 - Chang; Shu-Ming ;   et al.
2007-07-19
Process of automatically translating a high level programming language into an extended activity diagram
App 20070169054 - Cheng; Fu-Chiung ;   et al.
2007-07-19
Lamp driving device and method
App 20070159112 - Chang; Shu-Ming ;   et al.
2007-07-12
Inverter
App 20070159114 - Chang; Shu-Ming ;   et al.
2007-07-12
Process of automatically translating a high level programming language into a hardware description language
App 20070157132 - Cheng; Fu-Chiung ;   et al.
2007-07-05
Process of automatically translating an extended activity diagram into a hardware component graph
App 20070157187 - Cheng; Fu-Chiung ;   et al.
2007-07-05
Hardware component graph to hardware description language translation method
App 20070157147 - Cheng; Fu-Chiung ;   et al.
2007-07-05
Protective case for electro product with apparatus to receive earphone
App 20070154048 - Chang; Shu-Ming
2007-07-05
High-level programming language to hardware component graph translation method
App 20070157186 - Cheng; Fu-Chiung ;   et al.
2007-07-05
Bonding Structure With Buffer Layer And Method Of Forming The Same
App 20070122635 - Lu; Su-Tsai ;   et al.
2007-05-31
Wafer level chip scale packaging structure and method of fabricating the same
App 20070108629 - Chang; Shu-Ming ;   et al.
2007-05-17
Bonding Structure With Buffer Layer And Method Of Forming The Same
App 20070056163 - Lu; Su-Tsai ;   et al.
2007-03-15
Bonding structure with buffer layer and method of forming the same
Grant 7,183,494 - Lu , et al. February 27, 2
2007-02-27
3-D stackable semiconductor package
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