Chang; Shih-Tzung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chang; Shih-Tzung.The latest application filed is for "statistical method for monitoring manufacturing equipment and processing operations".

Company Profile

0.14.11

Chang; Shih-Tzung - Camas WA
Chang; Shih-Tzung - Taichung TW
Chang; Shih-Tzung - Vancouver WA
Chang; Shih Tzung - Hsin-Chu TW
Chang, Shih-Tzung - Fengyuan city TW
Chang; Shih-Tzung - Feugyuan TW
Chang; Shih-Tzung - Fengyuan Taichung TW
Chang; Shih-Tzung - Feng-Yuan TW
Chang; Shih-Tzung - Fengyuan TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Recipe management system and method Grant 9,280,151 - Chang , et al. March 8, 2	2016-03-08
Statistical method for monitoring manufacturing equipment and processing operations Grant 9,275,918 - Lu , et al. March 1, 2	2016-03-01
Statistical Method For Monitoring Manufacturing Equipment And Processing Operations App 20150262894 - LU; Liwen ; et al.	2015-09-17
Statistical method for monitoring manufacturing equipment and processing operations Grant 9,064,788 - Lu , et al. June 23, 2	2015-06-23
Recipe Management System And Method App 20130310960 - Chang; Shih-Tzung ; et al.	2013-11-21
Semiconductor devices having post passivation interconnections and a buffer layer Grant 7,528,478 - Cheng , et al. May 5, 2	2009-05-05
Test device and method for laser alignment calibration Grant 7,304,728 - Chang , et al. December 4, 2	2007-12-04
Metal-filled openings for submicron devices and methods of manufacture thereof Grant 7,199,045 - Liu , et al. April 3, 2	2007-04-03
Electropolishing method for removing particles from wafer surface Grant 7,128,821 - Lin , et al. October 31, 2	2006-10-31
Semiconductor devices having post passivation interconnections with a second connection pattern App 20060145332 - Cheng; Hsi-Kuei ; et al.	2006-07-06
Method of forming barrier layer with reduced resistivity and improved reliability in copper damascene process Grant 7,071,100 - Chen , et al. July 4, 2	2006-07-04
Method for reducing defects in post passivation interconnect process Grant 7,026,233 - Cheng , et al. April 11, 2	2006-04-11
Test device and method for laser alignment calibration App 20060055928 - Chang; Shih-Tzung ; et al.	2006-03-16
Metal-filled openings for submicron devices and methods of manufacture thereof App 20050275941 - Liu, Chi-Wen ; et al.	2005-12-15
Method of forming barrier layer with reduced resistivity and improved reliability in copper damascene process App 20050191855 - Chen, Kei-Wei ; et al.	2005-09-01
Electropolishing method for removing particles from wafer surface App 20050155869 - Lin, Shih-Ho ; et al.	2005-07-21
Method for reducing defects in post passivation interconnect process App 20050032353 - Cheng, Hsi-Kuei ; et al.	2005-02-10
Removal of SiON residue after CMP Grant 6,828,226 - Chen , et al. December 7, 2	2004-12-07
Method and system for slurry usage reduction in chemical mechanical polishing Grant 6,769,959 - Chen , et al. August 3, 2	2004-08-03
Method for improving thickness uniformity on a semiconductor wafer during chemical mechanical polishing Grant 6,626,741 - Wang , et al. September 30, 2	2003-09-30
Method and system for slurry usage reduction in chemical mechanical polishing App 20030143924 - Chen, Kei-Wei ; et al.	2003-07-31
Use of a capping layer to reduce particle evolution during sputter pre-clean procedures Grant 6,531,382 - Cheng , et al. March 11, 2	2003-03-11
Method for improving thickness uniformity on a semiconductor wafer during chemical mechanical polishing App 20030017784 - Wang, Ting-Chun ; et al.	2003-01-23

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