Patent | Date |
---|
Recipe management system and method Grant 9,280,151 - Chang , et al. March 8, 2 | 2016-03-08 |
Statistical method for monitoring manufacturing equipment and processing operations Grant 9,275,918 - Lu , et al. March 1, 2 | 2016-03-01 |
Statistical Method For Monitoring Manufacturing Equipment And Processing Operations App 20150262894 - LU; Liwen ;   et al. | 2015-09-17 |
Statistical method for monitoring manufacturing equipment and processing operations Grant 9,064,788 - Lu , et al. June 23, 2 | 2015-06-23 |
Recipe Management System And Method App 20130310960 - Chang; Shih-Tzung ;   et al. | 2013-11-21 |
Semiconductor devices having post passivation interconnections and a buffer layer Grant 7,528,478 - Cheng , et al. May 5, 2 | 2009-05-05 |
Test device and method for laser alignment calibration Grant 7,304,728 - Chang , et al. December 4, 2 | 2007-12-04 |
Metal-filled openings for submicron devices and methods of manufacture thereof Grant 7,199,045 - Liu , et al. April 3, 2 | 2007-04-03 |
Electropolishing method for removing particles from wafer surface Grant 7,128,821 - Lin , et al. October 31, 2 | 2006-10-31 |
Semiconductor devices having post passivation interconnections with a second connection pattern App 20060145332 - Cheng; Hsi-Kuei ;   et al. | 2006-07-06 |
Method of forming barrier layer with reduced resistivity and improved reliability in copper damascene process Grant 7,071,100 - Chen , et al. July 4, 2 | 2006-07-04 |
Method for reducing defects in post passivation interconnect process Grant 7,026,233 - Cheng , et al. April 11, 2 | 2006-04-11 |
Test device and method for laser alignment calibration App 20060055928 - Chang; Shih-Tzung ;   et al. | 2006-03-16 |
Metal-filled openings for submicron devices and methods of manufacture thereof App 20050275941 - Liu, Chi-Wen ;   et al. | 2005-12-15 |
Method of forming barrier layer with reduced resistivity and improved reliability in copper damascene process App 20050191855 - Chen, Kei-Wei ;   et al. | 2005-09-01 |
Electropolishing method for removing particles from wafer surface App 20050155869 - Lin, Shih-Ho ;   et al. | 2005-07-21 |
Method for reducing defects in post passivation interconnect process App 20050032353 - Cheng, Hsi-Kuei ;   et al. | 2005-02-10 |
Removal of SiON residue after CMP Grant 6,828,226 - Chen , et al. December 7, 2 | 2004-12-07 |
Method and system for slurry usage reduction in chemical mechanical polishing Grant 6,769,959 - Chen , et al. August 3, 2 | 2004-08-03 |
Method for improving thickness uniformity on a semiconductor wafer during chemical mechanical polishing Grant 6,626,741 - Wang , et al. September 30, 2 | 2003-09-30 |
Method and system for slurry usage reduction in chemical mechanical polishing App 20030143924 - Chen, Kei-Wei ;   et al. | 2003-07-31 |
Use of a capping layer to reduce particle evolution during sputter pre-clean procedures Grant 6,531,382 - Cheng , et al. March 11, 2 | 2003-03-11 |
Method for improving thickness uniformity on a semiconductor wafer during chemical mechanical polishing App 20030017784 - Wang, Ting-Chun ;   et al. | 2003-01-23 |