loadpatents
Patent applications and USPTO patent grants for CHANG; Molly.The latest application filed is for "integrated circuit filler and method thereof".
Patent | Date |
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Integrated Circuit Filler And Method Thereof App 20220246600 - LO; Tseng Chin ;   et al. | 2022-08-04 |
Integrated circuit filler and method thereof Grant 11,309,307 - Lo , et al. April 19, 2 | 2022-04-19 |
Smart collaboration across multiple locations Grant 10,976,983 - Wang , et al. April 13, 2 | 2021-04-13 |
Smart Collaboration Across Multiple Locations App 20200310737 - Wang; Der-Joung ;   et al. | 2020-10-01 |
Integrated Circuit Filler And Method Thereof App 20200303366 - LO; Tseng Chin ;   et al. | 2020-09-24 |
Integrated circuit filler and method thereof Grant 10,679,980 - Lo , et al. | 2020-06-09 |
Integrated Circuit Filler And Method Thereof App 20190371783 - LO; Tseng Chin ;   et al. | 2019-12-05 |
Integrated circuit filler and method thereof Grant 10,388,645 - Lo , et al. A | 2019-08-20 |
Integrated circuit filler and method thereof Grant 10,283,496 - Lo , et al. | 2019-05-07 |
Software layout processing localization Grant 10,282,174 - Chang , et al. | 2019-05-07 |
Integrated Circuit Filler And Method Thereof App 20180358348 - LO; Tseng Chin ;   et al. | 2018-12-13 |
Integrated Circuit Filler And Method Thereof App 20180006010 - LO; Tseng Chin ;   et al. | 2018-01-04 |
Software Layout Processing In Localization App 20120254833 - CHANG; MOLLY ;   et al. | 2012-10-04 |
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