Patent | Date |
---|
Physiological Detection Method And Device Thereof App 20170340220 - Hsu; Po-Chun ;   et al. | 2017-11-30 |
Semiconductor including cup-shaped leadframe packaging techniques Grant 9,040,356 - Chang , et al. May 26, 2 | 2015-05-26 |
Integrated circuit package for semiconductior devices with improved electric resistance and inductance Grant 8,169,062 - Luo , et al. May 1, 2 | 2012-05-01 |
Integrated circuit package for semiconductor devices with improved electric resistance and inductance Grant 8,067,822 - Luo , et al. November 29, 2 | 2011-11-29 |
Integrated circuit package for semiconductior devices with improved electric resistance and inductance App 20110221005 - Luo; Leeshawn ;   et al. | 2011-09-15 |
Methods of achieving linear capacitance in symmetrical and asymmetrical EMI filters with TVS Grant 7,863,995 - Ho , et al. January 4, 2 | 2011-01-04 |
Semiconductor Packaging Techniques App 20090256246 - Chang; Mike ;   et al. | 2009-10-15 |
Semiconductor die package including cup-shaped leadframe Grant 7,595,547 - Chang , et al. September 29, 2 | 2009-09-29 |
Integrated circuit package for semiconductior devices with improved electric resistance and inductance App 20090014853 - Luo; Leeshawn ;   et al. | 2009-01-15 |
Methods of achieving linear capacitance in symmetrical and asymmetrical EMI filters with TVS App 20080310065 - Ho; Moses ;   et al. | 2008-12-18 |
Integrated circuit package for semiconductor devices having a reduced leadframe pad and an increased bonding area Grant 7,391,100 - Luo , et al. June 24, 2 | 2008-06-24 |
Magnetic thin film head with heat-assisted write section and hard disk drive incorporating same Grant 7,310,206 - Liu , et al. December 18, 2 | 2007-12-18 |
Magnetic thin film head with heat-assisted write section and hard disk drive incorporating same App 20060143635 - Liu; Cheng Yih ;   et al. | 2006-06-29 |
Adjustable Antenna Mount For A Mobile Phone Cell Station App 20050248496 - Chen, Michael ;   et al. | 2005-11-10 |
Integrated circuit package for semiconductor devices with improved electric resistance and inductance App 20050145996 - Luo, Leeshawn ;   et al. | 2005-07-07 |
Semiconductor assembly with package using cup-shaped lead-frame Grant 6,909,170 - Chang , et al. June 21, 2 | 2005-06-21 |
Integrated circuit package for semiconductor devices with improved electric resistance and inductance Grant 6,841,852 - Luo , et al. January 11, 2 | 2005-01-11 |
Semiconductor die package including cup-shaped leadframe Grant 6,744,124 - Chang , et al. June 1, 2 | 2004-06-01 |
Integrated circuit package for semicoductor devices with improved electric resistance and inductance App 20040004272 - Luo, Leeshawn ;   et al. | 2004-01-08 |
Semiconductor assembly with package using cup-shaped lead frame App 20030057532 - Chang, Mike ;   et al. | 2003-03-27 |
Method of making trench-gated MOSFET having cesium gate oxide layer Grant 6,509,233 - Chang , et al. January 21, 2 | 2003-01-21 |
Method of making trench-gated MOSFET having cesium gate oxide layer App 20020123196 - Chang, Mike ;   et al. | 2002-09-05 |
Structure of power mosfets, including termination structures Grant 5,521,409 - Hshieh , et al. May 28, 1 | 1996-05-28 |
Low on-resistance power MOS technology Grant 5,429,964 - Yilmaz , et al. July 4, 1 | 1995-07-04 |
Structure and fabrication of power MOSFETs, including termination structures Grant 5,404,040 - Hshieh , et al. April 4, 1 | 1995-04-04 |
Lightly-doped drain MOSFET with improved breakdown characteristics Grant 5,374,843 - Williams , et al. December 20, 1 | 1994-12-20 |
Low on-resistance power MOS technology Grant 5,304,831 - Yilmaz , et al. April 19, 1 | 1994-04-19 |