| Patent | Date |
|---|
Composite Spring Structure To Reinforce Mechanical Robustness Of A Mems Device
App 20220306454 - Chang; Kuei-Sung ; et al. | 2022-09-29 |
Die Attached Leveling Control By Metal Stopper Bumps
App 20220270999 - Mao; Wei-Jhih ; et al. | 2022-08-25 |
Composite spring structure to reinforce mechanical robustness of a MEMS device
Grant 11,420,866 - Chang , et al. August 23, 2 | 2022-08-23 |
Micro-electro Mechanical System Device Containing A Bump Stopper And Methods For Forming The Same
App 20220212917 - CHENG; Chun-wen ; et al. | 2022-07-07 |
Wire-bond Damper For Shock Absorption
App 20220162058 - Hsieh; Tsung-Lin ; et al. | 2022-05-26 |
Package Structure And Method Of Forming The Package Structure
App 20220148992 - CHANG; KUEI-SUNG | 2022-05-12 |
Package Structure And Measurement Method For The Package Structure
App 20220139789 - CHANG; KUEI-SUNG | 2022-05-05 |
Semiconductor Structure And Manufacturing Method Thereof
App 20220112074 - MAO; WEI-JHIH ; et al. | 2022-04-14 |
Micro-electro mechanical system device containing a bump stopper and methods for forming the same
Grant 11,279,611 - Cheng , et al. March 22, 2 | 2022-03-22 |
Mems Device With Dummy-area Utilization For Pressure Enhancement
App 20220063994 - Cheng; Chun-Wen ; et al. | 2022-03-03 |
Vacuum Wafer Chuck For Manufacturing Semiconductor Devices
App 20220059393 - LEE; Chien-Fa ; et al. | 2022-02-24 |
Outgassing Material Coated Cavity For A Micro-electro Mechanical System Device And Methods For Forming The Same
App 20220024756 - CHANG; Kuei-Sung ; et al. | 2022-01-27 |
Outgassing material coated cavity for a micro-electro mechanical system device and methods for forming the same
Grant 11,180,363 - Chang , et al. November 23, 2 | 2021-11-23 |
Bypass Structure
App 20210354980 - Hsieh; Eason ; et al. | 2021-11-18 |
MEMS device with dummy-area utilization for pressure enhancement
Grant 11,174,158 - Cheng , et al. November 16, 2 | 2021-11-16 |
Microelectromechanical Systems Device Having A Mechanically Robust Anti-stiction/outgassing Structure
App 20210309508 - Chang; Kuei-Sung ; et al. | 2021-10-07 |
Composite Spring Structure To Reinforce Mechanical Robustness Of A Mems Device
App 20210292157 - Chang; Kuei-Sung ; et al. | 2021-09-23 |
Outgassing Material Coated Cavity For A Micro-electro Mechanical System Device And Methods For Forming The Same
App 20210246014 - Chang; Kuei-Sung ; et al. | 2021-08-12 |
Bypass structure
Grant 11,084,713 - Hsieh , et al. August 10, 2 | 2021-08-10 |
Microelectromechanical systems device having a mechanically robust anti-stiction/outgassing structure
Grant 11,040,870 - Chang , et al. June 22, 2 | 2021-06-22 |
Micro-electro Mechanical System Device Containing A Bump Stopper And Methods For Forming The Same
App 20210179419 - CHENG; Chun-wen ; et al. | 2021-06-17 |
Narrow gap device with parallel releasing structure
Grant 11,018,218 - Chang , et al. May 25, 2 | 2021-05-25 |
Narrow gap device with parallel releasing structure
Grant 11,011,601 - Chang , et al. May 18, 2 | 2021-05-18 |
Semiconductor structure and manufacturing method thereof
Grant 10,961,115 - Chang March 30, 2 | 2021-03-30 |
Method Of Making Ohmic Contact On Low Doped Bulk Silicon For Optical Alignment
App 20210070611 - Chang; Kuei-Sung ; et al. | 2021-03-11 |
Method Of Making Ohmic Contact On Low Doped Bulk Silicon For Optical Alignment
App 20210070612 - Chang; Kuei-Sung ; et al. | 2021-03-11 |
Microelectromechanical Systems Device Having A Mechanically Robust Anti-stiction/outgassing Structure
App 20210024348 - Chang; Kuei-Sung ; et al. | 2021-01-28 |
MEMS method and structure
Grant 10,889,493 - Wu , et al. January 12, 2 | 2021-01-12 |
Wafer stack and fabrication method thereof
Grant 10,867,836 - Chang , et al. December 15, 2 | 2020-12-15 |
Method of making ohmic contact on low doped bulk silicon for optical alignment
Grant 10,850,976 - Chang , et al. December 1, 2 | 2020-12-01 |
Mems Apparatus With Anti-stiction Layer
App 20200346919 - Chang; Kuei-Sung ; et al. | 2020-11-05 |
Method of stiction prevention by patterned anti-stiction layer
Grant 10,745,268 - Chang , et al. A | 2020-08-18 |
Bypass Structure
App 20200239298 - Hsieh; Eason ; et al. | 2020-07-30 |
Semiconductor Structure And Manufacturing Method Thereof
App 20200223688 - CHANG; KUEI-SUNG | 2020-07-16 |
Method of stiction prevention by patterned anti-stiction layer
Grant 10,654,707 - Chang , et al. | 2020-05-19 |
Bypass structure
Grant 10,640,366 - Hsieh , et al. | 2020-05-05 |
Mems Device With Dummy-area Utilization For Pressure Enhancement
App 20200131032 - Cheng; Chun-Wen ; et al. | 2020-04-30 |
Bypass Structure
App 20200102212 - Hsieh; Eason ; et al. | 2020-04-02 |
Method Of Making Ohmic Contact On Low Doped Bulk Silicon For Optical Alignment
App 20200095119 - Chang; Kuei-Sung ; et al. | 2020-03-26 |
MEMS Structure and Method of Forming Same
App 20200067425 - Tsai; Yi Heng ; et al. | 2020-02-27 |
Semiconductive Structure And Manufacturing Method Thereof
App 20200031662 - LIU; YEN-CHENG ; et al. | 2020-01-30 |
Method Of Stiction Prevention By Patterned Anti-stiction Layer
App 20200024124 - Chang; Kuei-Sung ; et al. | 2020-01-23 |
MEMS structure and method of forming same
Grant 10,541,627 - Tsai , et al. Ja | 2020-01-21 |
Narrow Gap Device With Parallel Releasing Structure
App 20200020763 - Chang; Kuei-Sung ; et al. | 2020-01-16 |
Narrow Gap Device With Parallel Releasing Structure
App 20200020764 - Chang; Kuei-Sung ; et al. | 2020-01-16 |
Narrow gap device with parallel releasing structure
Grant 10,497,776 - Chang , et al. De | 2019-12-03 |
Semiconductive structure and manufacturing method thereof
Grant 10,457,549 - Liu , et al. Oc | 2019-10-29 |
Semiconductor Devices and Methods of Manufacture Thereof
App 20190244919 - Chang; Kuei-Sung ; et al. | 2019-08-08 |
Multi-pressure MEMS package
Grant 10,273,144 - Liu , et al. | 2019-04-30 |
MEMS Method and Structure
App 20190119105 - Wu; Ting-Hau ; et al. | 2019-04-25 |
Semiconductive structure and manufacturing method thereof
Grant 10,266,395 - Liu , et al. | 2019-04-23 |
Semiconductor devices and methods of manufacture thereof
Grant 10,269,743 - Chang , et al. | 2019-04-23 |
Method Of Stiction Prevention By Patterned Anti-stiction Layer
App 20190002273 - Chang; Kuei-Sung ; et al. | 2019-01-03 |
MEMS method and structure
Grant 10,160,642 - Wu , et al. Dec | 2018-12-25 |
Microelectromechanical System Device And Method For Manufacturing The Same
App 20180334378 - TSAI; SHANG-YING ; et al. | 2018-11-22 |
Microelectromechanical system device and method for manufacturing the same
Grant 10,131,533 - Tsai , et al. November 20, 2 | 2018-11-20 |
Semiconductor devices with moving members and methods for making the same
Grant 10,087,069 - Chu , et al. October 2, 2 | 2018-10-02 |
Micro-electro mechanical system (MEMS) structures with through substrate vias and methods of forming the same
Grant 10,071,905 - Chu , et al. September 11, 2 | 2018-09-11 |
Semiconductive Structure And Manufacturing Method Thereof
App 20180222750 - LIU; YEN-CHENG ; et al. | 2018-08-09 |
MEMS and method for forming the same
Grant 10,023,459 - Chang , et al. July 17, 2 | 2018-07-17 |
MEMS Structure and Method of Forming Same
App 20180145612 - Tsai; Yi Heng ; et al. | 2018-05-24 |
MEMS structure and method of forming same
Grant 9,859,819 - Tsai , et al. January 2, 2 | 2018-01-02 |
Wafer Stack And Fabrication Method Thereof
App 20170316969 - Chang; Kuei-Sung ; et al. | 2017-11-02 |
Multi-pressure Mems Package
App 20170283250 - Liu; Yu-Chia ; et al. | 2017-10-05 |
Semiconductor Devices and Methods of Manufacture Thereof
App 20170221843 - Chang; Kuei-Sung ; et al. | 2017-08-03 |
Multi-pressure MEMS package
Grant 9,695,039 - Liu , et al. July 4, 2 | 2017-07-04 |
Integrated semiconductor device and wafer level method of fabricating the same
Grant 9,691,725 - Chang , et al. June 27, 2 | 2017-06-27 |
Semiconductor Devices with Moving Members and Methods for Making the Same
App 20170166435 - Chu; Chia-Hua ; et al. | 2017-06-15 |
Semiconductor devices with moving members and methods for making the same
Grant 9,586,811 - Chu , et al. March 7, 2 | 2017-03-07 |
Semiconductive Structure And Manufacturing Method Thereof
App 20170050841 - LIU; YEN-CHENG ; et al. | 2017-02-23 |
Multi-pressure MEMS package
Grant 9,567,210 - Cheng , et al. February 14, 2 | 2017-02-14 |
Micro-electro Mechanical System (mems) Structures With Through Substrate Vias And Methods Of Forming The Same
App 20170022049 - CHU; Chia-Hua ; et al. | 2017-01-26 |
Semiconductor bonding structure and process
Grant 9,502,370 - Chang , et al. November 22, 2 | 2016-11-22 |
MEMS Method and Structure
App 20160325988 - Wu; Ting-Hau ; et al. | 2016-11-10 |
Method of sealing and shielding for dual pressure MEMs devices
Grant 9,481,564 - Chang November 1, 2 | 2016-11-01 |
Multi-pressure Mems Package
App 20160244325 - Cheng; Chun-Wen ; et al. | 2016-08-25 |
Support structure for TSV in MEMS structure
Grant 9,422,153 - Tsai , et al. August 23, 2 | 2016-08-23 |
Cavity structure using patterned sacrificial layer
Grant 9,418,849 - Chang , et al. August 16, 2 | 2016-08-16 |
Method for manufacturing a microelectromechanical systems (MEMS) device with different electrical potentials and an etch stop
Grant 9,403,673 - Liu , et al. August 2, 2 | 2016-08-02 |
MEMS method and structure
Grant 9,394,164 - Wu , et al. July 19, 2 | 2016-07-19 |
Integrated Semiconductor Device And Wafer Level Method Of Fabricating The Same
App 20160204083 - Chang; Kuei-Sung ; et al. | 2016-07-14 |
Semiconductor Bonding Structure and Process
App 20160163670 - Chang; Kuei-Sung ; et al. | 2016-06-09 |
Package systems
Grant 9,355,896 - Shu , et al. May 31, 2 | 2016-05-31 |
Method to integrate different function devices fabricated by different process technologies
Grant 9,337,182 - Chang , et al. May 10, 2 | 2016-05-10 |
Magnetic sensor and forming method
Grant 9,316,704 - Chang , et al. April 19, 2 | 2016-04-19 |
Integrated semiconductor device and wafer level method of fabricating the same
Grant 9,293,431 - Chang , et al. March 22, 2 | 2016-03-22 |
Semiconductor bonding structure and process
Grant 9,281,287 - Chang , et al. March 8, 2 | 2016-03-08 |
Magnetic Sensor And Forming Method
App 20160054401 - Chang; Kuei-Sung ; et al. | 2016-02-25 |
Method for handling a thin substrate and for substrate capping
Grant 9,266,724 - Chang , et al. February 23, 2 | 2016-02-23 |
Method For Manufacturing A Microelectromechanical Systems (mems) Device With Different Electrical Potentials And An Etch Stop
App 20160031703 - Liu; Yu-Chia ; et al. | 2016-02-04 |
MEMS device and method of forming the same
Grant 9,233,839 - Liu , et al. January 12, 2 | 2016-01-12 |
Method for manufacturing a microelectromechanical systems (MEMS) device with different electrical potentials and an etch stop
Grant 9,221,674 - Liu , et al. December 29, 2 | 2015-12-29 |
MEMS and Method for Forming the Same
App 20150353342 - Chang; Kuei-Sung ; et al. | 2015-12-10 |
Package Systems
App 20150340341 - SHU; Chia-Pao ; et al. | 2015-11-26 |
Support Structure for TSV in MEMS Structure
App 20150321902 - Tsai; Yi Heng ; et al. | 2015-11-12 |
Semiconductor structure and method forming the same
Grant 9,162,874 - Chang October 20, 2 | 2015-10-20 |
MEMS Structure and Method of Forming Same
App 20150288297 - Tsai; Yi Heng ; et al. | 2015-10-08 |
Method Of Sealing And Shielding For Dual Pressure Mems Devices
App 20150232326 - Chang; Kuei-Sung | 2015-08-20 |
Package systems and manufacturing methods thereof
Grant 9,112,001 - Shu , et al. August 18, 2 | 2015-08-18 |
Semiconductor Structure And Method Forming The Same
App 20150203347 - CHANG; KUEI-SUNG | 2015-07-23 |
Support structure for TSV in MEMS structure
Grant 9,085,456 - Tsai , et al. July 21, 2 | 2015-07-21 |
Method For The Prevention Of Suspended Silicon Structure Etching During Reactive Ion Etching
App 20150191350 - Wu; Ting-Hau ; et al. | 2015-07-09 |
MEMS structure and method of forming same
Grant 9,065,358 - Tsai , et al. June 23, 2 | 2015-06-23 |
Wafer level sealing methods with different vacuum levels for MEMS sensors
Grant 9,035,451 - Liu , et al. May 19, 2 | 2015-05-19 |
Wafer level method of sealing different pressure levels for MEMS sensors
Grant 9,029,961 - Chang , et al. May 12, 2 | 2015-05-12 |
Package systems having an opening in a substrate thereof and manufacturing methods thereof
Grant 9,000,578 - Shu , et al. April 7, 2 | 2015-04-07 |
Wafer Level Sealing Methods With Different Vacuum Levels For Mems Sensors
App 20150091153 - Liu; Yu-Chia ; et al. | 2015-04-02 |
Method for the prevention of suspended silicon structure etching during reactive ion etching
Grant 8,987,845 - Wu , et al. March 24, 2 | 2015-03-24 |
Integrated Semiconductor Device And Wafer Level Method Of Fabricating The Same
App 20150076710 - Chang; Kuei-Sung ; et al. | 2015-03-19 |
Wafer Level Method Of Sealing Different Pressure Levels For Mems Sensors
App 20150061046 - Chang; Kuei-Sung ; et al. | 2015-03-05 |
Semiconductor Bonding Structure and Process
App 20150054161 - Chang; Kuei-Sung ; et al. | 2015-02-26 |
Mems Device And Method Of Forming The Same
App 20150035089 - LIU; YU-CHIA ; et al. | 2015-02-05 |
Narrow Gap Device With Parallel Releasing Structure
App 20140374885 - Chang; Kuei-Sung ; et al. | 2014-12-25 |
Cavity Structure Using Patterned Sacrificial Layer
App 20140361412 - Chang; Kuei-Sung ; et al. | 2014-12-11 |
MEMS device and method of forming the same
Grant 8,900,905 - Liu , et al. December 2, 2 | 2014-12-02 |
Integrated semiconductor device and wafer level method of fabricating the same
Grant 8,895,360 - Chang , et al. November 25, 2 | 2014-11-25 |
Semiconductor bonding structure and process
Grant 8,878,355 - Chang , et al. November 4, 2 | 2014-11-04 |
Electrical bypass structure for MEMS device
Grant 8,878,312 - Hung , et al. November 4, 2 | 2014-11-04 |
Method for Handling a Thin Substrate and for Substrate Capping
App 20140322894 - Chang; Kuei-Sung ; et al. | 2014-10-30 |
MEMS Method and Structure
App 20140264644 - Wu; Ting-Hau ; et al. | 2014-09-18 |
Method for handling a thin substrate and for substrate capping
Grant 8,796,110 - Chang , et al. August 5, 2 | 2014-08-05 |
Method To Integrate Different Function Devices Fabricated By Different Process Technologies
App 20140183611 - Chang; Kuei-Sung ; et al. | 2014-07-03 |
Package Systems And Manufacturing Methods Thereof
App 20140170849 - SHU; Chia-Pao ; et al. | 2014-06-19 |
Method for the Prevention of Suspended Silicon Structure Etching During Reactive Ion Etching
App 20140131818 - Wu; Ting-Hau ; et al. | 2014-05-15 |
Semiconductor Bonding Structure and Process
App 20140117510 - Chang; Kuei-Sung ; et al. | 2014-05-01 |
Package systems having a eutectic bonding material and manufacturing methods thereof
Grant 8,674,495 - Shu , et al. March 18, 2 | 2014-03-18 |
Integrated Semiconductor Device and Wafer Level Method of Fabricating the Same
App 20140035158 - Chang; Kuei-Sung ; et al. | 2014-02-06 |
MEMS device etch stop
Grant 8,633,554 - Chu , et al. January 21, 2 | 2014-01-21 |
Micro-electro Mechanical System (mems) Structures With Through Substrate Vias And Methods Of Forming The Same
App 20130193527 - CHU; Chia-Hua ; et al. | 2013-08-01 |
Support Structure for TSV in MEMS Structure
App 20130181355 - Tsai; Yi Heng ; et al. | 2013-07-18 |
Mems Device Etch Stop
App 20130140653 - Chu; Chia-Hua ; et al. | 2013-06-06 |
Method for Handling a Thin Substrate and for Substrate Capping
App 20130052797 - Chang; Kuei-Sung ; et al. | 2013-02-28 |
MEMS device etch stop
Grant 8,368,152 - Chu , et al. February 5, 2 | 2013-02-05 |
MEMS Structure And Method Of Forming Same
App 20130015743 - Tsai; Yi Heng ; et al. | 2013-01-17 |
Semiconductor Devices With Moving Members and Methods for Making the Same
App 20120313235 - Chu; Chia-Hua ; et al. | 2012-12-13 |
Mems Device Etch Stop
App 20120261830 - Chu; Chia-Hua ; et al. | 2012-10-18 |
Electrical Bypass Structure For Mems Device
App 20120223613 - Hung; Chia-Ming ; et al. | 2012-09-06 |
Package systems having a conductive element through a substrate thereof and manufacturing methods of the same
Grant 8,232,614 - Chu , et al. July 31, 2 | 2012-07-31 |
Package Systems And Manufacturing Methods Thereof
App 20120086127 - SHU; Chia-Pao ; et al. | 2012-04-12 |
Package Systems And Manufacturing Methods Thereof
App 20120086126 - SHU; Chia-Pao ; et al. | 2012-04-12 |
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