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Semiconductor Device and Method of Forming Thereof
App 20220301858 - Chang; Cheng-Wei ; et al. | 2022-09-22 |
Interconnect Structures And Manufacturing Method Thereof
App 20220293503 - HUANG; Chun-Hsien ; et al. | 2022-09-15 |
Source/drain Contact Formation Methods And Devices
App 20220189825 - Chang; Cheng-Wei ; et al. | 2022-06-16 |
Interconnect Structure And Manufacturing Method For The Same
App 20220130755 - LIANG; SHUEN-SHIN ; et al. | 2022-04-28 |
Source/drain contact formation methods and devices
Grant 11,257,712 - Chang , et al. February 22, 2 | 2022-02-22 |
Interconnect structure and manufacturing method for the same
Grant 11,217,524 - Liang , et al. January 4, 2 | 2022-01-04 |
Interconnect Structure And Manufacturing Method For The Same
App 20210391252 - LIANG; SHUEN-SHIN ; et al. | 2021-12-16 |
Method for forming semiconductor contact structure
Grant 11,195,791 - Cheng , et al. December 7, 2 | 2021-12-07 |
Liner-free Conductive Structures
App 20210376103 - LIANG; Shuen-Shin ; et al. | 2021-12-02 |
Source/Drain Contact Formation Methods and Devices
App 20210358804 - Chang; Cheng-Wei ; et al. | 2021-11-18 |
Contact Conductive Feature Formation and Structure
App 20210343590 - Chang; Ken-Yu ; et al. | 2021-11-04 |
Capping Layer For Liner-free Conductive Structures
App 20210335720 - LIANG; Shuen-Shin ; et al. | 2021-10-28 |
Contact Metallization Process
App 20210280462 - CHOU; Tien-Pei ; et al. | 2021-09-09 |
Conductive Feature Formation and Structure
App 20210225701 - Wang; Yu Shih ; et al. | 2021-07-22 |
Contact conductive feature formation and structure
Grant 11,062,941 - Chang , et al. July 13, 2 | 2021-07-13 |
Conductive feature formation and structure
Grant 10,971,396 - Wang , et al. April 6, 2 | 2021-04-06 |
Contact metallization process
Grant 10,964,590 - Chou , et al. March 30, 2 | 2021-03-30 |
Contact Conductive Feature Formation and Structure
App 20200203222 - Chang; Ken-Yu ; et al. | 2020-06-25 |
Method For Forming Semiconductor Contact Structure
App 20200111739 - CHENG; Yu-Wen ; et al. | 2020-04-09 |
Contact conductive feature formation and structure
Grant 10,580,693 - Chang , et al. | 2020-03-03 |
Contact Conductive Feature Formation and Structure
App 20200020578 - Chang; Ken-Yu ; et al. | 2020-01-16 |
Method for manufacturing copper layer
Grant 10,504,832 - Chang , et al. Dec | 2019-12-10 |
Contact structure and the method of forming the same
Grant 10,504,834 - Cheng , et al. Dec | 2019-12-10 |
Contact Structure And The Method Of Forming The Same
App 20190273042 - Cheng; Yu-Wen ; et al. | 2019-09-05 |
Conductive feature formation and structure
Grant 10,361,120 - Wang , et al. | 2019-07-23 |
Semiconductor device with TiN adhesion layer for forming a contact plug
Grant 10,332,789 - Chou , et al. | 2019-06-25 |
Semiconductor Device With TiN Adhesion Layer For Forming A Contact Plug
App 20190164822 - CHOU; Tien-Pei ; et al. | 2019-05-30 |
Conductive Feature Formation and Structure
App 20190164824 - Wang; Yu Shih ; et al. | 2019-05-30 |
Conductive Feature Formation And Structure
App 20190164823 - WANG; Yu Shih ; et al. | 2019-05-30 |
Contact Metallization Process
App 20190148223 - CHOU; Tien-Pei ; et al. | 2019-05-16 |
Method of forming hybrid diffusion barrier layer and semiconductor device thereof
Grant 9,812,397 - Kuo , et al. November 7, 2 | 2017-11-07 |
Method for line stress reduction through dummy shoulder structures
Grant 9,437,485 - Kuo , et al. September 6, 2 | 2016-09-06 |
Semiconductor Structure And Method For Manufacturing The Same
App 20160126185 - CHANG; KEN-YU ; et al. | 2016-05-05 |
Method of forming a copper layer using physical vapor deposition
Grant 9,240,378 - Chang , et al. January 19, 2 | 2016-01-19 |
Method Of Forming A Copper Layer Using Physical Vapor Deposition
App 20150333012 - CHANG; KEN-YU ; et al. | 2015-11-19 |
Method Of Forming Hybrid Diffusion Barrier Layer And Semiconductor Device Thereof
App 20150108649 - KUO; Kai-Shiang ; et al. | 2015-04-23 |
Method of forming hybrid diffusion barrier layer and semiconductor device thereof
Grant 8,962,473 - Kuo , et al. February 24, 2 | 2015-02-24 |
Method Of Forming Hybrid Diffusion Barrier Layer And Semiconductor Device Thereof
App 20140264867 - KUO; Kai-Shiang ; et al. | 2014-09-18 |
Dummy Shoulder Structure For Line Stress Reduction
App 20140208283 - Kuo; Cheng-Cheng ; et al. | 2014-07-24 |
Dummy shoulder structure for line stress reduction
Grant 8,692,351 - Kuo , et al. April 8, 2 | 2014-04-08 |
Dummy Shoulder Structure For Line Stress Reduction
App 20110241207 - Kuo; Cheng Cheng ; et al. | 2011-10-06 |
Biomaterials for guided tissue regeneration and drug delivery
App 20060149392 - Hsieh; Kuo-Huang ; et al. | 2006-07-06 |
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