Chang; Kai-Jun
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chang; Kai-Jun.The latest application filed is for "method for testing multi-chip stacked packages".
- Chang; Kai-Jun - Hsinchu N/A TW
| Patent | Date |
|---|---|
| Method for testing multi-chip stacked packages Grant 8,710,859 - Chang April 29, 2 | 2014-04-29 |
| Method for wafer-level testing diced multi-chip stacked packages Grant 8,703,508 - Chang , et al. April 22, 2 | 2014-04-22 |
| Method For Testing Multi-chip Stacked Packages App 20130076384 - CHANG; Kai-Jun | 2013-03-28 |
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