Chang; Ka Fai
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chang; Ka Fai.The latest application filed is for "layout design methodology for stacked devices".
- Chang; Ka Fai - Hsinchu TW
- Chang; Ka Fai - Singapore SG
- Chang; Ka Fai - Hsin-Chu TW
- Chang; Ka Fai - Hsin-Chu City TW
| Patent | Date |
|---|---|
| Layout Design Methodology For Stacked Devices App 20220130818 - Chang; Fong-Yuan ; et al. | 2022-04-28 |
| Layout design methodology for stacked devices Grant 11,222,884 - Chang , et al. January 11, 2 | 2022-01-11 |
| Electromagnetic Shielding Metal-insulator-metal Capacitor Structure App 20210320072 - LEE; Hui Yu ; et al. | 2021-10-14 |
| Entangled Inductor Structures App 20210257156 - CHANG; Ka Fai ; et al. | 2021-08-19 |
| Electromagnetic shielding metal-insulator-metal capacitor structure Grant 11,088,084 - Lee , et al. August 10, 2 | 2021-08-10 |
| Semiconductor package and method of forming the same Grant 11,018,080 - Weerasekera , et al. May 25, 2 | 2021-05-25 |
| Solenoid inductors within a multi-chip package Grant 10,971,485 - Lee , et al. April 6, 2 | 2021-04-06 |
| Entangled inductor structures Grant 10,943,729 - Chang , et al. March 9, 2 | 2021-03-09 |
| Method And System Of Forming Integrated Circuit App 20200402856 - CHANG; KA FAI ; et al. | 2020-12-24 |
| Method and system of forming integrated circuit Grant 10,811,316 - Chang , et al. October 20, 2 | 2020-10-20 |
| Electromagnetic Shielding Metal-insulator-metal Capacitor Structure App 20200258846 - A1 | 2020-08-13 |
| Fan-out wafer-level packaging method and the package produced thereof Grant 10,720,339 - Kawano , et al. | 2020-07-21 |
| Semiconductor Package And Method Of Forming The Same App 20200185299 - CHANG; Ka Fai ; et al. | 2020-06-11 |
| Layout Design Methodology For Stacked Devices App 20200168595 - CHANG; Fong-Yuan ; et al. | 2020-05-28 |
| Electromagnetic shielding metal-insulator-metal capacitor structure Grant 10,665,550 - Lee , et al. | 2020-05-26 |
| Entangled Inductor Structures App 20200135388 - CHANG; Ka Fai ; et al. | 2020-04-30 |
| Solenoid Inductors Within A Multi-chip Package App 20200135709 - LEE; Hui Yu ; et al. | 2020-04-30 |
| Method And System Of Forming Integrated Circuit App 20200051863 - CHANG; KA FAI ; et al. | 2020-02-13 |
| Electromagnetic Shielding Metal-insulator-metal Capacitor Structure App 20200020644 - LEE; Hui Yu ; et al. | 2020-01-16 |
| Fan-out Wafer-level Packaging Method And The Package Produced Thereof App 20190393051 - KAWANO; Masaya ; et al. | 2019-12-26 |
| Semiconductor Package And Method Of Forming The Same App 20190043792 - WEERASEKERA; Roshan ; et al. | 2019-02-07 |
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