Chang; Jung-Hua
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chang; Jung-Hua.The latest application filed is for "substrate transfer system with tray aligner".
Company Profile
24.22.32
- Chang; Jung-Hua - Hsinchu TW
- CHANG; JUNG-HUA - Hsinchu County TW
- - Hsinchu TW
- Chang; Jung-Hua - Hsin-Chu TW
- Chang; Jung-Hua - Taoyuan TW
Patent Activity
| Patent | Date |
|---|---|
| Semiconductor package and manufacturing method thereof Grant 11,456,268 - Chang , et al. September 27, 2 | 2022-09-27 |
| Chip package structure Grant 11,456,276 - Li , et al. September 27, 2 | 2022-09-27 |
| Non-vertical through-via in package Grant 11,355,406 - Huang , et al. June 7, 2 | 2022-06-07 |
| Substrate Transfer System With Tray Aligner App 20220165600 - LIN; JING-CHENG ; et al. | 2022-05-26 |
| Powder Atomic Layer Deposition Apparatus With Special Cover Lid App 20220162750 - LIN; JING-CHENG ; et al. | 2022-05-26 |
| Powder Atomic Layer Deposition Apparatus For Blowing Powders App 20220136103 - LIN; JING-CHENG ; et al. | 2022-05-05 |
| Substrate transfer system with tray aligner Grant 11,322,380 - Lin , et al. May 3, 2 | 2022-05-03 |
| Alignment Mechanism And Alignment Method Of Bonding Machine App 20220122868 - LIN; JING-CHENG ; et al. | 2022-04-21 |
| Detachable Atomic Layer Deposition Apparatus For Powders App 20220106686 - LIN; JING-CHENG ; et al. | 2022-04-07 |
| Atomic Layer Deposition Apparatus For Powders App 20220106682 - LIN; JING-CHENG ; et al. | 2022-04-07 |
| Atomic Layer Deposition Apparatus For Coating On Fine Powders App 20220106684 - LIN; JING-CHENG ; et al. | 2022-04-07 |
| Atomic Layer Deposition Apparatus For Coating On Fine Powders App 20220106685 - LIN; JING-CHENG ; et al. | 2022-04-07 |
| Semiconductor Structure, Package Structure Including Stacked Pillar Portions And Method For Fabricating The Same App 20210391290 - Chang; Jung-Hua ; et al. | 2021-12-16 |
| Package structure and method of manufacturing the same Grant 11,145,562 - Chang , et al. October 12, 2 | 2021-10-12 |
| Plurality of stacked pillar portions on a semiconductor structure Grant 11,139,260 - Chang , et al. October 5, 2 | 2021-10-05 |
| Package Structure And Semiconductor Pacakge App 20210280519 - Chang; Jung-Hua ; et al. | 2021-09-09 |
| Semiconductor package structure with twinned copper Grant 11,114,405 - Chang , et al. September 7, 2 | 2021-09-07 |
| Package Structure And Method Of Manufacturing The Same App 20210193542 - Chang; Jung-Hua ; et al. | 2021-06-24 |
| Package structure, semiconductor package and method of fabricating the same Grant 11,004,797 - Chang , et al. May 11, 2 | 2021-05-11 |
| Semiconductor Structure And Package Structure App 20210082850 - Chang; Jung-Hua ; et al. | 2021-03-18 |
| Structure And Formation Method Of Chip Package With Fan-out Feature App 20210066125A1 - | 2021-03-04 |
| Structure And Formation Method Of Chip Package With Through Vias App 20210066179A1 - | 2021-03-04 |
| Metal-Bump Sidewall Protection App 20210005564 - Chang; Jung-Hua ; et al. | 2021-01-07 |
| Chip Package Structure App 20200411468 - LI; Ling-Wei ; et al. | 2020-12-31 |
| Non-Vertical Through-via in Package App 20200303275 - Huang; Cheng-Lin ; et al. | 2020-09-24 |
| Metal-bump sidewall protection Grant 10,784,222 - Chang , et al. Sept | 2020-09-22 |
| Package contact structure, semiconductor package and manufacturing method thereof Grant 10,777,531 - Chang , et al. Sept | 2020-09-15 |
| Chip package structure and method for forming the same Grant 10,770,427 - Li , et al. Sep | 2020-09-08 |
| Semiconductor Package And Manufacturing Method Thereof App 20200235065 - Chang; Jung-Hua ; et al. | 2020-07-23 |
| Package Contact Structure, Semiconductor Package And Manufacturing Method Thereof App 20200212006 - Chang; Jung-Hua ; et al. | 2020-07-02 |
| Non-vertical through-via in package Grant 10,699,981 - Huang , et al. | 2020-06-30 |
| Semiconductor Package Structure With Conductive Layer App 20200135680 - CHANG; Jung-Hua ; et al. | 2020-04-30 |
| Metal-Bump Sidewall Protection App 20200135677 - Chang; Jung-Hua ; et al. | 2020-04-30 |
| Package Structure, Semiconductor Pacakge And Method Of Fabricating The Same App 20200135649 - Chang; Jung-Hua ; et al. | 2020-04-30 |
| Package Structure And Method Of Fabricating The Same App 20200020633 - Chang; Jung-Hua ; et al. | 2020-01-16 |
| Package structure and method of fabricating the same Grant 10,522,470 - Chang , et al. Dec | 2019-12-31 |
| Method for forming semiconductor package structure with twinned copper layer Grant 10,515,923 - Chang , et al. Dec | 2019-12-24 |
| Non-Vertical Through-via in Package App 20190067146 - Huang; Cheng-Lin ; et al. | 2019-02-28 |
| Semiconductor Package Structure With Conductive Line And Method For Forming The Same App 20180350765 - CHANG; Jung-Hua ; et al. | 2018-12-06 |
| Solder bump for ball grid array Grant 10,134,701 - Chang , et al. November 20, 2 | 2018-11-20 |
| Non-vertical through-via in package Grant 10,115,647 - Huang , et al. October 30, 2 | 2018-10-30 |
| Solder Bump for Ball Grid Array App 20170317044 - Chang; Jung-Hua ; et al. | 2017-11-02 |
| Solder bump for ball grid array Grant 9,711,472 - Chang , et al. July 18, 2 | 2017-07-18 |
| Non-vertical Through-via In Package App 20160276248 - Huang; Cheng-Lin ; et al. | 2016-09-22 |
| Method and apparatus for a conductive pillar structure Grant 9,379,080 - Chang , et al. June 28, 2 | 2016-06-28 |
| Solder bump for ball grid array Grant 9,159,687 - Chang , et al. October 13, 2 | 2015-10-13 |
| Method and Apparatus for a Conductive Pillar Structure App 20150187724 - Chang; Jung-Hua ; et al. | 2015-07-02 |
| Method and apparatus for a conductive pillar structure Grant 8,994,171 - Chang , et al. March 31, 2 | 2015-03-31 |
| Solder Bump for Ball Grid Array App 20140339697 - Chang; Jung-Hua ; et al. | 2014-11-20 |
| Method and apparatus for a conductive bump structure Grant 8,847,389 - Chang , et al. September 30, 2 | 2014-09-30 |
| Method and Apparatus for a Conductive Bump Structure App 20140264838 - Chang; Jung-Hua ; et al. | 2014-09-18 |
| Method and Apparatus for a Conductive Pillar Structure App 20140264828 - Chang; Jung-Hua ; et al. | 2014-09-18 |
| Solder Bump For Ball Grid Array App 20140035135 - Chang; Jung-Hua ; et al. | 2014-02-06 |
| Rear-view mirror assembly App 20090052071 - Chang; Jung-Hua | 2009-02-26 |
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