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Chang; Jung-Ho Patent Filings

Chang; Jung-Ho

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chang; Jung-Ho.The latest application filed is for "integrated circuit and method of manufacturing the same".

Company Profile
3.11.2
  • Chang; Jung-Ho - Yunlin County TW
  • Chang; Jung-Ho - Taichung TW
  • Chang; Jung-Ho - Taichung City TW
  • Chang; Jung-Ho - Uen-Lin TW
  • Chang; Jung-Ho - Hsinchu TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Non-volatile memory device and method for manufacturing the same
Grant 11,251,273 - Chen , et al. February 15, 2
2022-02-15
Integrated circuit and method of manufacturing the same
Grant 10,971,508 - Tsai , et al. April 6, 2
2021-04-06
Integrated Circuit And Method Of Manufacturing The Same
App 20200343256 - Tsai; Yao-Ting ;   et al.
2020-10-29
Non-volatile Memory Device And Method For Manufacturing The Same
App 20200035794 - CHEN; Jian-Ting ;   et al.
2020-01-30
Process for integrating hemispherical grain silicon and a nitride-oxide capacitor dielectric layer for a dynamic random access memory capacitor structure
Grant 6,194,265 - Chang , et al. February 27, 2
2001-02-27
Method to decrease capacitance depletion, for a DRAM capacitor, via selective deposition of a doped polysilicon layer on a selectively formed hemispherical grain silicon layer
Grant 6,165,830 - Lin , et al. December 26, 2
2000-12-26
In situ, one step, formation of selective hemispherical grain silicon layer, and a nitride-oxide dielectric capacitor layer, for a DRAM application
Grant 6,127,221 - Lin , et al. October 3, 2
2000-10-03
Growth enhancement of hemispherical grain silicon on a doped polysilicon storage node capacitor structure, for dynamic random access memory applications
Grant 6,046,083 - Lin , et al. April 4, 2
2000-04-04
One step in situ doped amorphous silicon layers used for selective hemispherical grain silicon formation for crown shaped capacitor applications
Grant 6,037,219 - Lin , et al. March 14, 2
2000-03-14
Process to reduce defect formation occurring during shallow trench isolation formation
Grant 6,037,238 - Chang , et al. March 14, 2
2000-03-14
Method for fabricating a stacked, or crown shaped, capacitor structure
Grant 5,930,625 - Lin , et al. July 27, 1
1999-07-27
Method of selective growth of a hemispherical grain silicon layer on the outer sides of a crown shaped DRAM capacitor structure
Grant 5,913,119 - Lin , et al. June 15, 1
1999-06-15
Method of manufacturing hemispherical grained polysilicon with improved adhesion and reduced capacitance depletion
Grant 5,897,352 - Lin , et al. April 27, 1
1999-04-27

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