| Patent | Date |
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Thermal assemblies for multi-chip packages
Grant 11,456,232 - Wan , et al. September 27, 2 | 2022-09-27 |
Two-phase metallic alloys to facilitate thermal energy storage of a system on chip
Grant 11,378,346 - Chang July 5, 2 | 2022-07-05 |
Immersion Cooling For Integrated Circuit Devices
App 20220201889 - Sover; Raanan ; et al. | 2022-06-23 |
Die back side structures for warpage control
Grant 11,322,456 - Eid , et al. May 3, 2 | 2022-05-03 |
Ic Die With Solderable Thermal Interface Structures For Assemblies Including Solder Array Thermal Interconnects
App 20210305119 - Mallik; Debendra ; et al. | 2021-09-30 |
Ic Die And Heat Spreaders With Solderable Thermal Interface Structures For Multi-chip Assemblies Including Solder Array Thermal Interconnects
App 20210305120 - Mallik; Debendra ; et al. | 2021-09-30 |
Ic Die And Heat Spreaders With Solderable Thermal Interface Structures For Assemblies Including Solder Array Thermal Interconnects
App 20210305121 - Mallik; Debendra ; et al. | 2021-09-30 |
Substrate Cooling Using Heat Pipe Vapor Chamber Stiffener And Ihs Legs
App 20210259134 - UPPAL; Aastha ; et al. | 2021-08-19 |
Heat Dissipation Devices Having Thermal Interface Material Containment Structures
App 20210249326 - Uppal; Aastha ; et al. | 2021-08-12 |
Radiation shield around a component on a substrate
Grant 11,081,450 - Han , et al. August 3, 2 | 2021-08-03 |
Integrated Circuit Assemblies Having Metal Foam Structures
App 20210233832 - Uppal; Aastha ; et al. | 2021-07-29 |
Heat Dissipation Device Having Shielding/containment Extensions
App 20210235596 - Uppal; Aastha ; et al. | 2021-07-29 |
Full Package Vapor Chamber With Ihs
App 20210195798 - NEAL; Nicholas ; et al. | 2021-06-24 |
3d Buildup Of Thermally Conductive Layers To Resolve Die Height Differences
App 20210193547 - WAN; Zhimin ; et al. | 2021-06-24 |
Package Wrap-around Heat Spreader
App 20210193549 - EID; Feras ; et al. | 2021-06-24 |
A Novel Modular Technique For Die-level Liquid Cooling
App 20210183741 - JHA; Chandra M. ; et al. | 2021-06-17 |
Hybrid Interposer Of Glass And Silicon To Reduce Thermal Crosstalk
App 20210118756 - WAN; Zhimin ; et al. | 2021-04-22 |
Embedded Substrate Heat Sink For Bottom Side Cooling
App 20210111091 - UPPAL; Aastha ; et al. | 2021-04-15 |
Lateral Heat Removal For 3d Stack Thermal Management
App 20210104448 - EID; Feras ; et al. | 2021-04-08 |
Integrated Heat Spreader With Enhanced Vapor Chamber For Multichip Packages
App 20200350229 - Chang; Je-Young ; et al. | 2020-11-05 |
Thermoelectric Coolers Combined With Phase-change Material In Integrated Circuit Packages
App 20200294884 - Shaikh; Javed ; et al. | 2020-09-17 |
Coupled Cooling Fins In Ultra-small Systems
App 20200273772 - Uppal; Aastha ; et al. | 2020-08-27 |
Thermal Management Solutions For Integrated Circuit Packages
App 20200260609 - A1 | 2020-08-13 |
Multi-surface Heat Sink Suitable For Multi-chip Packages
App 20200251403 - Kind Code | 2020-08-06 |
Cooling Solution Including Microchannel Arrays And Methods Of Forming The Same
App 20200243418 - Neal; Nicholas ; et al. | 2020-07-30 |
Thermal management component
Grant 10,727,160 - Kulkarni , et al. | 2020-07-28 |
Direct Liquid Micro Jet (dlmj) Structures For Addressing Thermal Performance At Limited Flow Rate Conditions
App 20200227341 - Neal; Nicholas ; et al. | 2020-07-16 |
Thermal Management Solutions For Integrated Circuit Assemblies Using Phase Change Materials
App 20200219789 - Uppal; Aastha ; et al. | 2020-07-09 |
Phase Change Materials For Electromagnetic Interference Shielding And Heat Dissipation In Integrated Circuit Assemblies
App 20200219790 - Uppal; Aastha ; et al. | 2020-07-09 |
Multi-piece Heat Spreader For Multi-chip Package
App 20200194332 - Ahuja; Sandeep ; et al. | 2020-06-18 |
Die Backside Structures For Enhancing Liquid Cooling Of High Power Multi-chip Package (mcp) Dice
App 20200176352 - CHANG; Je-Young ; et al. | 2020-06-04 |
Two-phase Metallic Alloys To Facilitate Thermal Energy Storage Of A System On Chip
App 20200103177 - CHANG; Je-Young | 2020-04-02 |
Apparatus for inspection of a package assembly with a thermal solution
Grant 10,600,699 - Uppal , et al. | 2020-03-24 |
Die Back Side Structures For Warpage Control
App 20200066655 - EID; Feras ; et al. | 2020-02-27 |
Standoff Members For Semiconductor Package
App 20200066654 - CHANG; Je-Young ; et al. | 2020-02-27 |
Thermal Assemblies For Multi-chip Packages
App 20200051894 - Wan; Zhimin ; et al. | 2020-02-13 |
Radiation Shield Around A Component On A Substrate
App 20200027844 - Han; Dong-Ho ; et al. | 2020-01-23 |
Heat management system
Grant 10,468,331 - Chang , et al. No | 2019-11-05 |
Heat Management System
App 20190221499 - Chang; Je-young ; et al. | 2019-07-18 |
Thermal Management Component
App 20190206764 - Kulkarni; Devdatta P. ; et al. | 2019-07-04 |
Methods Of Direct Cooling Of Packaged Devices And Structures Formed Thereby
App 20190094925 - Kulkarni; Devdatta P. ; et al. | 2019-03-28 |
Methods of direct cooling of packaged devices and structures formed thereby
Grant 10,228,735 - Kulkarni , et al. | 2019-03-12 |
Apparatus For Inspection Of A Package Assembly With A Thermal Solution
App 20190067135 - Uppal; Aastha ; et al. | 2019-02-28 |
Methods Of Direct Cooling Of Packaged Devices And Structures Formed Thereby
App 20190004573 - Kulkarni; Devdatta P. ; et al. | 2019-01-03 |
Heat dissipation lid having direct liquid contact conduits
Grant 9,686,888 - Song , et al. June 20, 2 | 2017-06-20 |
Enabling an aluminum heat exchanger with a working fluid
Grant 9,574,832 - Chang , et al. February 21, 2 | 2017-02-21 |
Thermal management solution for circuit products
Grant 9,477,275 - Choudhury , et al. October 25, 2 | 2016-10-25 |
Heat Dissipation Lid Having Direct Liquid Contact Conduits
App 20160007499 - Song; David W. ; et al. | 2016-01-07 |
Thermal Management Solution For Circuit Products
App 20140204534 - Choudhury; Arnab ; et al. | 2014-07-24 |
Heat Dissipation Lid Having Direct Liquid Contact Conduits
App 20140126150 - Song; David W. ; et al. | 2014-05-08 |
Biosensor for analyzing quantitatively analyte with a predetermined size and larger than, and manufacturing method thereof
Grant 8,673,626 - Chang , et al. March 18, 2 | 2014-03-18 |
Microelectronic package and method of cooling same
Grant 7,592,697 - Arana , et al. September 22, 2 | 2009-09-22 |
Enabling an aluminum heat exchanger with a working fluid
App 20090166014 - Chang; Je-Young ; et al. | 2009-07-02 |
Microelectronic Package And Method Of Cooling Same
App 20090057881 - Arana; Leonel R. ; et al. | 2009-03-05 |
Integrated circuit coolant microchannel assembly with manifold member that facilitates coolant line attachment
Grant 7,471,515 - Chang , et al. December 30, 2 | 2008-12-30 |
Biosensor for analyzing quantitatively analyte with a predetermined size and larger than, and manufacturing method thereof
App 20080311648 - Chang; Je-Young ; et al. | 2008-12-18 |
Integrated Circuit Coolant Microchannel Assembly With Manifold Member That Facilitates Coolant Line Attachment
App 20080068792 - Chang; Je-Young ; et al. | 2008-03-20 |
Biosensor for analyzing quantitatively analyte with a predetermined size and larger than, and manufacturing method thereof
Grant 7,332,314 - Chang , et al. February 19, 2 | 2008-02-19 |
Preventing burst-related hazards in microelectronic cooling systems
App 20080006389 - Sauciuc; Ioan ; et al. | 2008-01-10 |
Integrated circuit coolant microchannel assembly with manifold member that facilitates coolant line attachment
Grant 7,317,615 - Chang , et al. January 8, 2 | 2008-01-08 |
Coolant capable of enhancing corrosion inhibition, system containing same, and method of manufacturing same
Grant 7,309,453 - Chang , et al. December 18, 2 | 2007-12-18 |
Coolant Capable Of Enhancing Corrosion Inhibition, System Containing Same, And Method Of Manufacturing Same
App 20070262286 - Chang; Je-Young ; et al. | 2007-11-15 |
Enhanced flow channel for component cooling in computer systems
Grant 7,283,360 - Chang , et al. October 16, 2 | 2007-10-16 |
Integrated Circuit Coolant Microchannel With Compliant Cover
App 20070230116 - Myers; Alan M. ; et al. | 2007-10-04 |
Integrated Circuit Coolant Microchannel Assembly With Targeted Channel Configuration
App 20070217147 - Chang; Je-Young ; et al. | 2007-09-20 |
Integrated circuit coolant microchannel assembly with targeted channel configuration
Grant 7,259,965 - Chang , et al. August 21, 2 | 2007-08-21 |
Integrated circuit coolant microchannel with compliant cover
Grant 7,243,705 - Myers , et al. July 17, 2 | 2007-07-17 |
Biosensor for analyzing quantitatively analyte with a predetermined size and larger than, and manufacturing method thereof
App 20070042440 - Chang; Je-Young ; et al. | 2007-02-22 |
Enhanced flow channel for component cooling in computer systems
App 20070002541 - Chang; Je-Young ; et al. | 2007-01-04 |
Integrated circuit coolant microchannel assembly with manifold member that facilitates coolant line attachment
App 20060262502 - Chang; Je-Young ; et al. | 2006-11-23 |
Use of adjusted evaporator section area of heat pipe that is sized to match the surface area of an integrated heat spreader used in CPU packages in mobile computers
Grant 7,131,487 - Chang , et al. November 7, 2 | 2006-11-07 |
Enhanced flow channel for component cooling in computer systems
Grant 7,123,479 - Chang , et al. October 17, 2 | 2006-10-17 |
Integrated circuit coolant microchannel assembly with targeted channel configuration
App 20060226539 - Chang; Je-Young ; et al. | 2006-10-12 |
Apparatus for using fluid laden with nanoparticles for application in electronic cooling
Grant 7,104,313 - Pokharna , et al. September 12, 2 | 2006-09-12 |
Integrated circuit coolant microchannel with compliant cover
App 20060196646 - Myers; Alan M. ; et al. | 2006-09-07 |
Apparatus and associated method for microelectronic cooling
App 20060131003 - Chang; Je-Young ; et al. | 2006-06-22 |
Apparatus for using fluid laden with nanoparticles for application in electronic cooling
App 20050139345 - Pokharna, Himanshu ; et al. | 2005-06-30 |
Heat pipe including enhanced nucleate boiling surface
App 20050126761 - Chang, Je-Young ; et al. | 2005-06-16 |
Enhanced flow channel for component cooling in computer systems
App 20050122688 - Chang, Je-Young ; et al. | 2005-06-09 |
Method and apparatus for protecting thermal interfaces
Grant 6,867,977 - DiStefano , et al. March 15, 2 | 2005-03-15 |
Method and apparatus for protecting thermal interfaces
App 20040125564 - DiStefano, Eric ; et al. | 2004-07-01 |
Computer assembly providing cooling for more than one electronic component
Grant 6,621,698 - Chang September 16, 2 | 2003-09-16 |
Use of adjusted evaporator section area of heat pipe that is sized to match the surface area of an integrated heat spreader used in CPU packages in mobile computers
App 20030111213 - Chang, Je Young ; et al. | 2003-06-19 |
Computer assembly providing cooling for more than one electronic component
App 20020181200 - Chang, Je-Young | 2002-12-05 |
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