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Patent applications and USPTO patent grants for Chang; I-Feng.The latest application filed is for "internal circuit structure of semiconductor chip with array-type bonding pads and method of fabricating the same".
Patent | Date |
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Internal circuit structure of semiconductor chip with array-type bonding pads and method of fabricating the same Grant 6,762,507 - Cheng , et al. July 13, 2 | 2004-07-13 |
Internal circuit structure of semiconductor chip with array-type bonding pads and method of fabricating the same Grant 6,759,329 - Cheng , et al. July 6, 2 | 2004-07-06 |
Package of semiconductor chip with array-type bonding pads Grant 6,707,164 - Cheng , et al. March 16, 2 | 2004-03-16 |
Internal circuit structure of semiconductor chip with array-type bonding pads and method of fabricating the same App 20040004296 - Cheng, Wen-Lung ;   et al. | 2004-01-08 |
Internal circuit structure of semiconductor chip with array-type bonding pads and method of fabricating the same App 20040004278 - Cheng, Wen-Lung ;   et al. | 2004-01-08 |
Package of semiconductor chip with array-type bonding pads App 20030075812 - Cheng, Wen-Lung ;   et al. | 2003-04-24 |
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