CHANG; Hui-Shan

Patent Applications and Registrations

Patent applications and USPTO patent grants for CHANG; Hui-Shan.The latest application filed is for "hearing training device".

Company Profile

1.11.17

CHANG; Hui-Shan - Taichung City TW
Chang; Hui-Shan - Jhongli TW
Chang; Hui-Shan - Jhongli City TW
Chang; Hui-Shan - Taoyuan County TW
Chang; Hui-Shan - Kaohsiung N/A TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Hearing Training Device App 20200382884 - CHANG; Hui-Shan ; et al.	2020-12-03
Method for dicing a semiconductor wafer having through silicon vias and resultant structures Grant 8,952,542 - Hua , et al. February 10, 2	2015-02-10
Method For Dicing A Semiconductor Wafer Having Through Silicon Vias And Resultant Structures App 20140131876 - Hua; Pei Hsing ; et al.	2014-05-15
Semiconductor package with through silicon vias and method for making the same Grant 8,643,167 - Hung , et al. February 4, 2	2014-02-04
Thermal Compression Head For Flip Chip Bonding App 20130175324 - Chang; Hui-Shan ; et al.	2013-07-11
Package structure and package process Grant 8,446,000 - Shen , et al. May 21, 2	2013-05-21
Semiconductor device with a plurality of mark through substrate vias Grant 8,390,129 - Shen , et al. March 5, 2	2013-03-05
Package process Grant 8,258,007 - Shen , et al. September 4, 2	2012-09-04
Packaging Structure App 20120205800 - Shen; Chi-Chih ; et al.	2012-08-16
Semiconductor Package With Through Silicon Vias And Method For Making The Same App 20120175767 - Hung; Chia-Lin ; et al.	2012-07-12
Semiconductor Device With A Plurality Of Mark Through Substrate Vias App 20120119335 - Shen; Chi-Chih ; et al.	2012-05-17
Stacked Semiconductor Package Having Conductive Vias And Method For Making The Same App 20120086120 - Chen; Jen-Chuan ; et al.	2012-04-12
Stackable Semiconductor Device Packages App 20120049338 - Chen; Kuang-Hsiung ; et al.	2012-03-01
Semiconductor Package And Method For Manufacturing The Same App 20120049332 - Chen; Jen-Chuan ; et al.	2012-03-01
Method of fabricating a stacked type chip package structure Grant 8,105,877 - Shen , et al. January 31, 2	2012-01-31
Stackable semiconductor device packages including openings partially exposing connecting elements, conductive bumps, or conductive conductors Grant 8,076,765 - Chen , et al. December 13, 2	2011-12-13
Method for Making Die Assemblies App 20110300669 - Shen; Chi-Chih ; et al.	2011-12-08
Packaging Structure And Package Process App 20110285014 - Shen; Chi-Chih ; et al.	2011-11-24
Package Structure And Package Process App 20110121442 - Shen; Chi-Chih ; et al.	2011-05-26
Flip chip package structure and carrier thereof Grant 7,791,211 - Chen , et al. September 7, 2	2010-09-07
Stackable Semiconductor Device Packages App 20100171205 - CHEN; Kuang-Hsiung ; et al.	2010-07-08
Chip Structure, Substrate Structure, Chip Package Structure And Process Thereof App 20090127706 - Shen; Chi-Chih ; et al.	2009-05-21
Flip chip package structure and carrier thereof App 20090102047 - Chen; Jen-Chuan ; et al.	2009-04-23
Stacked Type Chip Package Structure And Method Of Fabricating The Same App 20090091041 - Shen; Chi-Chih ; et al.	2009-04-09

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