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Chang; Huey-Ru Patent Filings

Chang; Huey-Ru

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chang; Huey-Ru.The latest application filed is for "multi-layer circuit structure".

Company Profile
0.9.10
  • Chang; Huey-Ru - Hsinchu County TW
  • Chang; Huey-Ru - Hsinchu TW
  • Chang, Huey-Ru - Chutung Township TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Multi-layer circuit structure
Grant 10,129,974 - Hsu , et al. November 13, 2
2018-11-13
Multi-layer Circuit Structure
App 20170273174 - Hsu; Chien-Min ;   et al.
2017-09-21
Power device package structure
Grant 8,525,328 - Perng , et al. September 3, 2
2013-09-03
Capacitor devices with a filter structure
Grant 8,237,520 - Chang , et al. August 7, 2
2012-08-07
Power Device Package Structure
App 20120168839 - Perng; Jiin-Shing ;   et al.
2012-07-05
Capacitor devices having multi-sectional conductors
Grant 8,198,538 - Hsu , et al. June 12, 2
2012-06-12
Embedded capacitor device having a common coupling area
Grant 7,875,808 - Chang , et al. January 25, 2
2011-01-25
Capacitor Devices With A Filter Structure
App 20090267704 - CHANG; Huey-Ru ;   et al.
2009-10-29
Capacitor Devices Having Multi-sectional Conductors
App 20090219668 - Hsu; Chien-Min ;   et al.
2009-09-03
Embedded Capacitor Device Having A Common Coupling Area
App 20070062726 - Chang; Huey-Ru ;   et al.
2007-03-22
Buried array capacitor and microelectronic structure incorporating the same
Grant 7,064,427 - Chung , et al. June 20, 2
2006-06-20
Buried Array Capacitor And Microelectronic Structure Incorporating The Same
App 20050269685 - Chung, Stephen ;   et al.
2005-12-08
Coaxial via hole and process of fabricating the same
App 20040149490 - Chang, Huey-Ru ;   et al.
2004-08-05
Coaxial via hole and process of fabricating the same
Grant 6,717,071 - Chang , et al. April 6, 2
2004-04-06
Packaging structure with low switching noises
Grant 6,683,781 - Ho , et al. January 27, 2
2004-01-27
Packaging Structure With Low Switching Noises
App 20030217858 - Ho, Ted C. ;   et al.
2003-11-27
Electrical-resistant via hole and process of fabricating the same
App 20020047772 - Chang, Huey-Ru ;   et al.
2002-04-25
Coaxial via hole and process of fabricating the same
App 20020017399 - Chang, Huey-Ru ;   et al.
2002-02-14

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